EP2SGX60EF1152I4 - Stratix II GX FPGA 60K LEs, 1152-BGA | Intel
MPN: EP2SGX60EF1152I4 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1595 | $159,500.00 |
| 500 | $1480 | $740,000.00 |
| 1,000 | $1395 | $1,395,000.00 |
EP2SGX60EF1152I4 Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic function is defined after manufacturing by the end user. Within the broader taxonomy of programmable logic, FPGAs sit alongside CPLDs as the dominant family; the Stratix II GX series in particular adds hardened multi-gigabit transceivers (MGTs) for serial protocols, bridging programmable logic and physical-layer (PHY) silicon. FPGAs occupy the same tier as ASSPs/ASICs in system design but offer faster time-to-market and field re-programmability.
The EP2SGX60EF1152I4 integrates 3,022 Logic Array Blocks (LABs), 534 user I/O pins, and dedicated DSP blocks optimized for high-throughput arithmetic. Its on-chip transceivers operate in the multi-gigabit range, supporting protocols such as PCI Express, Serial RapidIO, and Gigabit Ethernet. Embedded memory totalling approximately 2.5 Mb is distributed across True-Dual-Port and Simple-Dual-Port RAM blocks, allowing wide data-path designs without external SRAM.
Architecturally, Stratix II GX uses an adaptive logic module (ALM) based fabric that improves effective logic utilization versus traditional 4-LUT architectures. The device's 1.2V core supply, combined with 90nm CMOS technology, yields a favorable logic-performance-to-power ratio for its generation. Hardened PCIe and SERDES blocks reduce soft-IP overhead and free fabric for application logic.
Typical applications include high-speed serial interface bridging, telecom backplane aggregation, software-defined radio (SDR) baseband processing, and test & measurement instrumentation. Its industrial temperature grade and high pin count make it well suited to line-card designs in wired communications.
When designing in the EP2SGX60EF1152I4, plan power-rail sequencing carefully and use the manufacturer's reference PCB footprint for the FC-FBGA-1152 package; BGA escape routing benefits from buried vias and microvia stack-ups. Confirm transceiver reference-clock jitter compliance with the Stratix II GX Device Handbook before final layout.
This page synthesizes distributor availability data, drop-in variants from the Stratix II GX family, and engineering design notes that go beyond the datasheet to support sourcing and second-source decisions for long-lifecycle programs.
Drop-in alternatives for EP2SGX60EF1152I4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX60EF1152I4 (same form factor and footprint) — differing in Package, Mounting Type, Operating Temperature, Operating Temperature Grade, Package Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX60EF1152I4N
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP2SGX60EF1152I3N
✅ Drop-In✓ In Stock
$1195 / Unit
View Datasheet →EP2SGX60EF1152I3
✅ Drop-In✓ In Stock
$365 / Unit
View Datasheet →EP2SGX60EF1152C5N
✅ Drop-In✓ In Stock
$3300 / Unit
View Datasheet →EP2SGX60EF1152C5
✅ Drop-In✓ In Stock
$1380 / Unit
View Datasheet →EP2SGX60EF1152C4N
✅ Drop-In✓ In Stock
$1350 / Unit
View Datasheet →EP2SGX60EF1152I4 Maximum Ratings & Electrical Characteristics
| Device Family | Stratix II GX |
| Logic Elements | 60,440 |
| Logic Cells | 60,440 |
| Logic Array Blocks (LABs) | 3,022 |
| Embedded Memory | 2,544,192 bits |
| User I/O Pins | 534 |
| Maximum Internal Frequency | 717 MHz (per data source) |
| Maximum Operating Frequency | 732.1 MHz (per data source) |
| Process Technology | 90 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Package | 1152-ball FC-FBGA (flip-chip fine-pitch BGA) |
| Package Dimensions | 23 x 23 mm, 1 mm pitch (per data source) |
| Temperature Grade | Industrial |
| Mounting Type | Surface Mount (BGA) |
EP2SGX60EF1152I4 23 x 23 mm, 1 mm pitch (per data source) Pin Configuration Guide
Pin configuration for EP2SGX60EF1152I4 (23 x 23 mm, 1 mm pitch (per data source) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX60EF1152I4.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX60EF1152I4 is suitable for 6 applications: Telecom Line Card Aggregation, Software-Defined Radio Baseband, Test and Measurement Instrumentation, Broadcast Video Processing, Industrial High-Speed Control, Aerospace and Defense Signal Processing.
Telecom Line Card Aggregation
The EP2SGX60EF1152I4 fits telecom line-card aggregation because its 60,440 logic elements and hardened multi-gigabit transceivers can terminate multiple backplane protocols (PCI Express, Serial RapidIO, Gigabit Ethernet) on a single die. Its 534 user I/Os provide wide buses for packet lookup memory and queuing SRAM, while the 1152-ball FC-FBGA package supports the power and ground balls required for sustained transceiver operation at multi-gigabit line rates. Using this FPGA consolidates PHY bridging, traffic shaping, and statistics counters into one fabric, reducing board area versus an ASSP plus glue-logic approach. For aggregation at the edge of metro networks, the device's industrial temperature grade also covers outdoor cabinet environments with thermal margin.
Recommended
Software-Defined Radio Baseband
For SDR baseband processing, the EP2SGX60EF1152I4 offers 60,440 LEs plus dedicated DSP blocks capable of sustaining high-throughput FIR filtering, FFT/iFFT cores, and channelization in real time. Its embedded 2.5 Mb of distributed SRAM holds tap coefficients and overlap-save buffers, avoiding external memory round-trips on hot loops. The transceiver channels digitize IF/RF streams directly into the fabric, supporting flexible waveform portability across protocols. Compared with a fixed-function DSP, the FPGA lets designers re-target the same hardware to new waveforms by re-programming, ideal for multi-mode military or public-safety radios where one platform must span several standards.
Recommended
Test and Measurement Instrumentation
In test-and-measurement gear such as logic analyzers, protocol exercisers, and high-speed digitizers, the EP2SGX60EF1152I4's combination of 534 user I/Os, large logic capacity, and transceiver channels allows a single FPGA to drive display pipelines, capture memory, and external trigger logic. The 1.2V 90nm core keeps dynamic power manageable even at the device's full fabric utilization. The industrial temperature grade supports chassis mounted in semi-outdoor or factory-floor environments. Designers reuse soft-IP measurement cores across product lines, leveraging Quartus II libraries for PCIe, JTAG, and LVDS interfaces that slot directly into the device.
Recommended
Broadcast Video Processing
Broadcast video routers and processing frames use the EP2SGX60EF1152I4 to handle uncompressed SDI streams, embedded audio mux/demux, and ancillary data extraction at line rates up to 3 Gbps per channel. The fabric's 60,440 LEs accommodate color-space converters, scalers, and frame synchronizers in a single device, while transceivers interface directly to SDI serializers. Latency-critical paths benefit from hardware implementation versus general-purpose CPUs. The 1152-ball FC-FBGA supports the many SDI input/output differential pairs required for matrix routers with 16 or more channels per chassis slot.
Recommended
Industrial High-Speed Control
Industrial motion controllers and high-speed machine-vision processors benefit from the EP2SGX60EF1152I4's industrial temperature rating, large fabric, and embedded DSP blocks. The device can ingest multi-lane Camera Link or CoaXPress streams from machine-vision cameras, perform real-time image preprocessing (filtering, thresholding, blob detection), and drive servomotor control loops in parallel. Hardened SERDES channels reduce board complexity compared to soft-IP PHY solutions. The 90nm node and 1.2V core still deliver acceptable thermal performance for fan-cooled industrial chassis in factory automation lines.
Recommended
Aerospace and Defense Signal Processing
Defense signal-processing subsystems (radar front-end preprocessing, electronic-warfare digitizers, secure communications) often retain the Stratix II GX family because of long-lifecycle availability and proven fabrication maturity. The EP2SGX60EF1152I4 offers the logic capacity for adaptive beamforming, digital down-conversion chains, and crypto-acceleration cores, while multi-gigabit transceivers drive fiber-optic links between racks. Industrial temperature grade covers most ground-mobile and shipboard environments; programs requiring MIL-STD-810 must verify with the manufacturer. Long-term programs also benefit from the wide availability of drop-in I4/I3/C5/C4 speed-grade variants.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX60EF1152I4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX60EF1152I4N | EP2SGX60EF1152I3N | EP2SGX60EF1152C5N | EP2SGX60EF1152C4N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-ball FC-FBGA | 1152-ball FC-FBGA (same) | 1152-ball FC-FBGA (same) | 1152-ball FC-FBGA (same) | 1152-ball FC-FBGA (same) |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 |
| Speed Grade | I4 (industrial) | I4 (industrial) | I3 (industrial, slower) | C5 (commercial, faster) | C4 (commercial) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Lead-Free / RoHS | Non-lead-free (legacy) | Yes (lead-free, RoHS) | Yes (lead-free, RoHS) | Yes (lead-free, RoHS) | Yes (lead-free, RoHS) |
| User I/O Pins | 534 | 534 | 534 | 534 | 534 |
| Embedded Memory | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Key Differentiators
- Lead-free N-suffix variant matches the I4 speed grade with identical silicon (vs EP2SGX60EF1152I4 (non-lead-free) vs EP2SGX60EF1152I4N (lead-free))
- Slower I3 speed grade allows cost-down where timing margin exists (vs EP2SGX60EF1152I4N vs EP2SGX60EF1152I3N)
- Commercial temperature C5/C4 variants enable lower-cost commercial products (vs EP2SGX60EF1152I4N vs EP2SGX60EF1152C5N)
- Cross-brand Xilinx Virtex-5 parts are NOT drop-in (vs EP2SGX60EF1152I4 vs Xilinx Virtex-5 FX130T)
Design Notes
Estimated: With a 1.2V core at the maximum stated 732.1 MHz operating frequency, full-fabric utilization on a 90nm process can produce junction temperatures exceeding the industrial limit of 100C without airflow. Plan for at least 200 LFM of forced-air cooling across the BGA, and use thermal vias under the package center thermal pad to pull heat into inner copper planes. Derate logic density or clock frequency if chassis airflow is constrained.
The 1152-ball FC-FBGA at 1 mm pitch demands a high-density interconnect stack-up. Use laser-drilled microvias on the outer layers and buried vias to escape the inner-row balls; maintain a 50 ohm controlled impedance for high-speed serial lanes and 100 ohm differential for LVDS pairs. Follow the reference footprint in the Stratix II GX Device Handbook pin tables exactly to avoid solder-ball opens during reflow.
Do not confuse the EP2SGX60EF1152I4 (industrial grade) with the EP2SGX60EF1152C5/C4 (commercial grade) variants when ordering - they look identical in part number decoding. Also verify the lead-free N-suffix vs non-N-suffix termination matches your reflow profile and RoHS requirements. Cross-brand drop-in replacements do not exist; treat any Xilinx Virtex-series equivalent as a fresh PCB design.
Decouple the EP2SGX60EF1152I4 with a combination of 0402 ceramic capacitors (0.1 uF and 1 uF) placed as close as practical to each power pin, plus bulk polymer or tantalum capacitors on each supply rail. Maintain a clean ground-return path for the multi-gigabit transceiver power islands - a split ground plane under the transceiver region will degrade signal integrity. Use the Quartus II pin planner to validate SSN and simultaneous-switching limits before tape-out.
Compliance Information
RoHS, REACH, and halogen-free status for the EP2SGX60EF1152I4 are not explicitly stated in the verified web data; only the lead-free N-suffix variant is confirmed RoHS. AEC-Q100 is not applicable because this is an FPGA, not an automotive-grade IC. Always verify compliance directly with the manufacturer for production use.
