EP2SGX60EF1152I5N vs EP2SGX90EF1152I5N Comparison

Detailed side-by-side comparison of EP2SGX60EF1152I5N by Intel and EP2SGX90EF1152I5N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2SGX60EF1152I5N EP2SGX90EF1152I5N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Unknown Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $0.00 $1,320.00
Device Type Field Programmable Gate Array (FPGA) β€”
Family Stratix II GX Stratix II GX
Logic Cells 60,440 β€”
Logic Blocks 60,440 β€”
Process Technology 90 nm CMOS 90 nm CMOS
Core Supply Voltage 1.2 V β€”
Internal Frequency 717 MHz β€”
Reported Internal Frequency 609.76 MHz β€”
Maximum Clock Frequency 622.08 MHz 609.76 MHz
Operating Temperature Range -40 Β°C to 85 Β°C β€”
Package 1152-ball BGA β€”
Package Type FC-FBGA FC-FBGA (flip-chip fine-pitch BGA)
Package Dimensions 23 x 23 mm β€”
Terminal Pitch 1 mm β€”
Number of Terminals 1152 β€”
Terminal Form Ball BALL
Temperature Grade Industrial β€”
Propagation Delay [DATA_NEEDED: propagation delay] β€”
Configuration Memory [DATA_NEEDED: configuration memory type and size] β€”
I/O Count [DATA_NEEDED: user I/O count] β€”
Transceiver Count [DATA_NEEDED: transceiver count] β€”
RoHS Status unknown [DATA_NEEDED: RoHS status]
REACH Status unknown β€”
Series β€” EP2SGX90
Logic Elements (LEs) β€” 90,960
Equivalent CLBs β€” 90,960
Core Voltage (VCCINT) β€” 1.2 V
Combinatorial Delay β€” 4.006 ns
Number of Pins/Balls β€” 1152
Package Code β€” BGA
Package Shape β€” SQUARE
Operating Temperature Grade β€” INDUSTRIAL (I)
Embedded Transceivers β€” Yes (GX series, multi-gigabit PMA)
On-chip Block Memory β€” [DATA_NEEDED: total M512/M4K/M-RAM bits]
DSP Blocks β€” [DATA_NEEDED: number of DSP blocks]
User I/O Banks β€” [DATA_NEEDED: I/O bank count]
Mounting Type β€” Surface Mount

Datasheets & Resources

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