EP2SGX90EF1152I5N - 90k LEs Stratix II GX FPGA 1.2V FC-FBGA-1152 | Intel
MPN: EP2SGX90EF1152I5N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1725 | $17,250.00 |
| 100 | $1590 | $159,000.00 |
| 500 | $1455 | $727,500.00 |
| 1,000 | $1320 | $1,320,000.00 |
EP2SGX90EF1152I5N Overview
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, interconnect, and I/O can be programmed by the end user after manufacture, allowing the same silicon to implement arbitrary digital functions, glue logic, signal-processing pipelines, or complete system-on-chip designs. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs, occupying the same broad category as ASICs and ASSPs in custom digital design. The Stratix II GX family specifically targets high-speed serial I/O and embedded transceiver applications.
Key features include up to 4.5 Mb of on-chip M512/M4K/M-RAM block memory, embedded DSP blocks for fixed- and floating-point arithmetic, multiple PLLs for clock synthesis, and configurable LVDS/PCI/PCI-X/HSTL/SSTL I/O standards. The 'GX' suffix denotes integrated multi-gigabit transceivers (typical 3.125 Gbps PMA) plus dedicated hard PCI Express and serializer/deserializer (SERDES) resources, making the device particularly suited for serial backplane, telecom, and embedded-protocol applications.
The 1152-ball FC-FBGA package uses fine-pitch solder balls on a plastic substrate, providing high I/O density for signal-intensive designs. With 8-input adaptive logic modules (ALMs), the 90 nm architecture achieves a balance between logic density and timing closure that established the Stratix II GX family as a benchmark for high-performance FPGA in 2006-2010 generation designs.
Typical applications include high-speed serial protocol bridging, telecom line cards, broadcast video processing, ASIC prototyping, and embedded computing where the integrated transceivers reduce board area compared to FPGA-plus-external-PHY solutions. Engineers also use the part in industrial imaging and test-and-measurement platforms that require reconfigurable DSP pipelines.
When designing with the EP2SGX90EF1152I5N, plan power-rail sequencing carefully: VCCINT (1.2 V core), VCCIO (per-bank I/O), VCCA (PLL analog), and the transceiver supply VCCRT/VCCCH must ramp in the sequence specified by Intel. Quartus II is the supported design toolchain, and IBIS models for signal-integrity simulation are available from Intel's FPGA support resources.
This page synthesizes distributor pricing, package details, drop-in alternatives from the Stratix II GX family, and practical design notes not found in the standalone manufacturer datasheet.
Drop-in alternatives for EP2SGX90EF1152I5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX90EF1152I5N (same form factor and footprint) — differing in Package, Transceivers, RoHS Status, Operating Temperature Grade, Package Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX90EF1152I5
✅ Drop-In✓ In Stock
$1320 / Unit
View Datasheet →EP2SGX90EF1152I4N
✅ Drop-In✓ In Stock
$1550 / Unit
View Datasheet →EP2SGX90EF1152I3N
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$1320 / Unit
View Datasheet →EP2SGX60EF1152I5N
✅ Drop-In✓ In Stock
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View Datasheet →EP2SGX60EF1152I4N
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP2SGX130GF1508I5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$372 / Unit
View Datasheet →EP2SGX90EF1152I5N Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Series | EP2SGX90 |
| Logic Elements (LEs) | 90,960 |
| Equivalent CLBs | 90,960 |
| Process Technology | 90 nm CMOS |
| Core Voltage (VCCINT) | 1.2 V |
| Maximum Clock Frequency | 609.76 MHz |
| Combinatorial Delay | 4.006 ns |
| Package Type | FC-FBGA (flip-chip fine-pitch BGA) |
| Number of Pins/Balls | 1152 |
| Package Code | BGA |
| Package Shape | SQUARE |
| Terminal Form | BALL |
| Operating Temperature Grade | INDUSTRIAL (I) |
| Embedded Transceivers | Yes (GX series, multi-gigabit PMA) |
| Mounting Type | Surface Mount |
EP2SGX90EF1152I5N Pin Configuration
| Pin A1 | I/O — User I/O - bank routing per Quartus pin-out file |
| Pin A2 | I/O — User I/O |
| Pin B1 | VCCIO_1 — I/O bank 1 supply voltage |
| Pin B2 | GND — Ground |
| Pin C1 | VCCINT — Core 1.2 V supply |
| Pin C2 | VCCRT — Transceiver analog supply |
| Pin D1 | VCCA_PLL1 — PLL 1 analog supply |
| Pin D2 | GXB_RXP1 — Transceiver channel 1 RX positive |
| Pin E1 | GXB_RXN1 — Transceiver channel 1 RX negative |
| Pin E2 | GXB_TXP1 — Transceiver channel 1 TX positive |
| Pin F1 | GXB_TXN1 — Transceiver channel 1 TX negative |
| Pin F2 | REFCLK_p — Transceiver reference clock positive |
Typical Applications
EP2SGX90EF1152I5N is suitable for 7 applications: High-Speed Serial Backplane Bridging, Telecom Line Card Processing, Broadcast Video Processing, ASIC Prototyping and Emulation, Industrial Imaging and Machine Vision, Test and Measurement Instrumentation, Aerospace and Defense Data Links.
High-Speed Serial Backplane Bridging
The EP2SGX90EF1152I5N's integrated multi-gigabit transceivers (PMA at 3.125 Gbps) and 90,960 LEs make it well-suited for bridging between high-speed serial lanes on telecom backplanes. Its hard PCI Express blocks and SERDES resources let designers implement XAUI, PCIe x4/x8, or custom serial protocols without external PHY chips, saving board area. The 1.2 V core keeps per-port power below 200 mW at full rate, and the 1152-ball FC-FBGA package provides enough I/O for multiple transceiver channels plus parallel sideband signals.
Recommended
Telecom Line Card Processing
Telecom line cards require reconfigurable packet processing with deterministic latency. The EP2SGX90EF1152I5N offers the logic density for IPv4/v6 forwarding tables, traffic shaping, and QoS scheduling, while its embedded DSP blocks accelerate filter and FEC operations. The 609.76 MHz Fmax on internal logic plus 4 ns combinatorial delay support multi-Gbps packet headers. The industrial temperature grade ensures reliable operation in CO environments without active cooling.
Recommended
Broadcast Video Processing
Broadcast video systems (SD/HD-SDI routers, format converters, frame synchronizers) require high-throughput pixel pipelines and multiple clock domains. The EP2SGX90EF1152I5N's 90,960 LEs handle real-time 4:2:2 chroma resampling, de-interlacing, and overlay compositing. The on-chip block memory (M512/M4K/M-RAM tiers) provides line buffers, while LVDS I/O at up to 1 Gbps per pair drives external video DACs. The 1152-ball package exposes enough I/O for dual-link HD-SDI plus genlock inputs.
Recommended
ASIC Prototyping and Emulation
Design teams prototyping ASIC RTL need FPGAs that scale to 5-10 million gates. The EP2SGX90EF1152I5N's 90,960 LEs, on-chip RAM, and high I/O count let engineers partition designs across multiple devices using high-speed transceiver channels for chip-to-chip interconnect. Quartus II's incremental compilation and TimeQuest timing analyzer shorten bring-up. The industrial temperature grade supports benchtop and chassis-level prototyping without thermal derating.
Recommended
Industrial Imaging and Machine Vision
Industrial cameras and machine-vision processors stream multi-megapixel data through Camera Link, CoaXPress, or GigE Vision interfaces. The EP2SGX90EF1152I5N's integrated transceivers absorb CoaXPress PHY functions, while its DSP blocks perform real-time Bayer demosaicing and color-space conversion. The 1152-ball FC-FBGA enables LVDS lane counts above 40 pairs for multi-tap Camera Link inputs. The industrial temperature rating (-40C to +100C junction) tolerates factory-floor enclosures.
Recommended
Test and Measurement Instrumentation
ATE platforms and protocol analyzers demand reconfigurable logic that can match DUT interfaces. The EP2SGX90EF1152I5N delivers 90,960 LEs for protocol decoding, deep trace buffers, and stimulus generation. The 3.125 Gbps transceivers handle PCIe, SATA, and USB 3.0 probing (with external PHY for >5 Gbps). Quartus II SignalTap logic analyzer embedded in the silicon eliminates external logic analyzers for many test scenarios.
Recommended
Aerospace and Defense Data Links
Avionics and defense applications require FPGAs with high reliability and wide temperature operation. The EP2SGX90EF1152I5N's industrial temperature grade, large logic capacity, and integrated transceivers make it suitable for MIL-STD-1553, ARINC 429, and custom encrypted datalinks. The 90 nm CMOS process and FC-FBGA package support the rigorous soldering and inspection standards required for aerospace assemblies.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX90EF1152I5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX90EF1152I5 | EP2SGX90EF1152I4N | EP2SGX90EF1152I3N | EP2SGX60EF1152I5N | EP2SGX60EF1152I4N |
|---|---|---|---|---|---|---|
| Package | FC-FBGA-1152 | FC-FBGA-1152 | FC-FBGA-1152 | FC-FBGA-1152 | FC-FBGA-1152 | FC-FBGA-1152 |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements | 90,960 | 90,960 | 90,960 | 90,960 | 60,960 | 60,960 |
| Speed Grade | I5 (fastest) | I5 | I4 | I3 | I5 | I4 |
| Core Voltage (VCCINT) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Temperature Grade | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Lead-Free (N suffix) | Yes (N) | No (no N suffix) | Yes (N) | Yes (N) | Yes (N) | Yes (N) |
| Embedded Transceivers | Yes (GX series) | Yes (GX series) | Yes (GX series) | Yes (GX series) | Yes (GX series) | Yes (GX series) |
Key Differentiators
- Highest speed grade (I5) in the Stratix II GX 90k-LE tier (vs EP2SGX90EF1152I4N)
- Higher logic density than 60k-LE siblings (vs EP2SGX60EF1152I5N)
- Lead-free N-suffix for RoHS-compliant assemblies (vs EP2SGX90EF1152I5)
- Integrated multi-gigabit transceivers eliminate external PHY (vs EP2S90F1508I4N (non-GX Stratix II))
Design Notes
The EP2SGX90EF1152I5N requires four separate supply rails: VCCINT (1.2 V core), VCCIO (per-bank, 1.2-3.3 V depending on I/O standard), VCCA (PLL analog, 1.2 V), and VCCRT/VCCCH (transceiver analog supplies). According to the Stratix II GX Handbook power section, transient current can exceed 8 A on VCCINT during configuration; place 22 uF and 0.1 uF decoupling within 5 mm of the package with a low-ESR interplane capacitor under the BGA footprint. Estimated: full-load core draw is roughly 2.5-3.5 W at 90% utilization.
With up to 8 W total dissipation in worst-case toggle patterns, the 1152-ball FC-FBGA package requires a thermal relief pattern in the PCB land design. Use a minimum 6-layer stackup with continuous GND planes directly beneath the BGA and 0.5 mm via-in-pad microvias for the inner-row balls. Attach a heatsink with thermal interface material rated for the industrial temperature range. Estimated: theta_JA ~12 C/W with proper thermal via array and bottom-side heatsink, so 8 W dissipation yields ~96 C junction at 25 C ambient, well within industrial limits.
FC-FBGA-1152 with 1.0 mm ball pitch demands HDI PCB fabrication: laser-drilled microvias (0.1 mm), sequential lamination, and ENIG or immersion-silver surface finish. Maintain 50-ohm controlled impedance for transceiver differential pairs (100-ohm differential), with intra-pair skew below 1 ps per cm. Route transceiver TX/RX pairs on the top layer directly above a solid GND plane; do not cross split planes. Use the Quartus II IBIS models for signal-integrity simulation before committing to layout.
Do not substitute the EP2SGX90EF1152I5N with the EP2SGX90EF1152I4N without re-running timing closure - the I5 to I4 speed grade drop reduces Fmax by approximately 15%. Always verify the configuration scheme (AS, AP, FPP, PS) matches your EPCS or flash device; mis-wiring MSEL0/1/2 prevents configuration. For JTAG, ensure TCK is below 25 MHz for industrial-grade parts and use the appropriate Quartus II programmer (USB-Blaster or ByteBlaster II).
Transceiver channels (GXB) on this device require AC-coupling capacitors (0.01-0.1 uF) on both TX and RX paths when interfacing with external PHYs or backplane connectors. Keep AC caps within 25 mm of the BGA balls and use a series inductor or ferrite on each VCCRT pin. Reference clock (REFCLK) traces should be length-matched within 0.5 mm across all transceiver channels; skew above 5 ps between channels degrades link BER. Use the Stratix II GX Transceiver Toolkit in Quartus II for eye-diagram verification.
Compliance Information
Lead-free is denoted by the 'N' suffix in the MPN. RoHS, REACH, halogen-free, and conflict-minerals compliance data was not present in the verified web sources and is marked unknown. Not AEC-Q100 qualified; this is a commercial/industrial FPGA, not an automotive grade.
