EP2SGX90EF1152C3 vs EP2SGX90EF1152I3 Comparison

Detailed side-by-side comparison of EP2SGX90EF1152C3 by Intel and EP2SGX90EF1152I3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP2SGX90EF1152I3 EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel

EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel

EP2SGX90EF1152I3 ⚠ Last Time Buy

Specification Comparison

Parameter EP2SGX90EF1152C3 EP2SGX90EF1152I3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $1,180.00 $1,480.00
Series Stratix II GX Stratix II GX
Logic Elements (LEs) 90,960 β€”
Total RAM Bits 4,520,448 (4.5 Mbit) 4,520,448
User I/O Count 558 β€”
Number of LABs/CLBs 4548 β€”
Package 1152-FBGA (FineLine BGA) β€”
Number of Transceivers 12 β€”
Transceiver Data Rate 3.125 - 6.375 Gbps β€”
Number of PLLs 4 β€”
DSP Blocks (18x18 multipliers) 384 β€”
Core Voltage (VCCINT) 1.2 V β€”
Process Technology 90 nm CMOS 90 nm CMOS
Speed Grade C3 β€”
Operating Temperature 0C to +85C (commercial) β€”
Mounting Type Surface Mount (BGA) Surface Mount
RoHS Status [DATA_NEEDED: RoHS compliance status] Compliant
Logic Elements β€” 90,960
Adaptive Logic Modules (ALMs) β€” 558
Equivalent Logic Cells (CLBs) β€” 90,960
Maximum Operating Frequency β€” 622.08 MHz
Core Supply Voltage (VCCINT) β€” 1.2 V nominal (1.15 V to 1.25 V)
Operating Temperature Grade β€” Industrial (-40C to +100C)
Package Type β€” 1152-ball FC-FBGA (flip-chip)
Terminal Form β€” Ball
Terminal Pitch β€” [DATA_NEEDED: ball pitch]
Package Code β€” BGA
Package Shape β€” Square
Configuration Architecture β€” Enhanced Configuration (EPC) devices supported

Datasheets & Resources

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