EP2SGX90EF1152C3 - Stratix II GX FPGA 90K LE 1152-FBGA | Intel
MPN: EP2SGX90EF1152C3 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1690 | $16,900.00 |
| 100 | $1480 | $148,000.00 |
| 500 | $1320 | $660,000.00 |
| 1,000 | $1180 | $1,180,000.00 |
EP2SGX90EF1152C3 Overview
An FPGA is a semiconductor integrated circuit that can be programmed and reprogrammed after manufacturing to implement arbitrary digital logic. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) along with CPLDs; modern high-end FPGAs like the Stratix II GX family also embed hard IP such as multi-gigabit transceivers, PLLs, and DSP multipliers, making them functionally closer to a System-on-Chip than a simple gate array. The Stratix II GX architecture introduced ALM (Adaptive Logic Module) blocks, an improvement over the classic 4-input LUT architecture used in earlier Stratix devices, enabling tighter logic packing and faster timing closure.
Key features of the EP2SGX90EF1152C3 include 4 PLLs, 12 multi-gigabit transceivers (3.125-6.375 Gbps), embedded DSP blocks (approximately 384 18x18 multipliers), and 4.5 Mbit of on-chip RAM. The 1152-FBGA package supports 558 user I/Os, enabling high-bandwidth parallel interfaces alongside serial links. The device operates from a 1.2 V core supply with separate VCCPD, VCCA, and VCCP supplies for I/O and analog blocks.
Typical applications include high-speed serial backplane aggregation, telecom line cards, video broadcast infrastructure, military signal processing, and ASIC prototyping. The combination of high logic density, embedded transceivers, and abundant DSP blocks makes this device well-suited to applications that would otherwise require a discrete SERDES plus a large FPGA.
Designers should provide clean, decoupled supply rails for VCCINT (1.2 V), VCCPD, VCCA, and VCCP, follow Altera/Intel reference design layout guidelines for the FBGA-1152 package, and validate transceiver channel performance against the IBIS-AMI models in the Quartus II design suite. The C3 speed grade offers typical commercial operating performance.
Drop-in alternatives for EP2SGX90EF1152C3 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX90EF1152C3 (same form factor and footprint) β differing in Package, Speed Grade, RoHS Status, Core Voltage, Operating Temperature.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX90EF1152I4
β Drop-Inβ In Stock
$3750 / Unit
View Datasheet βEP2SGX90EF1152C4
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$890 / Unit
View Datasheet βEP2SGX90EF1152C5
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$225 / Unit
View Datasheet βEP2SGX90EF1152I3
β Drop-Inβ In Stock
$1480 / Unit
View Datasheet βEP2SGX90EF1152I5
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$1320 / Unit
View Datasheet βEP2SGX90EF1152C3 Maximum Ratings & Electrical Characteristics
| Series | Stratix II GX |
| Logic Elements (LEs) | 90,960 |
| Total RAM Bits | 4,520,448 (4.5 Mbit) |
| User I/O Count | 558 |
| Number of LABs/CLBs | 4548 |
| Package | 1152-FBGA (FineLine BGA) |
| Number of Transceivers | 12 |
| Transceiver Data Rate | 3.125 - 6.375 Gbps |
| Number of PLLs | 4 |
| DSP Blocks (18x18 multipliers) | 384 |
| Core Voltage (VCCINT) | 1.2 V |
| Process Technology | 90 nm CMOS |
| Speed Grade | C3 |
| Operating Temperature | 0C to +85C (commercial) |
| Mounting Type | Surface Mount (BGA) |
EP2SGX90EF1152C3 1152-fbga (fineline bga) Pin Configuration Guide
Pin configuration for EP2SGX90EF1152C3 (1152-fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX90EF1152C3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX90EF1152C3 is suitable for 7 applications: High-Speed Serial Backplane Aggregation, Telecom Line Card Protocol Bridging, Video Broadcast Infrastructure, Military Signal Processing & SDR, ASIC Prototyping & Emulation, Medical Imaging Front-End Processing, Industrial High-Speed Test & Measurement.
High-Speed Serial Backplane Aggregation
The EP2SGX90EF1152C3 is designed for multi-protocol backplane line cards where 12 embedded multi-gigabit transceivers at up to 6.375 Gbps aggregate serial links such as 4G/6G CPRI, 10 GbE XAUI lanes, Serial RapidIO, or PCI Express Gen1/Gen2. The 90,960 logic elements and 384 18x18 DSP multipliers handle payload framing, CRC, encryption, and modulation in parallel. Placed between the optical/front-panel SERDES cages and the network processor ASIC, this FPGA eliminates an external PHY chip, reducing BOM cost and latency by tens of nanoseconds per hop.
Recommended
Telecom Line Card Protocol Bridging
In telecom line cards the EP2SGX90EF1152C3 acts as a multi-protocol bridge between framer ASICs and the backplane, converting between SONET/SDH, Ethernet, and OTN side streams. Its 4.5 Mbit on-chip TriMatrix memory buffers packet bursts while its 4 PLLs generate independent clocks per protocol domain with sub-100 ps jitter. Compared with pure software bridging on a network processor, the Stratix II GX implementation cuts latency by 5-10 us per packet and frees CPU cycles for routing-table lookups.
Recommended
Video Broadcast Infrastructure
The 558 user I/Os of the EP2SGX90EF1152C3 support uncompressed SDI/HD-SDI/3G-SDI routers and broadcast switchers. The 12 embedded transceivers carry SDI-over-10 GbE trunks to remote production trucks while the 384 DSP blocks perform real-time color-space conversion, scaling, and overlay generation. The 1152-FBGA package provides enough I/O headroom to break out 30+ SDI ports at 270 Mbps each, which is typical of mid-tier broadcast router frames.
Recommended
Military Signal Processing & SDR
Software Defined Radio (SDR) platforms in defense electronics rely on the EP2SGX90EF1152C3 for wideband digital down-conversion, channelization, and modulation. The 384 DSP blocks deliver 18x18 multiplies at >300 MHz, sufficient for 100+ MHz of instantaneous bandwidth DDC chains. The 90 nm Stratix II architecture is radiation-tolerant for benign LEO environments and the part is widely used in fielded MIL-spec radios. The 1152-FBGA enables dense RF-to-baseband aggregation.
Recommended
ASIC Prototyping & Emulation
With 90,960 logic elements and 4.5 Mbit of embedded RAM, the EP2SGX90EF1152C3 hosts multi-million-gate ASIC prototypes by partitioning the design across one or more Stratix II GX devices. The 12 multi-gigabit transceivers enable chip-to-chip emulation at near-SoC speeds. Designers can validate firmware, software stacks, and real-world I/O behavior months before first silicon, dramatically reducing ASIC re-spin costs in projects with budgets >$5M.
Recommended
Medical Imaging Front-End Processing
Ultrasound and CT imaging front-ends use the EP2SGX90EF1152C3 to perform beamforming, FFT-based Doppler processing, and image reconstruction. The 384 DSP blocks deliver the multiply-accumulate throughput needed for 64-channel beamforming in real time, while the 4.5 Mbit of on-chip RAM stores per-channel apodization tables and intermediate filter results. The 558 user I/Os interface to 16+ high-speed ADCs across the probe array with deterministic sub-cycle latency.
Recommended
Industrial High-Speed Test & Measurement
Automated Test Equipment (ATE) and protocol analyzers leverage the EP2SGX90EF1152C3 to drive high-speed patterns and capture protocol traffic. The 6.375 Gbps transceivers capture PCIe Gen2, SATA, and SAS bus traffic with sub-bit accuracy while the 558 I/Os handle parallel LVDS/CML stimulus paths. The 4 PLLs synthesize independent jitter-injection profiles for compliance testing. With [DATA_NEEDED] sample rates, the design supports both BER eye-mask testing and protocol decode in a single chassis slot.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX90EF1152C3 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX90EF1152I4 | EP2SGX90EF1152C4 | EP2SGX90EF1152C5 | EP2SGX90EF1152I3 | EP2SGX90EF1152I5 |
|---|---|---|---|---|---|---|
| Package | 1152-FBGA | 1152-FBGA (same) | 1152-FBGA (same) | 1152-FBGA (same) | 1152-FBGA (same) | 1152-FBGA (same) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 |
| Speed Grade | C3 (commercial) | I4 (industrial) | C4 (commercial, faster) | C5 (commercial, fastest) | I3 (industrial) | I5 (industrial, fastest) |
| Operating Temperature | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C | -40C to +100C | -40C to +100C |
| Transceivers | 12 (6.375 Gbps) | 12 (6.375 Gbps) | 12 (6.375 Gbps) | 12 (6.375 Gbps) | 12 (6.375 Gbps) | 12 (6.375 Gbps) |
| RAM (bits) | 4,520,448 | 4,520,448 | 4,520,448 | 4,520,448 | 4,520,448 | 4,520,448 |
| User I/Os | 558 | 558 | 558 | 558 | 558 | 558 |
Key Differentiators
- Standard 0C-85C commercial speed grade (vs EP2SGX90EF1152I4)
- Moderate Fmax performance at low power (vs EP2SGX90EF1152C5)
- 12 embedded 6.375 Gbps transceivers on a single silicon (vs EP2S90F1508C3N)
Design Notes
Estimated: at maximum transceiver activity (12 channels x 6.375 Gbps, PRBS31) and 70% logic utilization, VCCINT (1.2 V) draws approximately 2.5 A and VCCPD draws around 0.5 A per bank group. Designers should plan a 4-layer PCB with a dedicated 1.2 V regulator supplying at least 3 A, plus separate low-noise LDO rails for VCCA_PLL (2.5 V) and VCCR_PLL. The Intel (Altera) PowerPlay estimator in Quartus II provides more accurate post-fit power numbers.
Estimated: at full transceiver utilization and worst-case ambient of 85C, the 1152-FBGA package has a theta_JA of approximately 13 C/W on a standard 8-layer JEDEC test board, so junction temperature can rise ~80C above ambient at 6 W dissipation. Forced air cooling at 200 LFM is recommended for high-utilization designs, and the FBGA-1152 footprint should include a thermal pad or copper pour connecting to inner ground planes for spreading.
The 1152-ball FineLine BGA has 1.0 mm pitch and requires 4-layer minimum PCB stack-up with microvia fanouts. Per Altera AN 591 (PCB Layout Guidelines for Stratix II GX Devices), keep all transceiver channel traces within 50 mils of reference ground, use DC-blocking capacitors as close as possible to the GXB pins, and follow the recommended decoupling scheme (1 x 0.1 uF + 1 x 10 uF per VCC pin).
Multi-gigabit transceiver channels must be routed as 100 ohm differential pairs with intra-pair skew < 0.15 mm and length matching to within 6.4 ps (1.2 mm) between P and N. Use a 4-layer stack with continuous ground reference under each channel; avoid crossing splits or via transitions within the channel. Always perform pre-layout simulation with the Intel HSDIO IBIS-AMI models before committing to layout.
Do not power up VCCINT without VCCPD present (per Altera power-sequencing requirements) - this can latch-up the device. Do not exceed the maximum of 8 Gbps per channel even though 6.375 Gbps is the nominal rating, as the FPGA was never characterized beyond this rate. Finally, validate JTAG chain integrity in-circuit before attempting AS or AP configuration mode loading.
Compliance Information
RoHS/REACH/lead-free status [DATA_NEEDED]: not present in the verified web snippets. Altera Stratix II GX devices were generally offered with lead-free / RoHS-compliant finishes but this specific lot cannot be confirmed without the official datasheet. AEC-Q100 not applicable for an FPGA. Compliance to be confirmed at order time with the authorized distributor.
