EP2SGX90EF1152C3N vs EP2SGX90EF1152I3 Comparison
Detailed side-by-side comparison of EP2SGX90EF1152C3N by Intel and EP2SGX90EF1152I3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2SGX90EF1152C3N | EP2SGX90EF1152I3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,280.00 | $1,480.00 |
| Series | Stratix II GX | Stratix II GX |
| Family | Stratix II GX | β |
| Logic Elements (LE) | 90960 | β |
| Number of LABs/CLBs | 4548 | β |
| Total Memory Bits | 4520448 | β |
| User I/Os | 558 | β |
| Number of Transceivers | [DATA_NEEDED: transceiver count per family] | β |
| Process Technology | 90 nm | 90 nm CMOS |
| Core Voltage | 1.2 V | β |
| Operating Frequency (max) | 816.9 MHz | β |
| Operating Temperature | 0C to +85C (Commercial) | β |
| Package Type | FC-FBGA (Flip-Chip Fine-pitch BGA) | 1152-ball FC-FBGA (flip-chip) |
| Package Pin Count | 1152 balls | β |
| Package Dimensions | 34 mm x 34 mm | β |
| Mounting Type | Surface Mount | Surface Mount |
| Lead-Free / RoHS | Yes (RoHS compliant) | β |
| Speed Grade | EF | β |
| Temperature Grade | C3 (Commercial) | β |
| Logic Elements | β | 90,960 |
| Adaptive Logic Modules (ALMs) | β | 558 |
| Equivalent Logic Cells (CLBs) | β | 90,960 |
| Total RAM Bits | β | 4,520,448 |
| Maximum Operating Frequency | β | 622.08 MHz |
| Core Supply Voltage (VCCINT) | β | 1.2 V nominal (1.15 V to 1.25 V) |
| Operating Temperature Grade | β | Industrial (-40C to +100C) |
| Terminal Form | β | Ball |
| Terminal Pitch | β | [DATA_NEEDED: ball pitch] |
| Package Code | β | BGA |
| Package Shape | β | Square |
| Configuration Architecture | β | Enhanced Configuration (EPC) devices supported |
| RoHS Status | β | Compliant |