EP2SGX90EF1152I2N vs EP2SGX90EF1152C3N Comparison

Detailed side-by-side comparison of EP2SGX90EF1152I2N by Intel and EP2SGX90EF1152C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP2SGX90EF1152I2N EP2SGX90EF1152I2N - 90,960 LEs Stratix II GX FPGA | Intel

EP2SGX90EF1152I2N - 90,960 LEs Stratix II GX FPGA | Intel

EP2SGX90EF1152I2N βœ“ Active

Specification Comparison

Parameter EP2SGX90EF1152I2N EP2SGX90EF1152C3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $1,320.00 $1,280.00
Family Stratix II GX Stratix II GX
Manufacturer Intel (formerly Altera) β€”
Logic Elements 90,960 β€”
Logic Array Blocks (LABs) 4,548 β€”
Total Embedded RAM Bits 4,520,448 bits β€”
User I/Os 558 558
Package 1152-BBGA (FC-FBGA, flip-chip) β€”
Core Voltage 1.2 V 1.2 V
Operating Temperature Grade Industrial (I2) β€”
Process Node 90 nm β€”
Transceivers Up to 12 high-speed serial channels (family spec) β€”
Mounting Type Surface Mount (BGA) Surface Mount
RoHS Status Compliant β€”
Lead-Free Yes β€”
Lifecycle Status Active (Stratix II GX family) β€”
Series β€” Stratix II GX
Logic Elements (LE) β€” 90960
Number of LABs/CLBs β€” 4548
Total Memory Bits β€” 4520448
Number of Transceivers β€” [DATA_NEEDED: transceiver count per family]
Process Technology β€” 90 nm
Operating Frequency (max) β€” 816.9 MHz
Operating Temperature β€” 0C to +85C (Commercial)
Package Type β€” FC-FBGA (Flip-Chip Fine-pitch BGA)
Package Pin Count β€” 1152 balls
Package Dimensions β€” 34 mm x 34 mm
Lead-Free / RoHS β€” Yes (RoHS compliant)
Speed Grade β€” EF
Temperature Grade β€” C3 (Commercial)

Datasheets & Resources

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