EP2SGX90EF1152I2N - 90,960 LEs Stratix II GX FPGA | Intel
MPN: EP2SGX90EF1152I2N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1580 | $158,000.00 |
| 500 | $1450 | $725,000.00 |
| 1,000 | $1320 | $1,320,000.00 |
EP2SGX90EF1152I2N Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks (memory, transceivers, PLLs, multipliers). It sits in the broader taxonomy of programmable logic devices -> logic ICs -> integrated circuits. FPGAs allow designers to implement arbitrary digital logic after manufacturing, providing time-to-market and design-revision flexibility that ASICs and microcontrollers cannot match for parallel, high-throughput workloads.
Key features of the EP2SGX90EF1152I2N include 4,548 Logic Array Blocks (LABs), embedded multiplier blocks for DSP, embedded memory (M512/M4K/M-RAM blocks totaling 4,520,448 bits), and dedicated high-speed transceivers. The device is built on a 1.2 V core with PLL-based clock management for multi-domain designs. The 1152-BBGA (FC-FBGA) flip-chip BGA package supports the high I/O count and signal-integrity requirements of multi-gigabit serial interfaces.
From an architectural standpoint, the Stratix II GX family uses an ALM-based logic fabric with 8-input fracturable look-up tables, supporting higher effective logic utilization than the older 4-input LUT architecture. Embedded transceivers and dedicated PHY hard IP allow line rates up to 6.375 Gbps depending on protocol, simplifying high-speed serial designs.
Typical applications include high-end serial backplanes, telecommunications line cards, software-defined radio (SDR), high-performance DSP and video processing, ASIC prototyping, and test and measurement equipment. The GX transceiver block is especially attractive for protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and custom serial links.
Design considerations include robust power-decoupling networks (the Stratix II GX requires multi-rail supply sequencing), thermal management via package-bottom heatsinking (FC-BGA exposes a die-side thermal interface), and PCB layout that meets the BGA escape and impedance-controlled routing requirements of the gigabit transceivers.
This page synthesizes current distributor pricing, drop-in family alternatives, and practical design notes not consolidated on the manufacturer's product page, with all data cross-referenced to live distributor listings as of 2026-09-09.
Drop-in alternatives for EP2SGX90EF1152I2N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX90EF1152I2N (same form factor and footprint) β differing in Package, Operating Temperature Grade, Transceivers, Operating Temperature, Series.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX90EF1152I4N
β Drop-Inβ In Stock
$1550 / Unit
View Datasheet βEP2SGX90EF1152I5N
β Drop-Inβ In Stock
$1320 / Unit
View Datasheet βEP2SGX90EF1152C5N
β Drop-Inβ In Stock
$1380 / Unit
View Datasheet βEP2SGX90EF1152C4N
β Drop-Inβ In Stock
$695 / Unit
View Datasheet βEP2SGX90EF1152C3N
β Drop-Inβ In Stock
$1280 / Unit
View Datasheet βEP2SGX90EF1152C5
β Drop-Inβ In Stock
$225 / Unit
View Datasheet βEP2SGX90EF1152I2N Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements | 90,960 |
| Logic Array Blocks (LABs) | 4,548 |
| Total Embedded RAM Bits | 4,520,448 bits |
| User I/Os | 558 |
| Package | 1152-BBGA (FC-FBGA, flip-chip) |
| Core Voltage | 1.2 V |
| Operating Temperature Grade | Industrial (I2) |
| Process Node | 90 nm |
| Transceivers | Up to 12 high-speed serial channels (family spec) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Lifecycle Status | Active (Stratix II GX family) |
EP2SGX90EF1152I2N 1152-bbga (fc-fbga, flip-chip) Pin Configuration Guide
Pin configuration for EP2SGX90EF1152I2N (1152-bbga (fc-fbga, flip-chip) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX90EF1152I2N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX90EF1152I2N is suitable for 6 applications: Telecommunications Line Cards, Software Defined Radio (SDR), High-Performance DSP and Video Processing, ASIC Prototyping, Test and Measurement Equipment, Industrial Control and Networking Backplanes.
Telecommunications Line Cards
The EP2SGX90EF1152I2N fits mid-to-high-end telecom line cards because of its 90,960 logic elements combined with multi-gigabit transceivers and 558 user I/Os. In a typical line card the FPGA fabric implements MAC, framer, traffic manager, and OAM logic in parallel, while the GX transceivers drive SFP+/XFP optical modules at rates up to 6.375 Gbps. Industrial temperature grade makes the part suitable for central-office deployments with relaxed HVAC, and the 1152-BBGA package offers the signal integrity required for backplane serial links such as Serial RapidIO and Interlaken.
Recommended
Software Defined Radio (SDR)
Software-defined radio systems benefit from the EP2SGX90EF1152I2N's combination of 18x18 hardware multipliers, embedded RAM blocks, and parallel logic capacity for high-sample-rate DSP pipelines. The 4,520,448 bits of embedded memory are used as sample-rate conversion buffers and FFT working storage, while the gigabit transceivers digitize IF outputs to a host processor. Industrial temperature grade supports outdoor and vehicular SDR deployments, and the 1152-BBGA package supports the dense interconnect required to interface high-speed ADCs and DACs.
Recommended
High-Performance DSP and Video Processing
The EP2SGX90EF1152I2N delivers tens of GMACs of DSP throughput for video codec, image processing, and radar pipelines. Its multiplier blocks handle H.264, JPEG2000, and FFT kernels, while the embedded RAM buffers video frames without external DDR. The 558 user I/Os accept parallel camera-link or LVDS inputs and drive HDMI/DVI output bridges. Industrial temperature grade lets the same hardware serve outdoor surveillance, automotive test rigs, and broadcast equipment, with the 1152-BBGA package supporting the high pin-count parallel video interfaces.
Recommended
ASIC Prototyping
ASIC prototyping is a classic application for the EP2SGX90EF1152I2N: the 90,960 logic elements map reasonably large ASIC RTL blocks, and the embedded transceivers emulate high-speed ASIC PHYs. Multi-FPGA partitioning is supported by the 558 user I/Os, which carry inter-FPGA signals between prototyping boards. Industrial temperature grade allows prototype boards to operate in non-air-conditioned labs, and Quartus II provides strong ASIC-pro design-flow support with gate-level netlist ingestion.
Recommended
Test and Measurement Equipment
Test and measurement instruments leverage the EP2SGX90EF1152I2N's transceivers to drive protocol analyzers, BERTs, and logic analyzers operating at multi-gigabit rates. The logic fabric implements custom protocol decoding, statistics counters, and trigger engines. Industrial temperature grade extends deployment into production-floor ATE and field-test gear. The 1152-BBGA package provides the high I/O count required to interface to multiple instrument front ends simultaneously, and the Quartus II tool chain simplifies time-domain closure for high-throughput pipelines.
Recommended
Industrial Control and Networking Backplanes
Industrial control cabinets and high-speed backplanes use the EP2SGX90EF1152I2N as a flexible I/O and protocol translator. The FPGA can implement EtherCAT, PROFINET, SERCOS III, or custom real-time fieldbuses, while the embedded transceivers bridge to gigabit uplinks. Industrial temperature grade (I2) is critical for factory-floor environments with elevated ambient temperatures, and the 1152-BBGA package supports the dense pin-out required to terminate multiple fieldbus channels and backplane serial links in parallel.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX90EF1152I2N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX90EF1152I4N | EP2SGX90EF1152I5N | EP2SGX90EF1152C5N | EP2SGX90EF1152C4N | EP2SGX90EF1152C3N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-BBGA (FC-FBGA) | 1152-BBGA (FC-FBGA) - same | 1152-BBGA (FC-FBGA) - same | 1152-BBGA (FC-FBGA) - same | 1152-BBGA (FC-FBGA) - same | 1152-BBGA (FC-FBGA) - same |
| Logic Elements | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 |
| User I/Os | 558 | 558 | 558 | 558 | 558 | 558 |
| Embedded RAM Bits | 4,520,448 bits | 4,520,448 bits | 4,520,448 bits | 4,520,448 bits | 4,520,448 bits | 4,520,448 bits |
| Temperature Grade | Industrial (I2) | Industrial (I4) | Industrial (I5) | Commercial | Commercial | Commercial |
| Speed Grade | 2 (I2 family) | 4 | 5 | 5 | 4 | 3 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Transceivers (family) | Up to 12 multi-gigabit | Up to 12 multi-gigabit | Up to 12 multi-gigabit | Up to 12 multi-gigabit | Up to 12 multi-gigabit | Up to 12 multi-gigabit |
Key Differentiators
- Industrial (I2) temperature grade with same die as commercial variants (vs EP2SGX90EF1152C5N)
- Full 90,960 logic element density (vs EP2SGX60EF1152I3N)
- High-density 1152-BBGA package supports maximum I/O (vs EP2S90F780I4N (780-pin BGA sibling))
- Integrated multi-gigabit transceivers (vs EP2S90F1508I4N (non-GX Stratix II))
Design Notes
The Stratix II GX EP2SGX90EF1152I2N requires multiple supply rails (VCCINT core 1.2 V, VCCIO banks, VCCA_PLL, VCC transceiver analog, VCCAUX). Sequence the rails per the device handbook: bring up VCCINT before VCCIO and VCCA, and enable transceivers only after their analog supply stabilizes. Use the dedicated PLL filter networks as specified; substituting standard ferrite beads causes excessive PLL jitter and degrades multi-gigabit link margin.
A flip-chip BGA package dissipates heat through the die into the package top, not through PCB balls. Attach a heatsink or heat-spreader with thermal interface material (TIM) to the package lid for any design running above 50% transceiver utilization or at industrial temperature. Estimated: at 1.0 W core dissipation plus 4 active transceivers, the junction temperature rise is roughly 15C with a properly mounted heatsink and 35C without - confirm in the device handbook theta_JC and theta_JB values before finalizing the thermal solution.
Escape a 1152-BBGA with microvia-in-pad stack-up using 0.4 mm or 0.5 mm pitch fan-out. Maintain 100-ohm differential impedance for the gigabit transceiver lanes, with intra-pair skew below 1 ps per cm. Keep reference planes continuous under transceiver ball rows to prevent impedance discontinuities; break reference only when a high-speed lane must transition layers, and stitch ground vias around each signal transition. Follow the Altera/Allegro reference pin-out file for the recommended decoupling capacitor placement.
For multi-gigabit transceivers, route each lane with matched-length differential pair, controlled skew to the reference clock, and AC-coupling capacitors of 100 nF placed close to the transmitter. Use IBIS-AMI models from Altera/Intel for channel simulation before committing to PCB fabrication; do not assume that the Stratix II GX pre-emphasis defaults are sufficient for backplane channels longer than 20 inches. Pre-tap and post-tap coefficients must be tuned per channel and verified with a BERT during board bring-up.
Do not reuse Quartus II assignments between I2 and C-speed grades without re-compiling - timing models differ and bitstream generation will fail or, worse, produce a working but unreliable design. Also verify that all transceiver reference clocks come from PLL-driven dedicated clock inputs, not regular GPIO; GPIO toggling cannot meet the jitter requirement of multi-gigabit links. Finally, the configuration flash should store separate images for engineering and production bitstreams to simplify field updates.
Compliance Information
RoHS and lead-free per Altera/Intel product marking. AEC-Q100 not applicable - this is a commercial/industrial FPGA, not an automotive-grade part. Conflict-minerals compliance per Intel corporate policy.
