EP2SGX90EF1152I3 vs EP2SGX90EF1152C3 Comparison
Detailed side-by-side comparison of EP2SGX90EF1152I3 by Intel and EP2SGX90EF1152C3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2SGX90EF1152I3 | EP2SGX90EF1152C3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,480.00 | $1,180.00 |
| Series | Stratix II GX | Stratix II GX |
| Logic Elements | 90,960 | β |
| Adaptive Logic Modules (ALMs) | 558 | β |
| Equivalent Logic Cells (CLBs) | 90,960 | β |
| Total RAM Bits | 4,520,448 | 4,520,448 (4.5 Mbit) |
| Maximum Operating Frequency | 622.08 MHz | β |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.2 V nominal (1.15 V to 1.25 V) | β |
| Operating Temperature Grade | Industrial (-40C to +100C) | β |
| Package Type | 1152-ball FC-FBGA (flip-chip) | β |
| Terminal Form | Ball | β |
| Terminal Pitch | [DATA_NEEDED: ball pitch] | β |
| Package Code | BGA | β |
| Package Shape | Square | β |
| Configuration Architecture | Enhanced Configuration (EPC) devices supported | β |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Logic Elements (LEs) | β | 90,960 |
| User I/O Count | β | 558 |
| Number of LABs/CLBs | β | 4548 |
| Package | β | 1152-FBGA (FineLine BGA) |
| Number of Transceivers | β | 12 |
| Transceiver Data Rate | β | 3.125 - 6.375 Gbps |
| Number of PLLs | β | 4 |
| DSP Blocks (18x18 multipliers) | β | 384 |
| Core Voltage (VCCINT) | β | 1.2 V |
| Speed Grade | β | C3 |
| Operating Temperature | β | 0C to +85C (commercial) |