EP2SGX90EF1152I3 vs EP2SGX90EF1152C3N Comparison
Detailed side-by-side comparison of EP2SGX90EF1152I3 by Intel and EP2SGX90EF1152C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2SGX90EF1152I3 | EP2SGX90EF1152C3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,480.00 | $1,280.00 |
| Series | Stratix II GX | Stratix II GX |
| Logic Elements | 90,960 | β |
| Adaptive Logic Modules (ALMs) | 558 | β |
| Equivalent Logic Cells (CLBs) | 90,960 | β |
| Total RAM Bits | 4,520,448 | β |
| Maximum Operating Frequency | 622.08 MHz | β |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Supply Voltage (VCCINT) | 1.2 V nominal (1.15 V to 1.25 V) | β |
| Operating Temperature Grade | Industrial (-40C to +100C) | β |
| Package Type | 1152-ball FC-FBGA (flip-chip) | FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Terminal Form | Ball | β |
| Terminal Pitch | [DATA_NEEDED: ball pitch] | β |
| Package Code | BGA | β |
| Package Shape | Square | β |
| Configuration Architecture | Enhanced Configuration (EPC) devices supported | β |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | Compliant | β |
| Family | β | Stratix II GX |
| Logic Elements (LE) | β | 90960 |
| Number of LABs/CLBs | β | 4548 |
| Total Memory Bits | β | 4520448 |
| User I/Os | β | 558 |
| Number of Transceivers | β | [DATA_NEEDED: transceiver count per family] |
| Core Voltage | β | 1.2 V |
| Operating Frequency (max) | β | 816.9 MHz |
| Operating Temperature | β | 0C to +85C (Commercial) |
| Package Pin Count | β | 1152 balls |
| Package Dimensions | β | 34 mm x 34 mm |
| Lead-Free / RoHS | β | Yes (RoHS compliant) |
| Speed Grade | β | EF |
| Temperature Grade | β | C3 (Commercial) |