EP2SGX90EF1152I3 vs EP2SGX90EF1152I2N Comparison

Detailed side-by-side comparison of EP2SGX90EF1152I3 by Intel and EP2SGX90EF1152I2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP2SGX90EF1152I3 EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel

EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel

EP2SGX90EF1152I3 ⚠ Last Time Buy
Intel
EP2SGX90EF1152I2N EP2SGX90EF1152I2N - 90,960 LEs Stratix II GX FPGA | Intel

EP2SGX90EF1152I2N - 90,960 LEs Stratix II GX FPGA | Intel

EP2SGX90EF1152I2N βœ“ Active

Specification Comparison

Parameter EP2SGX90EF1152I3 EP2SGX90EF1152I2N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last_time_buy Active
Stock Status In Stock In Stock
Unit Price (USD) $1,480.00 $1,320.00
Series Stratix II GX β€”
Logic Elements 90,960 90,960
Adaptive Logic Modules (ALMs) 558 β€”
Equivalent Logic Cells (CLBs) 90,960 β€”
Total RAM Bits 4,520,448 β€”
Maximum Operating Frequency 622.08 MHz β€”
Process Technology 90 nm CMOS β€”
Core Supply Voltage (VCCINT) 1.2 V nominal (1.15 V to 1.25 V) β€”
Operating Temperature Grade Industrial (-40C to +100C) Industrial (I2)
Package Type 1152-ball FC-FBGA (flip-chip) β€”
Terminal Form Ball β€”
Terminal Pitch [DATA_NEEDED: ball pitch] β€”
Package Code BGA β€”
Package Shape Square β€”
Configuration Architecture Enhanced Configuration (EPC) devices supported β€”
Mounting Type Surface Mount Surface Mount (BGA)
RoHS Status Compliant Compliant
Family β€” Stratix II GX
Manufacturer β€” Intel (formerly Altera)
Logic Array Blocks (LABs) β€” 4,548
Total Embedded RAM Bits β€” 4,520,448 bits
User I/Os β€” 558
Package β€” 1152-BBGA (FC-FBGA, flip-chip)
Core Voltage β€” 1.2 V
Process Node β€” 90 nm
Transceivers β€” Up to 12 high-speed serial channels (family spec)
Lead-Free β€” Yes
Lifecycle Status β€” Active (Stratix II GX family)

Datasheets & Resources

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