EP3C10F256C6 vs EP3C10E144C7N Comparison

Detailed side-by-side comparison of EP3C10F256C6 by Intel and EP3C10E144C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C10F256C6 EP3C10E144C7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $36.75 $45.20
Family Cyclone III Cycloneยฎ III
Logic Elements (LE) 10,320 โ€”
Total Memory Bits 423,936 bits โ€”
Embedded 18x18 Multipliers 23 23
PLLs 2 4
Maximum User I/Os 182 94
Package 256-FBGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) 144-pin LQFP Exposed Pad (EQFP-144)
Mounting Type Surface Mount (BGA) โ€”
Core Voltage (VCCINT) 1.15 V to 1.25 V (typ. 1.2 V) 1.15 V to 1.25 V
I/O Voltage (VCCIO) 1.2 V to 3.3 V (bank-dependent) โ€”
Process Technology 60 nm low-power CMOS TSMC 65 nm low-power CMOS
Configuration Memory SRAM-based (external EPCS flash required) โ€”
Operating Temperature -40 C to +125 C (industrial, suffix 'C') โ€”
Speed Grade 6 โ€”
RoHS Status Compliant (lead-free FBGA) Compliant
MSL Level 3 (168 hours) โ€”
Manufacturer โ€” Intel (formerly Altera)
Logic Elements (LEs) โ€” 10,320
Embedded Memory (M9K BRAM) โ€” 414 Kbits
Maximum Internal Clock Frequency โ€” 437.5 MHz
Configuration Modes โ€” JTAG, Active Serial, Active Parallel
Operating Junction Temperature โ€” 0C to +85C (Commercial, C7 speed grade)
I/O Standards Supported โ€” LVDS, LVCMOS, SSTL, HSTL (per bank VCCIO)

Datasheets & Resources

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