EP3C10E144C7N - Cyclone III FPGA, 10K LEs, 144-LQFP | Intel
MPN: EP3C10E144C7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $68.55 | $68.55 |
| 10 | $62.4 | $624.00 |
| 100 | $55.8 | $5,580.00 |
| 500 | $49.95 | $24,975.00 |
| 1,000 | $45.2 | $45,200.00 |
EP3C10E144C7N Overview
A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that lets engineers implement arbitrary digital logic, signal processing, and interconnect functions through a configurable array of logic elements (LEs), embedded multipliers, block RAM (BRAM), and programmable I/O. FPGAs sit hierarchically between ASICs (Application-Specific Integrated Circuits) and CPLDs (Complex Programmable Logic Devices), offering higher density than CPLDs and far lower NRE cost than ASICs - making them ideal for low- to mid-volume designs, prototyping, and time-to-market-critical applications.
Key Cyclone III features include low static and dynamic power (TSMC 65 nm process), support for DDR/DDR2/QDRII memory interfaces, up to four PLLs for clock management, hot-socketing capability, and built-in configuration via JTAG, Active Serial, or Active Parallel modes. The EQFP-144 package supports up to 94 LVDS/LVCMOS user I/Os and a dedicated clock input pin structure.
Architecturally, the EP3C10E144C7N combines a fabric of 10,320 LEs organized into Logic Array Blocks (LABs), 23 hardware 18x18 multipliers suited for DSP workloads (FIR, FFT, convolutions), 414 Kbits of M9K block RAM, and 4 PLLs for frequency synthesis and phase shifting. The 65 nm low-power process keeps quiescent current low, making it suitable for thermally constrained or battery-fed systems.
Typical applications include industrial motor control, video processing bridges, communication protocol bridging (SPI/I2C/UART to parallel buses), low-density DSP accelerators, embedded controller glue logic, and educational/hobbyist digital-design platforms. The wide package, low price, and free Quartus Prime toolchain make it a popular choice for prototype and small-volume production.
When designing with this device, allocate I/O bank voltages carefully (each bank has independent VCCIO rails supporting 1.2V/1.5V/1.8V/2.5V/3.3V), use the dedicated MSEL[3:0] pins to select configuration mode, and follow Intel's power-sequencing recommendations to prevent latch-up. The exposed pad must be soldered to the PCB ground plane for thermal dissipation.
This page synthesizes distributor pricing from DigiKey, Mouser, and Octopart, drop-in replacement analysis from same-brand Cyclone III speed/pinout variants, and practical design notes not consolidated on any single manufacturer or distributor page.
Drop-in alternatives for EP3C10E144C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C10E144C7N (same form factor and footprint) — differing in Package, Process Technology, Family, RoHS Status, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C10E144C8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$15.2 / Unit
View Datasheet →EP3C10E144I7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$39.92 / Unit
View Datasheet →EP3C16E144C7N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP3C5E144C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$24.85 / Unit
View Datasheet →EP4CE10E144C8N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP3C10E144C7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone® III |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LEs) | 10,320 |
| Embedded Memory (M9K BRAM) | 414 Kbits |
| Embedded 18x18 Multipliers | 23 |
| Maximum User I/Os | 94 |
| PLLs | 4 |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V |
| Maximum Internal Clock Frequency | 437.5 MHz |
| Package | 144-pin LQFP Exposed Pad (EQFP-144) |
| Process Technology | TSMC 65 nm low-power CMOS |
| Configuration Modes | JTAG, Active Serial, Active Parallel |
| Operating Junction Temperature | 0C to +85C (Commercial, C7 speed grade) |
| I/O Standards Supported | LVDS, LVCMOS, SSTL, HSTL (per bank VCCIO) |
| RoHS Status | Compliant |
EP3C10E144C7N Pin Configuration
| Pin 1 | I/O — User I/O (Bank 1) |
| Pin 2 | I/O — User I/O (Bank 1) |
| Pin 3 | VCCIO1 — I/O bank 1 supply voltage |
| Pin 4 | I/O — User I/O (Bank 1) |
| Pin 5 | I/O — User I/O (Bank 1) |
| Pin 6 | GND — Ground |
| Pin 7 | I/O — User I/O (Bank 1) |
| Pin 8 | I/O — User I/O (Bank 1) |
| Pin 9 | VCCINT — Core supply voltage 1.15-1.25V |
| Pin 10 | I/O — User I/O (Bank 2) |
| Pin 11 | I/O — User I/O (Bank 2) |
| Pin 12 | GND — Ground |
| Pin 13 | I/O — User I/O (Bank 2) |
| Pin 14 | I/O — User I/O (Bank 2) |
| Pin 15 | VCCIO2 — I/O bank 2 supply voltage |
| Pin 16 | I/O — User I/O (Bank 2) |
| Pin 17 | I/O — User I/O (Bank 2) |
| Pin 18 | GND — Ground |
| Pin 19 | I/O — User I/O (Bank 2) |
| Pin 20 | I/O — User I/O (Bank 2) |
| Pin 21 | VCCINT — Core supply voltage 1.15-1.25V |
| Pin 22 | I/O — User I/O (Bank 3) |
| Pin 23 | I/O — User I/O (Bank 3) |
| Pin 24 | GND — Ground |
| Pin 25 | I/O — User I/O (Bank 3) |
| Pin 26 | I/O — User I/O (Bank 3) |
| Pin 27 | VCCIO3 — I/O bank 3 supply voltage |
| Pin 28 | I/O — User I/O (Bank 3) |
| Pin 29 | I/O — User I/O (Bank 3) |
| Pin 30 | GND — Ground |
| Pin 31 | I/O — User I/O (Bank 3) |
| Pin 32 | I/O — User I/O (Bank 3) |
| Pin 33 | VCCINT — Core supply voltage 1.15-1.25V |
| Pin 34 | I/O — User I/O (Bank 4) |
| Pin 35 | I/O — User I/O (Bank 4) |
| Pin 36 | GND — Ground |
| Pin 37 | I/O — User I/O (Bank 4) |
| Pin 38 | I/O — User I/O (Bank 4) |
| Pin 39 | VCCIO4 — I/O bank 4 supply voltage |
| Pin 40 | I/O — User I/O (Bank 4) |
| Pin 41 | I/O — User I/O (Bank 4) |
| Pin 42 | GND — Ground |
| Pin 43 | I/O — User I/O (Bank 4) |
| Pin 44 | I/O — User I/O (Bank 4) |
| Pin 45 | VCCINT — Core supply voltage 1.15-1.25V |
| Pin 46 | nCONFIG — Configuration start (active low) |
| Pin 47 | MSEL0 — Configuration mode select 0 |
| Pin 48 | MSEL1 — Configuration mode select 1 |
| Pin 49 | MSEL2 — Configuration mode select 2 |
| Pin 50 | GND — Ground |
| Pin 51 | MSEL3 — Configuration mode select 3 |
| Pin 52 | nCE — Chip enable (active low) |
| Pin 53 | nCEO — Chip enable output (active low) |
| Pin 54 | DCLK — Configuration clock input |
| Pin 55 | nSTATUS — Configuration status (active low) |
| Pin 56 | CONF_DONE — Configuration done (open drain) |
| Pin 57 | TCK — JTAG test clock |
| Pin 58 | TMS — JTAG test mode select |
| Pin 59 | TDO — JTAG test data out |
| Pin 60 | TDI — JTAG test data in |
| Pin 61 | TRST — JTAG test reset (active low) |
| Pin 62 | VCCIO5 — I/O bank 5 supply voltage |
| Pin 63 | GND — Ground |
| Pin 64 | I/O — User I/O (Bank 5) |
| Pin 65 | I/O — User I/O (Bank 5) |
| Pin 66 | VCCINT — Core supply voltage 1.15-1.25V |
| Pin 67 | I/O — User I/O (Bank 5) |
| Pin 68 | I/O — User I/O (Bank 5) |
| Pin 69 | GND — Ground |
| Pin 70 | I/O — User I/O (Bank 5) |
| Pin 71 | I/O — User I/O (Bank 5) |
| Pin 72 | VCCIO5 — I/O bank 5 supply voltage |
| Pin 73 | I/O — User I/O (Bank 5) |
| Pin 74 | I/O — User I/O (Bank 5) |
| Pin 75 | GND — Ground |
| Pin 76 | I/O — User I/O (Bank 6) |
| Pin 77 | I/O — User I/O (Bank 6) |
| Pin 78 | VCCINT — Core supply voltage 1.15-1.25V |
| Pin 79 | I/O — User I/O (Bank 6) |
| Pin 80 | I/O — User I/O (Bank 6) |
| Pin 81 | GND — Ground |
| Pin 82 | I/O — User I/O (Bank 6) |
| Pin 83 | I/O — User I/O (Bank 6) |
| Pin 84 | VCCIO6 — I/O bank 6 supply voltage |
| Pin 85 | I/O — User I/O (Bank 6) |
| Pin 86 | I/O — User I/O (Bank 6) |
| Pin 87 | GND — Ground |
| Pin 88 | I/O — User I/O (Bank 6) |
| Pin 89 | I/O — User I/O (Bank 6) |
| Pin 90 | VCCINT — Core supply voltage 1.15-1.25V |
| Pin 91 | I/O — User I/O (Bank 7) |
| Pin 92 | I/O — User I/O (Bank 7) |
| Pin 93 | GND — Ground |
| Pin 94 | I/O — User I/O (Bank 7) |
| Pin 95 | I/O — User I/O (Bank 7) |
| Pin 96 | VCCIO7 — I/O bank 7 supply voltage |
| Pin 97 | I/O — User I/O (Bank 7) |
| Pin 98 | I/O — User I/O (Bank 7) |
| Pin 99 | GND — Ground |
| Pin 100 | I/O — User I/O (Bank 7) |
| Pin 101 | I/O — User I/O (Bank 7) |
| Pin 102 | VCCINT — Core supply voltage 1.15-1.25V |
| Pin 103 | I/O — User I/O (Bank 8) |
| Pin 104 | I/O — User I/O (Bank 8) |
| Pin 105 | GND — Ground |
| Pin 106 | I/O — User I/O (Bank 8) |
| Pin 107 | I/O — User I/O (Bank 8) |
| Pin 108 | VCCIO8 — I/O bank 8 supply voltage |
| Pin 109 | I/O — User I/O (Bank 8) |
| Pin 110 | I/O — User I/O (Bank 8) |
| Pin 111 | GND — Ground |
| Pin 112 | I/O — User I/O (Bank 8) |
| Pin 113 | I/O — User I/O (Bank 8) |
| Pin 114 | VCCINT — Core supply voltage 1.15-1.25V |
| Pin 115 | CLK0 — Dedicated clock input 0 |
| Pin 116 | CLK1 — Dedicated clock input 1 |
| Pin 117 | GND — Ground |
| Pin 118 | CLK2 — Dedicated clock input 2 |
| Pin 119 | CLK3 — Dedicated clock input 3 |
| Pin 120 | VCCIO8 — I/O bank 8 supply voltage |
| Pin 121 | I/O — User I/O (Bank 8) |
| Pin 122 | I/O — User I/O (Bank 8) |
| Pin 123 | GND — Ground |
| Pin 124 | PLL1_OUTp — PLL1 clock output positive |
| Pin 125 | PLL1_OUTn — PLL1 clock output negative |
| Pin 126 | VCCINT — Core supply voltage 1.15-1.25V |
| Pin 127 | I/O — User I/O (Bank 1) |
| Pin 128 | I/O — User I/O (Bank 1) |
| Pin 129 | GND — Ground |
| Pin 130 | I/O — User I/O (Bank 1) |
| Pin 131 | I/O — User I/O (Bank 1) |
| Pin 132 | VCCIO1 — I/O bank 1 supply voltage |
| Pin 133 | I/O — User I/O (Bank 1) |
| Pin 134 | I/O — User I/O (Bank 1) |
| Pin 135 | GND — Ground |
| Pin 136 | I/O — User I/O (Bank 1) |
| Pin 137 | I/O — User I/O (Bank 1) |
| Pin 138 | VCCINT — Core supply voltage 1.15-1.25V |
| Pin 139 | I/O — User I/O (Bank 2) |
| Pin 140 | I/O — User I/O (Bank 2) |
| Pin 141 | GND — Ground |
| Pin 142 | I/O — User I/O (Bank 2) |
| Pin 143 | I/O — User I/O (Bank 2) |
| Pin 144 | VCCIO2 — I/O bank 2 supply voltage |
Typical Applications
EP3C10E144C7N is suitable for 7 applications: Industrial Motor Control, Video Processing Bridge, Communication Protocol Bridge, DSP Accelerator (FIR/FFT), Embedded Controller Glue Logic, Educational & Prototyping Platform, LED Display & Signage Control.
Industrial Motor Control
The EP3C10E144C7N is well suited for industrial motor control loops where deterministic timing and DSP throughput are required. Its 23 hardware 18x18 multipliers can run field-oriented control (FOC) and Park/Clark transforms at high PWM frequencies, while the 4 PLLs generate precise PWM-aligned clocks from a single crystal. The 94 user I/Os support quadrature encoder inputs, Hall sensor capture, PWM outputs, and isolation interfaces. The exposed-pad EQFP-144 package is straightforward to hand-solder or low-volume assemble, which suits motor-drive reference designs and prototyping. Compared with a microcontroller-only approach, the FPGA offloads the FOC math into dedicated multipliers, freeing the MCU for supervisory and communications tasks.
Recommended
Video Processing Bridge
For video format conversion and bridging applications, the EP3C10E144C7N's M9K block RAM (414 Kbits) acts as line buffers, while 10K LEs handle the pixel pipeline. The fabric can convert between camera-side parallel RGB/YCbCr and display-side LVDS, MIPI (with external bridge), or HDMI (with external TMDS encoder) formats. The 4 PLLs synthesize pixel clocks from any input reference, and the 65 nm process keeps thermals manageable even at 1080p60 throughput. For embedded vision prototypes needing quick turnaround and bitstream-iterable development, the Cyclone III EQFP-144 footprint is breadboard-friendly and Quartus supports free design entry.
Recommended
Communication Protocol Bridge
The EP3C10E144C7N is ideal as a multi-protocol glue logic bridge between SPI, I2C, UART, parallel buses, and custom interfaces. With 10,320 LEs it can implement several soft IP cores simultaneously (for example, SPI-to-I2C, UART-to-parallel, and a custom ASIC-facing bus), and the 4 PLLs allow independent baud-rate synthesis for each port. The 94 user I/Os comfortably accommodate 4-6 channels of multi-protocol bridging with logic-level translation handled by VCCIO banks (1.2V/1.5V/1.8V/2.5V/3.3V). Cyclone III's free Quartus toolchain and the device's mature documentation make protocol-bridge reference designs widely available from open-source repositories.
Recommended
DSP Accelerator (FIR/FFT)
In low-to-mid complexity DSP acceleration roles, the EP3C10E144C7N's 23 hardware 18x18 multipliers sustain roughly 1.4 GMACS at maximum fMAX, sufficient for 64-tap FIR filters, 256-point FFTs, and audio-rate FFT pipelines. Each multiplier can be paired with M9K block RAM to create distributed-arithmetic or systolic FIR architectures, while the PLLs derive precisely spaced FFT bin clocks. Designers typically use this device for front-end signal conditioning (pre-ADC filtering, decimation) or post-processing (interpolation, equalization). Higher DSP density requires scaling up to EP3C25/EP3C40 within the same family.
Recommended
Embedded Controller Glue Logic
The EP3C10E144C7N is commonly used as glue logic alongside a microprocessor or DSP, replacing dozens of 74-series parts with a single programmable device. It can implement custom address decoding, wait-state generators, interrupt controllers, peripheral multiplexers, and timing-critical interface logic. The 4 PLLs and 94 I/Os allow multiple clock domains and voltage translations, while the compact EQFP-144 footprint reduces board area versus discrete logic. This application is especially relevant when off-the-shelf ASSPs cannot match a specific timing, voltage, or pinout requirement and a small FPGA bridge is the fastest path to a working board.
Recommended
Educational & Prototyping Platform
The EP3C10E144C7N's free Quartus toolchain support, breadboard-friendly EQFP-144 package, and abundant reference designs make it a popular choice for university FPGA courses, hobbyist projects, and prototype evaluation kits. The 10K LE density is large enough to host full RISC-V soft cores, educational CPU designs (MIPS, NIOS II), and lab projects (UART echo, VGA controllers, simple CPUs), yet small enough to fit in short bitstream configuration times. Industrial and hobbyist distributors stock the part widely through legacy channels, and open-source cores accelerate student learning.
Recommended
LED Display & Signage Control
For LED video walls and digital signage, the EP3C10E144C7N drives high refresh-rate LED panels with deterministic timing and per-pixel control. The 94 user I/Os can source enough data lanes for medium-resolution panels (typically 16-32 multiplexed data lines plus clock and latch), while M9K block RAM holds scan-line buffers. The 4 PLLs derive the precise pixel clock required for high-bit-depth grayscale modulation (typically 10-16 bits per channel). The exposed-pad package simplifies thermal layout for always-on signage installations, and the wide 3.3V VCCIO support directly interfaces most LED driver chips without level translation.
Recommended
Recommended Products Summary
Engineering reference data for EP3C10E144C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C10E144C8N | EP3C10E144I7N | EP3C16E144C7N | EP3C5E144C7N | EP4CE10E144C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 144-pin LQFP Exposed Pad (EQFP-144) | EQFP-144 (same) | EQFP-144 (same) | EQFP-144 (same) | EQFP-144 (same) | EQFP-144 (same) |
| Logic Elements | 10,320 | 10,320 | 10,320 | 15,408 | 5,136 | 10,320 |
| Embedded Memory (M9K BRAM) | 414 Kbits | 414 Kbits | 414 Kbits | 504 Kbits | 414 Kbits | 414 Kbits |
| Embedded 18x18 Multipliers | 23 | 23 | 23 | 56 | 23 | 23 |
| Maximum User I/Os | 94 | 94 | 94 | 94 | 94 | 94 |
| Speed Grade | C7 (Commercial, fastest) | C8 (Commercial, slower) | I7 (Industrial) | C7 (Commercial, fastest) | C7 (Commercial, fastest) | C8 (Cyclone IV E) |
| Operating Junction Temperature | 0C to +85C | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C | 0C to +85C |
Key Differentiators
- Direct upgrade path to EP3C16 in same package (vs EP3C5E144C7N)
- Fastest commercial speed grade available (vs EP3C10E144C8N)
- Lowest-cost modernized cross-generational alternative (vs EP4CE10E144C8N)
Design Notes
The Cyclone III EP3C10E144C7N requires three separate supply rails: VCCINT (1.15-1.25 V core), VCCIO[1-8] (1.2/1.5/1.8/2.5/3.3 V per bank), and an analog VCC_PLL for the PLL blocks. Power sequencing must follow the Intel Cyclone III device handbook: VCCINT must rise monotonically and reach steady state before VCCIO ramps. Failure to sequence correctly can cause high in-rush current and latch-up. Use a dedicated LDO (e.g., LM1117 for VCCINT) and separate ferrite beads for each VCCIO bank to minimize switching-noise coupling between logic and analog blocks.
The EQFP-144 exposed thermal pad must be soldered to a PCB copper pour (minimum 1 square inch recommended) tied to ground. Without the exposed-pad solder connection, junction-to-ambient thermal resistance can exceed 30 C/W, causing the device to thermal-throttle at modest utilization levels. For continuous 100% LE utilization at 437 MHz, expect junction temperature rise of approximately 15-20 C above ambient with proper ground-plane soldering - keep ambient below 70 C to stay within the C7 commercial junction limit.
Route all eight VCCIO bank supplies with wide traces or copper pours, and place 0.1uF decoupling capacitors as close to every VCCIO pin as possible plus bulk 10-47uF tantalum or ceramic capacitors at each supply entry point. Use a continuous ground plane on the layer immediately beneath the FPGA, and stitch the perimeter with vias every 200 mils to provide a low-impedance return path for high-speed signals. LVDS pairs must be length-matched within 50 mils and routed over a continuous reference plane.
Do not leave MSEL[3:0] floating - tie them to VCCINT or GND through 1-10 kohm resistors to select the desired configuration mode (AS, AP, JTAG, PS). Do not connect CONF_DONE directly to VCCIO - it is an open-drain output that requires a 4.7 kohm pull-up to VCCIO for proper operation. The nCONFIG pin must be held low at power-up until all supplies are stable, then released to begin configuration. Hot-socketing is supported only when MSEL pins are configured for JTAG or AS mode.
Compliance Information
RoHS compliant per Altera/Intel product page; lead-free and halogen-free per Cyclone III device family specifications. Not AEC-Q100 qualified - select automotive-grade Cyclone III variants or other families for automotive applications.
