EP3C25F256I7N vs EP3C25F324C7N Comparison

Detailed side-by-side comparison of EP3C25F256I7N by Intel and EP3C25F324C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3C25F324C7N EP3C25F324C7N - 24,624-Cell Cyclone III FPGA | Intel

EP3C25F324C7N - 24,624-Cell Cyclone III FPGA | Intel

EP3C25F324C7N βœ“ Active

Specification Comparison

Parameter EP3C25F256I7N EP3C25F324C7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $48.90 $0.00
Family Cyclone III β€”
Device Type FPGA - Field Programmable Gate Array β€”
Logic Elements (LEs) 24,624 β€”
Logic Array Blocks (LABs) 1,539 β€”
Embedded Memory Bits 608,256 (66 M9K blocks) β€”
Embedded Multipliers (18x18) 66 β€”
Maximum User I/O Pins 156 β€”
PLLs 4 β€”
Process Technology 65 nm low-power 65 nm
Core Voltage 1.2 V 1.2 V
Package Type 256-LBGA / 256-FBGA (17x17 mm) β€”
Operating Temperature Range -40 C to +125 C (Industrial) β€”
Speed Grade 7 β€”
RoHS Status Lead-Free / RoHS Compliant (per F suffix, 7N suffix) [DATA_NEEDED: RoHS status]
Mounting Type Surface Mount Surface Mount
Product Type β€” Field Programmable Gate Array (FPGA)
Device Family β€” Cyclone III
Logic Cells β€” 24,624 cells
Embedded Memory β€” 608,256 bits
Available I/O Pins β€” 215 I/O
Maximum Listed Frequency β€” 437.5 MHz
Package β€” 324-ball FBGA
Terminal Count β€” 324 terminals
Terminal Form β€” Ball
Package Code β€” BGA
Package Shape β€” Rectangular
Temperature Grading β€” Other
Programmability β€” Field programmable
REACH Status β€” [DATA_NEEDED: REACH status]
AEC-Q100 Qualification β€” [DATA_NEEDED: AEC-Q100 qualification]

Datasheets & Resources

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