EP3C55F780C8N vs EP3C80F780C8N Comparison

Detailed side-by-side comparison of EP3C55F780C8N by Intel and EP3C80F780C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C55F780C8N EP3C80F780C8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Active
Stock Status In Stock In Stock
Unit Price (USD) $58.20 $240.20
Series Cyclone III β€”
Family Cyclone III (low-cost FPGA) Cyclone III
Logic Elements (LE) 55,856 β€”
Logic Array Blocks (LAB) 3,491 β€”
Total RAM Bits 2,396,160 bits (2396 Kbit) 2,810,880 bits
Embedded Memory Blocks (M9K) 260 β€”
Embedded 18x18 Multipliers 156 β€”
PLLs 4 4
Maximum User I/O 377 β€”
User I/O Banks 4 β€”
Process Technology 65 nm TSMC low-power β€”
Core Supply Voltage 1.15 V to 1.25 V β€”
Package 780-pin FBGA (29x29 mm, 1.0 mm pitch) 780-BGA (FBGA), 29 x 29 mm, 1.0 mm pitch
Speed Grade 8 (commercial, slowest) 8
Operating Temperature 0C to +85C (commercial, 'C' suffix) β€”
Configuration Modes Active Serial, Passive Serial, Fast Passive Parallel, JTAG β€”
Internal Frequency (typ.) 402 MHz β€”
RoHS Status Compliant (lead-free FBGA) β€”
Device Type β€” FPGA - Field Programmable Gate Array
Logic Elements β€” 81,264
Embedded Multipliers β€” 244 (18x18)
User I/O β€” 429
Internal Frequency (max) β€” 472 MHz
Number of Pins β€” 780
Package Height β€” 2.60 mm
Mounting Type β€” Surface Mount
Lead Free / RoHS β€” Yes (lead-free)
Process Node β€” 60 nm TSMC low-k
Operating Temperature Grade β€” Commercial (C)

Datasheets & Resources

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