EP3C55F780C8N - 55K LE Cyclone III FPGA, 780-FBGA | Intel/Altera
MPN: EP3C55F780C8N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.1 | $721.00 |
| 100 | $65.4 | $6,540.00 |
| 250 | $61.8 | $15,450.00 |
| 500 | $58.2 | $29,100.00 |
EP3C55F780C8N Overview
What is a low-cost FPGA? A field-programmable gate array is a semiconductor device whose logic function is defined after PCB assembly rather than at the wafer fab, allowing rapid hardware iteration. The Cyclone III family is positioned in the hierarchy as low-cost programmable logic -> FPGA -> programmable logic device -> semiconductor, manufactured on a 65 nm TSMC process and tailored for high-volume cost-sensitive designs where Cyclone IV or Cyclone V would be over-specified.
Key features include 55856 logic elements, 3,491 LABs, 2,396,160 bits (2396 Kbit) of RAM, 156 embedded 18x18 multipliers, four PLLs, 377 maximum user I/Os, and 4 user I/O banks that support LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device also provides 20 global clock networks and supports Nios II embedded processor soft cores via Altera/Intel Quartus design tools.
Architecturally, the Cyclone III uses a logic-element-based fabric with 16 logic elements per LAB, distributed M9K memory blocks (totaling 260 blocks), and DSP blocks formed from the 18x18 multipliers. The 65 nm process and 1.2 V core supply keep dynamic power low for a device of this logic density, while the 4 PLLs allow flexible clock synthesis across multiple I/O banks.
Typical applications include industrial motor control and machine vision, video processing and display bridges, communications line cards and protocol bridging, consumer electronics such as flat-panel TVs and set-top boxes, and test & measurement front ends. The 55K LE capacity is well matched to designs that require soft processor cores plus moderate DSP throughput.
When designing with this device, plan the 780-BGA PCB layout early: the 1.0 mm pitch and 29x29 mm body demand 4 or 6 layer stack-ups with microvia or HDI technology for escape routing, and at least 8 decoupling capacitor placements around the package perimeter. Configuration pin mapping must be verified against the chosen AS/PS/FPP mode before committing the schematic.
This page synthesizes distributor pricing, drop-in Cyclone III variants, and practical PCB and toolchain guidance not found in the manufacturer datasheet alone.
Drop-in alternatives for EP3C55F780C8N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C55F780C8N (same form factor and footprint) β differing in Package, Speed Grade, Process Technology, Family, Operating Temperature.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3C55F780C8
β Drop-Inβ In Stock
$126.01 / Unit
View Datasheet βEP3C55F780C7N
β Drop-Inβ In Stock
$138.31 / Unit
View Datasheet βEP3C55F780C7
β Drop-Inβ In Stock
$76.75 / Unit
View Datasheet βEP3C55F780C6N
β Drop-Inβ In Stock
$52.1 / Unit
View Datasheet βEP3C55F780C6
β Drop-Inβ In Stock
$209.22 / Unit
View Datasheet βEP3C55F780C8N Maximum Ratings & Electrical Characteristics
| Series | Cyclone III |
| Family | Cyclone III (low-cost FPGA) |
| Logic Elements (LE) | 55,856 |
| Logic Array Blocks (LAB) | 3,491 |
| Total RAM Bits | 2,396,160 bits (2396 Kbit) |
| Embedded Memory Blocks (M9K) | 260 |
| Embedded 18x18 Multipliers | 156 |
| PLLs | 4 |
| Maximum User I/O | 377 |
| User I/O Banks | 4 |
| Process Technology | 65 nm TSMC low-power |
| Core Supply Voltage | 1.15 V to 1.25 V |
| Package | 780-pin FBGA (29x29 mm, 1.0 mm pitch) |
| Speed Grade | 8 (commercial, slowest) |
| Operating Temperature | 0C to +85C (commercial, 'C' suffix) |
| Configuration Modes | Active Serial, Passive Serial, Fast Passive Parallel, JTAG |
| Internal Frequency (typ.) | 402 MHz |
| RoHS Status | Compliant (lead-free FBGA) |
EP3C55F780C8N 780-pin fbga (29x29 mm, 1.0 mm pitch) Pin Configuration Guide
Pin configuration for EP3C55F780C8N (780-pin fbga (29x29 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C55F780C8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C55F780C8N is suitable for 6 applications: Industrial Motor Control and Drive, Video Processing and Display Bridge, Communications Line Card and Protocol Bridge, Consumer Flat-Panel TV and Set-Top Box, Test & Measurement Front End, Soft Processor Embedded Platform (Nios II).
Industrial Motor Control and Drive
The EP3C55F780C8N fits industrial motor control because its 55,856 logic elements, 156 18x18 multipliers, and 4 PLLs comfortably host closed-loop field-oriented control (FOC) firmware for three-phase PMSM or induction motors. With 377 user I/Os across 4 banks the FPGA can interface simultaneously to resolver-to-digital converters, gate drivers, and isolated SPI/encoder buses, while the 260 M9K memory blocks provide headroom for lookup tables, ramp generators, and SVPWM modulation buffers. The 1.2 V core supply and 65 nm process keep dynamic power manageable inside sealed IP65 enclosures. Speed grade 8 supports the typical 10-20 kHz PWM switching frequency with substantial timing margin for quadrature decoding and current-sampling pipelines.
Recommended
Video Processing and Display Bridge
The EP3C55F780C8N is well suited as a video bridge between cameras, HDMI/DVI transmitters, and LCD panels because the 2,396,160 bits of embedded RAM provide line buffers and frame-store memory for resolution scaling and color-space conversion. The 156 18x18 multipliers enable real-time chroma upsampling, deinterlacing, and image enhancement filters, while 4 PLLs synthesize the pixel clocks needed for 720p, 1080p, and arbitrary LVDS panel timings. The 377 user I/Os are partitioned across 4 banks, allowing the design to accept parallel CMOS camera input on one bank and drive LVDS pairs to a display on another bank with independent VCCIO levels.
Recommended
Communications Line Card and Protocol Bridge
For telecom line cards the EP3C55F780C8N serves as a low-cost glue logic device bridging E1/T1 framers, UART/SCIF buses, SPI, I2C, and custom serial protocols to a backplane processor. Its 55K logic elements can host several soft UARTs, HDLC controllers, and FIFO bridges in parallel, and the 260 M9K blocks provide packet buffering at line rates up to several hundred Mbps. The 4 PLLs generate the multiple independent clock domains typically required in TDM aggregation designs, while the 4 I/O banks allow 3.3 V LVCMOS signalling to legacy framer chips and 1.8 V LVCMOS to a modern host ASIC on the same device.
Recommended
Consumer Flat-Panel TV and Set-Top Box
Consumer TV mainboards have long used Cyclone III as the system controller: the EP3C55F780C8N can host HDMI CEC, IR remote decoding, front-panel keyscan, LED backlight PWM, and audio routing while supervising a downstream media processor. The 377 user I/Os interface to tuner modules, HDMI switches, audio DACs, flash memory, and Ethernet PHYs, and the 156 18x18 multipliers can be repurposed for simple audio effects or comb filtering for video. The 1.2 V core and 65 nm process keep BOM cost low enough for high-volume consumer electronics.
Recommended
Test & Measurement Front End
The EP3C55F780C8N suits test and measurement front ends because its 55,856 logic elements implement complex trigger engines, pattern generators, and protocol-aware decoders that offload a host PC. The 156 18x18 multipliers support FIR filtering, FFT preprocessing, and digital downconversion of IF signals, while the 4 PLLs synthesize the multiple sample clocks required for ADC capture. The 377 user I/Os exposed through 4 banks allow direct connection to parallel ADCs, DACs, and LVDS data converters, with the 1.2 V core supplying the logic fabric and the 2.5 V/3.3 V I/O banks driving external signal-conditioning circuitry.
Recommended
Soft Processor Embedded Platform (Nios II)
The EP3C55F780C8N is a popular host for the Altera/Intel Nios II soft processor because the 55K logic elements can instantiate a Nios II/f core with caches, plus a rich set of peripherals: UART, SPI, I2C, Ethernet MAC, DDR controller, and custom accelerators. Designers can run embedded Linux (uClinux), FreeRTOS, or bare-metal firmware while leaving headroom for application logic in the remaining LE budget. The 2,396,160 bits of RAM back instruction and data caches, and the 4 PLLs synthesize processor, SDRAM, and peripheral clocks from a single reference oscillator. Commercial temperature grade 0C to 85C is adequate for indoor equipment.
Recommended
Recommended Products Summary
Engineering reference data for EP3C55F780C8N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C55F780C8 | EP3C55F780C7N | EP3C55F780C7 | EP3C55F780C6N | EP3C55F780C6 |
|---|---|---|---|---|---|---|
| Package | 780-FBGA (29x29 mm) | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 |
| Speed Grade | C8 (slowest) | C8 | C7 (~10% faster) | C7 (~10% faster) | C6 (~20% faster) | C6 (~20% faster) |
| Lead-Free (RoHS) | Yes (N suffix) | No (legacy) | Yes | No (legacy) | Yes | No (legacy) |
| Total RAM Bits | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 |
| User I/Os (max) | 377 | 377 | 377 | 377 | 377 | 377 |
Key Differentiators
- Lowest price point in the 55K-LE Cyclone III family (vs EP3C55F780C7N)
- Lead-free / RoHS compliant assembly (vs EP3C55F780C8)
- Drop-in compatible with full speed-grade family in same 780-BGA (vs EP3C55F780C6N)
Design Notes
The 780-FBGA package at 1.0 mm pitch requires a 4-layer (minimum) or 6-layer (recommended) PCB stack-up with microvia or HDI technology for BGA escape routing. Place at least 8 decoupling capacitors (4 x 100 nF + 4 x 10 uF) around the package perimeter, with one bulk 220 uF tantalum or polymer cap on each VCCIO bank. Use a continuous ground plane directly under the BGA and route all clock and high-speed LVDS signals on inner stripline layers with reference returns.
Power sequencing for the EP3C55F780C8N requires VCCINT (1.2 V core) to ramp before or simultaneously with VCCIO (per-bank I/O supply) per the Cyclone III device handbook. Use a dedicated power supervisor or sequencer IC to enforce the order; failure to sequence properly can latch-up the device or cause long-term reliability degradation. Each PLL analog supply VCC_PLL must be derived from a low-noise LDO (such as a TPS7A4701 or LT3042) with its own pi-filter, not shared with digital rails.
Configuration mode selection is a common source of board bring-up failures: verify the MSEL pins are strapped correctly for Active Serial, Passive Serial, or Fast Passive Parallel mode before powering up. The JTAG chain (TCK, TMS, TDI, TDO, nCONFIG, nSTATUS, CONF_DONE) must be accessible via a 10-pin header or USB-Blaster connector for reprogramming during development. Do not leave nCONFIG floating - tie it high through a 10 kohm resistor to VCCAUX or it will randomly reset during operation.
At full utilization (90% LE + DSP + RAM) the EP3C55F780C8N can dissipate up to approximately 2-3 W. Estimated: with theta_JA around 18-22 C/W on a standard 4-layer JEDEC test board, this yields a junction temperature rise of approximately 36-66 C above ambient. The commercial 85C ceiling leaves comfortable margin; for industrial 100C operation consider the EP3C55F780I7N (industrial temp, speed grade 7) drop-in.
Compliance Information
Lead-free RoHS compliant per the 'N' suffix in MPN. Commercial temperature grade 0C-85C. NRND status as of 2026-09-09 - not recommended for new designs but supported for existing customers.
