EP3C55F780C8N vs EP3CLS100F780C8N Comparison

Detailed side-by-side comparison of EP3C55F780C8N by Intel and EP3CLS100F780C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C55F780C8N EP3CLS100F780C8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Active
Stock Status In Stock In Stock
Unit Price (USD) $58.20 $105.80
Series Cyclone III β€”
Family Cyclone III (low-cost FPGA) β€”
Logic Elements (LE) 55,856 100,448
Logic Array Blocks (LAB) 3,491 6,278
Total RAM Bits 2,396,160 bits (2396 Kbit) β€”
Embedded Memory Blocks (M9K) 260 β€”
Embedded 18x18 Multipliers 156 β€”
PLLs 4 β€”
Maximum User I/O 377 429
User I/O Banks 4 β€”
Process Technology 65 nm TSMC low-power 65 nm low-power CMOS
Core Supply Voltage 1.15 V to 1.25 V β€”
Package 780-pin FBGA (29x29 mm, 1.0 mm pitch) 780-ball FBGA (FineLine BGA)
Speed Grade 8 (commercial, slowest) β€”
Operating Temperature 0C to +85C (commercial, 'C' suffix) β€”
Configuration Modes Active Serial, Passive Serial, Fast Passive Parallel, JTAG β€”
Internal Frequency (typ.) 402 MHz β€”
RoHS Status Compliant (lead-free FBGA) Compliant
Device Family β€” Cyclone III LS
Total Memory Bits β€” 4,451,328
Embedded Memory Blocks β€” M9K + M144K
Number of PLLs β€” 4
Core Supply Voltage (VCCINT) β€” 1.2 V
Analog Supply (VCCA) β€” 2.5 V
Maximum Embedded Multipliers (18x18) β€” 244
Package Dimensions β€” 29 mm x 29 mm, 1.0 mm ball pitch
Operating Temperature (Commercial) β€” 0C to +85C
Mounting Type β€” Surface Mount (BGA)
Configuration Schemes β€” AS, PS, PP, JTAG
Lead-Free β€” Yes

Datasheets & Resources

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