EP3C55F780I7N vs EP3C55F780C6N Comparison
Detailed side-by-side comparison of EP3C55F780I7N by Intel and EP3C55F780C6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3C55F780I7N
EP3C55F780I7N - Cyclone III FPGA, 55K LEs, 780-FBGA | Intel
EP3C55F780I7N β ActiveIntel
EP3C55F780C6N
EP3C55F780C6N - Cyclone III FPGA 55K LE 780-BGA | Intel (Altera)
EP3C55F780C6N β ActiveSpecification Comparison
| Parameter | EP3C55F780I7N | EP3C55F780C6N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $195.00 | $52.10 |
| Family | Cyclone III | Cyclone III FPGA |
| Logic Elements | 55,856 | β |
| Total RAM Bits | 2,396,160 | β |
| Number of Logic Array Blocks (LABs) | 2,426 | β |
| Embedded 18x18 Multipliers | 56 | 312 |
| Phase-Locked Loops (PLLs) | 4 | β |
| Maximum User I/O Count | 377 | β |
| Core Voltage | 1.2 V | β |
| Operating Temperature (Industrial) | -40 Β°C to +100 Β°C | β |
| Maximum Internal Frequency | 472 MHz | β |
| Process Technology | 65 nm | 65 nm low-power CMOS |
| Package | 780-FBGA (29 x 29 mm, 1 mm pitch, 2.60 mm height) | 780-ball FBGA (F780) |
| Mounting Type | Surface Mount | Surface Mount |
| Lead-Free / RoHS | Lead free, RoHS compliant | β |
| Configuration Scheme | Passive Serial / JTAG / Active Serial | β |
| Speed Grade | -7 (fastest) | C6 |
| Series | β | Cyclone III |
| Logic Elements (LE) | β | 55,856 |
| Embedded Memory (bits) | β | 2,396,160 |
| Embedded Memory (Kb) | β | 2,340 Kb |
| Maximum User I/O | β | 377 |
| PLLs | β | 4 |
| Global Clocks | β | 20 |
| Package Code | β | BGA, 780 balls |
| Operating Temperature | β | 0C to +85C (commercial) |
| RoHS Status | β | Compliant |
| Voltage - Supply (Core) | β | 1.2 V (typical) |
| Voltage - I/O | β | Multi-standard (LVTTL/LVCMOS/LVDS/SSTL/PCI) |