EP3C55F780C6N - Cyclone III FPGA 55K LE 780-BGA | Intel (Altera)
MPN: EP3C55F780C6N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $71.2 | $712.00 |
| 100 | $64.8 | $6,480.00 |
| 500 | $58.4 | $29,200.00 |
| 1,000 | $52.1 | $52,100.00 |
EP3C55F780C6N Overview
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that belongs to the broader category of integrated circuits and sits in the digital semiconductor hierarchy: FPGA > programmable logic > logic IC > integrated circuit. Cyclone III is positioned in the low-power, cost-sensitive segment of Intel's FPGA portfolio, targeting volume production in industrial, communications and consumer applications where Stratix-class performance is unnecessary.
Key features of this device include 55,856 logic elements, 312 embedded 18x18 multipliers, 2,396,160 bits (approximately 234 Kbits) of RAM, 4 PLLs and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL and PCI through 377 user I/O pins. The 'C6' speed grade and commercial temperature rating (0C to +85C) suit typical indoor and laboratory environments rather than extended industrial or automotive conditions.
From an architectural standpoint, the Cyclone III family uses a 65nm low-power process with on-chip termination, dedicated DSP blocks and embedded memory arranged in M9K blocks. The 780-FBGA package provides high I/O density suitable for parallel bus interfaces, video bridging and multi-channel data acquisition subsystems.
Typical applications include industrial motor control, video processing and bridging, software-defined radio, factory automation controllers, and test and measurement equipment where deterministic parallel logic and embedded DSP are required at low total system cost. When migrating designs between Cyclone III variants, verify pin compatibility because the F780 (780-pin FBGA) footprint differs from F484 and F324 package options within the same family.
Drop-in alternatives for EP3C55F780C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C55F780C6N (same form factor and footprint) — differing in Package, Speed Grade, Process Technology, Embedded 18x18 Multipliers, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C55F780C6
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View Datasheet →EP3C55F780C6N Maximum Ratings & Electrical Characteristics
| Series | Cyclone III |
| Family | Cyclone III FPGA |
| Logic Elements (LE) | 55,856 |
| Embedded Memory (bits) | 2,396,160 |
| Embedded Memory (Kb) | 2,340 Kb |
| Embedded 18x18 Multipliers | 312 |
| Maximum User I/O | 377 |
| PLLs | 4 |
| Global Clocks | 20 |
| Process Technology | 65 nm low-power CMOS |
| Package | 780-ball FBGA (F780) |
| Package Code | BGA, 780 balls |
| Speed Grade | C6 |
| Operating Temperature | 0C to +85C (commercial) |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
| Voltage - Supply (Core) | 1.2 V (typical) |
| Voltage - I/O | Multi-standard (LVTTL/LVCMOS/LVDS/SSTL/PCI) |
EP3C55F780C6N bga, 780 balls Pin Configuration Guide
Pin configuration for EP3C55F780C6N (bga, 780 balls package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C55F780C6N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C55F780C6N is suitable for 6 applications: Industrial Motor Control, Video Processing and Bridging, Software Defined Radio (SDR), Factory Automation Controllers, Test and Measurement Equipment, Multi-Channel Data Acquisition.
Industrial Motor Control
The EP3C55F780C6N fits industrial motor control applications thanks to its 312 dedicated 18x18 multipliers and 4 PLLs, which together provide the DSP throughput needed for field-oriented control (FOC), space-vector PWM and resolver/sine-cosine decoding at multi-kHz switching rates. The 55,856 logic elements comfortably absorb the encoder interface, fault logic and protective interlocks in parallel with the DSP pipeline, while 377 user I/O pins support multiple quadrature encoder channels, Hall sensor inputs and gate-driver outputs without external muxing. Compared to a microcontroller running a software FOC loop, this FPGA delivers deterministic cycle-accurate control at much higher update rates, and the F780 BGA's 1.0 mm pitch is well-established in industrial PCB manufacturing. Power dissipation is typically 1-2 W with all logic active, allowing fanless designs at the commercial 0C to +85C temperature range.
Recommended
Video Processing and Bridging
For video processing, format conversion and bridging applications, the EP3C55F780C6N provides the parallel logic and on-chip memory bandwidth required to handle multi-stream SD/HD video pipelines. The 2,396,160 bits of embedded RAM is sufficient to buffer full video frames for format conversion between parallel RGB, BT.656, BT.1120 and LVDS interfaces without external SDRAM for lower resolutions. The 377 user I/O pins can directly interface to DVI/HDMI bridge chips, camera sensor LVDS outputs and LCD panel timing controllers. With 312 hardware multipliers, color-space matrices (RGB to YCbCr) and scaling filters are offloaded from any host processor. The 65nm low-power Cyclone III process keeps the FPGA cool for fanless video appliances, and the F780 BGA package is widely accepted in commercial video hardware.
Recommended
Software Defined Radio (SDR)
The EP3C55F780C6N is well matched to entry-level software-defined radio (SDR) baseband processing where its 312 18x18 multipliers implement parallel FIR filters, FFT butterflies and channelization logic that would otherwise require a dedicated DSP or GPU. The 55,856 logic elements accommodate complete digital down-conversion chains, including numerically controlled oscillators (NCOs), decimation filters and AGC loops, while the 4 PLLs generate the multiple clock domains required by ADC sample clocks, FPGA fabric and interface logic. With 377 user I/O pins, parallel LVDS connections to high-speed ADCs/DACs are possible without external muxing, and the F780 BGA package supports the controlled-impedance routing needed for sub-ns setup/hold timing. Commercial temperature rating suits lab and bench SDR platforms.
Recommended
Factory Automation Controllers
In factory automation, the EP3C55F780C6N serves as a deterministic logic engine for PLC-style controllers, distributed I/O hubs and protocol bridges (e.g., EtherCAT, Profibus, Modbus) that demand predictable latency under load. Its 55,856 logic elements absorb complete industrial protocol stacks with custom state machines, while 377 I/O pins directly interface to 24V field I/O through opto-isolated digital inputs and outputs without external bus switches. The 4 PLLs generate the multiple clock domains needed for synchronized motion, encoder feedback and communication interfaces, and the 312 embedded multipliers accelerate vibration analysis and FFT-based condition monitoring. The commercial 0C to +85C range suits factory-floor environments when paired with proper enclosure thermal design.
Recommended
Test and Measurement Equipment
For test and measurement instruments such as logic analyzers, protocol exercisers and multi-channel data acquisition systems, the EP3C55F780C6N delivers the parallel logic capacity and memory bandwidth to capture, buffer and process data in real time. The 2,396,160 bits of embedded RAM act as deep sample buffers for trigger matching and pre-decimation storage, reducing or eliminating external SRAM. The 377 user I/O pins accept multiple parallel bus sources, and the 312 hardware multipliers accelerate FFT-based spectrum analysis and digital filtering. With 4 PLLs, multiple sampling-rate domains are synthesized cleanly, and the F780 BGA package provides the signal-integrity margin needed for high-speed digital instrumentation. Power consumption remains manageable for benchtop portable instruments.
Recommended
Multi-Channel Data Acquisition
The EP3C55F780C6N suits multi-channel data acquisition front-ends where its 312 hardware multipliers perform per-channel DSP (gain correction, decimation, anti-alias filtering) in parallel without time-multiplexing across channels. With 377 I/O pins, simultaneous interface to 8 or more 12-/14-bit ADC/DAC devices over LVDS or parallel CMOS buses is achievable, while the 2,396,160 bits of embedded RAM buffer samples between DMA bursts to the host. The 4 PLLs generate per-ADC sampling clocks with low jitter, and the 65nm Cyclone III low-power process keeps multi-channel aggregate power under typical fanless industrial limits. The F780 BGA's signal integrity supports the multi-MHz sample rates used in precision instrumentation, vibration analysis and sonar/ultrasound front-ends.
Recommended
Recommended Products Summary
Engineering reference data for EP3C55F780C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C55F780C6 | EP3C55F780C8N | EP3C55F780C7N | EP3C120F780C7N | EP3C120F780C8N | EP3C40F780C8N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FBGA (F780) | 780-ball FBGA (F780) - same | 780-ball FBGA (F780) - same | 780-ball FBGA (F780) - same | 780-ball FBGA (F780) - same | 780-ball FBGA (F780) - same | 780-ball FBGA (F780) - same |
| Logic Elements | 55,856 | 55,856 (same die) | 55,856 | 55,856 | 119,088 (+113%) | 119,088 (+113%) | 39,600 (-29%) |
| Embedded Memory (bits) | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 4,265,920 (+78%) | 4,265,920 (+78%) | 1,161,216 (-52%) |
| 18x18 Multipliers | 312 | 312 | 312 | 312 | 576 (+85%) | 576 (+85%) | 126 (-60%) |
| Maximum User I/O | 377 | 377 | 377 | 377 | 531 | 531 | 331 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Speed Grade | C6 | C6 | C8 (slower) | C7 (slower) | C7 (slower) | C8 (slower) | C8 (slower) |
| RoHS Status | RoHS compliant (N suffix) | Non-RoHS | RoHS compliant | RoHS compliant | RoHS compliant | RoHS compliant | RoHS compliant |
Key Differentiators
- Balanced LE/multiplier/memory ratio for mid-density DSP designs (vs EP3C40F780C8N)
- C6 speed grade is the fastest timing in Cyclone III F780 family (vs EP3C55F780C8N)
- RoHS-compliant lead-free (Pb-free) option for EU/global markets (vs EP3C55F780C6)
- 377 user I/O is among the highest in Cyclone III mid-density tier (vs EP3C55F484C8N)
Design Notes
The 780-ball FBGA package uses a 1.0 mm ball pitch and requires a minimum of 6 PCB layers with continuous ground planes under the BGA for signal integrity and thermal dissipation. Via-in-pad with filled-and-capped vias is recommended for the inner balls to escape cleanly. The PCB must support 0.5 mm via-to-pad spacing and use microvia or stacked-via structures for the breakout region; non-functional pads should be removed under the BGA to allow plane continuity. Reference the Intel Cyclone III Board Design Guidelines for the official escape routing recommendations.
Estimated: at typical toggle rates, the EP3C55F780C6N core draws approximately 0.5-1.5 A at 1.2 V plus I/O bank current. A 4-layer PCB with proper power plane stitching requires decoupling of at least 100 uF bulk plus 0.1 uF and 0.01 uF ceramic capacitors at every VCC pin group; the PLL analog supply (VCC_PLL) needs an additional ferrite bead and 10 uF + 0.1 uF RC filter to minimize jitter. The VCCIO banks must be tied to their target I/O standard voltage (1.2 V to 3.3 V) before JTAG configuration begins.
Do not confuse the EP3C55F780C6N (RoHS) with the EP3C55F780C6 (non-RoHS) when ordering for EU-marketed products; both share the same F780 footprint and are drop-in compatible, but only the 'N' suffix is RoHS compliant. The F780 BGA is not pin-compatible with the F484 or F324 packages in the same family - migrating between packages requires full PCB redesign and Quartus pin reassignment. Also verify that the Quartus Prime version supports the EP3C55F780C6N speed grade (C6) before starting a design.
Route high-speed differential pairs (LVDS) with 100 ohm differential impedance and keep length matching within 20 mil for data pairs and 100 mil across the data group. All clock inputs must be routed with controlled-impedance 50 ohm traces and isolated from switching signals by ground guard vias. JTAG signals (TCK, TMS, TDI, TDO) should be pulled up/down per the Cyclone III handbook to avoid configuration failures, and the nCONFIG, nSTATUS and CONF_DONE pins need their recommended RC reset networks.
Compliance Information
RoHS compliance indicated by 'N' suffix in the MPN. AEC-Q100 not applicable (FPGA is not an automotive-qualified IC by default). REACH compliance assumed from Cyclone III family product page.
