EP3C55F780I7N - Cyclone III FPGA, 55K LEs, 780-FBGA | Intel
MPN: EP3C55F780I7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $294.34 | $294.34 |
| 10 | $270 | $2,700.00 |
| 100 | $245 | $24,500.00 |
| 250 | $220 | $55,000.00 |
| 1,000 | $195 | $195,000.00 |
EP3C55F780I7N Overview
An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, all controlled by a configuration bitstream. FPGAs belong to the broader category of programmable logic devices (PLDs), sitting alongside CPLDs and structured ASICs in the logic IC hierarchy. Cyclone III devices specifically target high-volume, cost- and power-sensitive applications by combining the flexibility of programmable logic with ASIC-like unit pricing in the low hundreds of dollars.
Key features of the EP3C55F780I7N include 55,856 logic elements, 2,396,160 RAM bits distributed across M9K and M144K memory blocks, 56 embedded 18x18 multipliers for DSP operations, four phase-locked loops (PLLs) for clock management, and a maximum user I/O count of 377. Industrial temperature-grade operation from -40 °C to +100 °C is supported, and the device is lead-free and RoHS compliant. The 780-FBGA measures 29 mm x 29 mm with a 1 mm ball pitch, well suited to dense multi-layer PCBs.
Architecturally, Cyclone III devices use a Logic Array Block (LAB) structure containing 16 logic elements each, with routing channels and a global clock network distributed across eight quadrants. Hard IP blocks - including M9K memory blocks, 18x18 multipliers, and PLLs - are placed in dedicated columns and rows to optimize performance and silicon efficiency. The device is configured via a passive serial, JTAG, or Active Serial scheme using industry-standard Altera/Intel Quartus II design software.
Typical applications include industrial motor control and machine vision, video processing and display controllers, telecommunications line cards, automotive driver assistance (pre-Linux infotainment), and protocol bridging such as PCIe Gen1 endpoints. The device is also widely deployed in test and measurement front-ends and military/aerospace prototypes where FPGA flexibility is required.
When designing with this part, ensure that the Quartus II fitter reports timing closure within the I/O and core timing budgets for the chosen speed grade (-7). Decoupling must include 0.1 µF and 10 µF capacitors near every power pin to meet simultaneous-switching-noise specifications, and the JTAG chain should be ESD-protected at the connector.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, enabling engineers to compare the EP3C55F780I7N against alternative Cyclone III, Cyclone IV, and Lattice parts on the same 780-FBGA footprint.
Drop-in alternatives for EP3C55F780I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C55F780I7N (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Embedded 18x18 Multipliers, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C55F780I7
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP3C55F780C7N
✅ Drop-In✓ In Stock
$138.31 / Unit
View Datasheet →EP3C55F780C8N
✅ Drop-In✓ In Stock
$58.2 / Unit
View Datasheet →EP3C55F780C6N
✅ Drop-In✓ In Stock
$52.1 / Unit
View Datasheet →EP3C55F484I7N
✅ Drop-In✓ In Stock
$205.4 / Unit
View Datasheet →EP3C120F780I7N
✅ Drop-In✓ In Stock
$198.45 / Unit
View Datasheet →EP3C40F780I7N
✅ Drop-In✓ In Stock
$92.5 / Unit
View Datasheet →EP3C80F780I7N
✅ Drop-In✓ In Stock
$514.03 / Unit
View Datasheet →EP3C55F780I7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone III |
| Logic Elements | 55,856 |
| Total RAM Bits | 2,396,160 |
| Number of Logic Array Blocks (LABs) | 2,426 |
| Embedded 18x18 Multipliers | 56 |
| Phase-Locked Loops (PLLs) | 4 |
| Maximum User I/O Count | 377 |
| Core Voltage | 1.2 V |
| Operating Temperature (Industrial) | -40 °C to +100 °C |
| Maximum Internal Frequency | 472 MHz |
| Process Technology | 65 nm |
| Package | 780-FBGA (29 x 29 mm, 1 mm pitch, 2.60 mm height) |
| Mounting Type | Surface Mount |
| Lead-Free / RoHS | Lead free, RoHS compliant |
| Configuration Scheme | Passive Serial / JTAG / Active Serial |
| Speed Grade | -7 (fastest) |
EP3C55F780I7N 780-fbga (29 x 29 mm, 1 mm pitch, 2.60 mm height) Pin Configuration Guide
Pin configuration for EP3C55F780I7N (780-fbga (29 x 29 mm, 1 mm pitch, 2.60 mm height) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C55F780I7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C55F780I7N is suitable for 6 applications: Industrial Motor Control, Video Processing and Display Controllers, Telecommunications Line Cards, PCIe Gen1 Endpoint / Protocol Bridge, Test and Measurement Front-Ends, Machine Vision and Industrial Cameras.
Industrial Motor Control
The EP3C55F780I7N fits motor control designs because its 56 embedded 18x18 multipliers handle field-oriented control (FOC) algorithms, Park/Clarke transforms, and PWM generation in parallel - the EP3C55F780I7N's 472 MHz fabric headroom exceeds the ~50 MHz typical FOC loop rate. The industrial temperature grade (-40 to +100 C) tolerates factory floor enclosures, and the 377 user I/Os support multi-axis drives with encoder feedback and SPI/I2C/UART peripherals on a single chip. The 780-FBGA package provides sufficient I/O for up to 8 axes of current sensing, with PLLs generating the PWM carrier and encoder sample clocks. Compared to a discrete DSP+ASIC solution, the FPGA consolidates the algorithm logic, commutation timing, and protection logic on a reconfigurable substrate that adapts across motor families without PCB changes.
Recommended
Video Processing and Display Controllers
The EP3C55F780I7N is well suited to mid-resolution video pipelines because its 2,396,160 RAM bits (in M9K blocks) double-buffer full-HD frames at 60 fps without external memory, and the 472 MHz fabric clock supports real-time scaling and deinterlacing. The 377 I/Os expose parallel RGB/TTL, BT.656, BT.1120, and LVDS display interfaces simultaneously. Designers place the FPGA between a MIPI-CSI camera module and an HDMI transmitter, using the PLLs to derive pixel clocks from any source. Compared to a DSP, the FPGA offers line-rate parallelism and deterministic latency - critical for broadcast timing. The 780-FBGA package is a common industrial form factor, easing mechanical integration into display modules.
Recommended
Telecommunications Line Cards
The EP3C55F780I7N fits telecom line-card applications where multiple serial protocols (SERDES-less LVDS, HSTL, LVCMOS) and TDM interfaces must be bridged to a backplane. With 377 I/Os and 56 multipliers, the device implements framer/mapper blocks, E1/T1/J1 line interfaces, and Ethernet MACs simultaneously. The 4 PLLs generate independent bit clocks for each port, eliminating external PLL ICs. Industrial temperature grade supports central-office and outside-plant enclosures. Compared to discrete ASICs, the FPGA allows protocol upgrades (from TDM to packet, or adding SyncE) by reconfiguring the bitstream, extending product life without re-spinning the PCB.
Recommended
PCIe Gen1 Endpoint / Protocol Bridge
The EP3C55F780I7N implements PCIe Gen1 x1/x4 hard IP endpoints in concert with Cyclone III transceivers, but the device is more commonly used as a custom-logic bridge between a host CPU and an external bus. The 55K logic elements and 56 multipliers fit a DMA engine + descriptor ring + protocol translator with room for custom I/O glue logic. The 377 I/Os expose parallel local bus, I2C, SPI, and UART interfaces, while the PLLs generate the application clock domain. Compared to an ASSP bridge IC, the FPGA allows custom protocol addition (e.g. CAN, LIN, proprietary sensor buses) by recompiling without changing silicon.
Recommended
Test and Measurement Front-Ends
The EP3C55F780I7N suits T&M front-ends where arbitrary waveform generation, real-time DSP (FFT, FIR filtering), and trigger logic must coexist on a reconfigurable substrate. The 56 embedded 18x18 multipliers implement 1024-point FFTs at real-time rates below 1 ms, and the 2.4 Mbit RAM stores sample buffers for oscilloscope acquisition. The 377 I/Os drive parallel ADCs and DACs directly, while the PLLs generate the sample clock from an external reference. Industrial temperature supports bench and field-deployed test equipment. Compared to a fixed-function T&M ASIC, the FPGA supports new measurement standards (USB-C, automotive Ethernet) via bitstream update.
Recommended
Machine Vision and Industrial Cameras
The EP3C55F780I7N powers mid-resolution machine vision systems because its 2.4 Mbit RAM and 56 multipliers handle Bayer demosaicing, color correction, and edge detection in real time at 60 fps. The 377 I/Os drive MIPI-CSI-2 sensor receivers, parallel image sensors, and Gigabit Ethernet outputs simultaneously, while the PLLs derive pixel and network clocks. Industrial temperature supports factory-floor enclosures. The 780-FBGA package eases integration with high-pin-count image sensors. Compared to a GPU or vision processor, the FPGA delivers deterministic low latency (<1 ms) for inline inspection, critical for production-line throughput.
Recommended
Recommended Products Summary
Engineering reference data for EP3C55F780I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C55F780I7 | EP3C55F780C7N | EP3C40F780I7N | EP3C80F780I7N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 780-FBGA (29 x 29 mm, 1 mm pitch) | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Logic Elements | 55,856 | 55,856 | 55,856 | 39,600 (-29%) | 81,264 (+45%) |
| Total RAM Bits | 2,396,160 | 2,396,160 | 2,396,160 | 1,161,216 (-52%) | 2,810,880 (+17%) |
| Embedded 18x18 Multipliers | 56 | 56 | 56 | 36 (-36%) | 113 (+102%) |
| Maximum User I/O | 377 | 377 | 377 | 289 (-23%) | 295 (-22%) |
| Temperature Grade | Industrial -40 C to +100 C | Industrial -40 to +100 C (no N = non-lead-free) | Commercial 0 to +85 C | Industrial -40 to +100 C | Industrial -40 to +100 C |
| Speed Grade | -7 (fastest) | -7 | -7 | -7 | -7 |
Key Differentiators
- Highest density in Cyclone III 55K LE class on 780-FBGA footprint (vs EP3C40F780I7N)
- Lead-free, RoHS-compliant N-suffix finish for global market access (vs EP3C55F780I7 (non-N))
- Industrial temperature grade for harsh environments (vs EP3C55F780C7N (commercial))
- Faster speed grade -7 for high-throughput designs (vs EP3C55F780C6N (speed grade -6))
Design Notes
Decoupling is critical for Cyclone III FPGAs. Place 0.1 µF X7R ceramic capacitors within 100 mils of every VCCINT, VCCA, VCCPD, and VCCIO pin, plus a single bulk 47 µF tantalum or 100 µF aluminum polymer capacitor per voltage rail. According to the Cyclone III Device Handbook, ICCINT scales with logic utilization and clock frequency - ICCINTINOMINAL is approximately 500 mA at full utilization of 55K LEs. Inadequate decoupling causes simultaneous switching noise (SSN) and configuration failure.
Cyclone III devices use a 1.2 V core that produces moderate power dissipation. For the EP3C55F780I7N in 780-FBGA at high toggle rates (50-80% utilization at 472 MHz), package-only cooling (no external heatsink) typically suffices on a 4-layer PCB with an inner ground plane. Industrial temperature-grade operation (-40 C to +100 C junction) is the binding constraint, not steady-state power. Always verify junction temperature with the Quartus II PowerPlay estimator before sign-off.
Route configuration and clock signals first. The 780-FBGA uses 1 mm ball pitch - microvia or via-in-pad is required for inner-row balls. Use the Cyclone III pin connection guidelines to identify bank-specific I/O standards (each bank has a separate VCCIO) and keep high-speed differential pairs (LVDS TX/RX) within the same bank. JTAG chain signals (TCK, TMS, TDI, TDO) should be ESD-protected at the connector and routed with controlled impedance.
Cyclone III is a mature family with EOL notices on some variants - always verify active lifecycle status with Intel before new designs. Configuration via Active Serial (EPCS) requires a separate configuration flash - do not omit it on the BOM. The 'N' suffix indicates lead-free terminal finish required for RoHS-compliant products; non-N variants are increasingly hard to source. Power sequencing (VCCIO must precede or rise with VCCINT) must follow the datasheet sequence to avoid latch-up.
Cyclone III I/Os support LVDS up to 840 Mbps when used as transmitters. For DDR2 memory interfaces, follow the Cyclone III external memory interface guidelines - use matched trace lengths within ±50 mil and 100-ohm differential routing. SSTL18 and HSTL I/O standards require external VTT termination. The 377 user I/Os in the 780-FBGA are arranged in eight I/O banks, each with its own VCCIO rail - mix only compatible I/O standards within a bank.
Compliance Information
N-suffix indicates lead-free terminal finish per Cyclone III Device Handbook ordering information. RoHS compliant per Altera/Intel product page. AEC-Q100 not applicable - this is an FPGA, not an automotive-qualified IC.
