EP3C55U484C8N vs EP3C55U484C6N Comparison
Detailed side-by-side comparison of EP3C55U484C8N by Intel and EP3C55U484C6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C55U484C8N | EP3C55U484C6N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $119.85 | $274.06 |
| Series | Cyclone III | β |
| Family | EP3C55 | Cyclone III |
| Logic Elements | 55,856 | 55856 LE |
| Embedded Memory (bits) | 2,396,160 | β |
| Number of Logic Array Blocks (LABs) | 3,491 | β |
| Number of M9K Memory Blocks | 250 | β |
| Embedded 18x18 Multipliers | 156 | β |
| Phase-Locked Loops (PLLs) | 4 | β |
| Maximum User I/Os | 327 | β |
| Number of I/O Banks | 8 | β |
| Package | 484-UBGA (Ultra FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 484-FBGA |
| Speed Grade | 8 (commercial, fastest) | β |
| Process Technology | 60 nm low-power CMOS | 65 nm |
| Operating Temperature | 0 C to +85 C (commercial) | [DATA_NEEDED: operating temperature range] |
| Mounting Type | Surface Mount | Surface Mount |
| Lead-Free / RoHS | Compliant (per DigiKey listing) | β |
| Product Type | β | Field Programmable Gate Array (FPGA) |
| Number of Logic Cells | β | 55856 cells |
| Embedded Memory | β | 2396160 bit |
| I/O Count | β | 327 I/O |
| Core Technology Voltage | β | 1.2 V |
| JTAG LVTTL/LVCMOS Operation | β | 3.3 V, 3.0 V, 2.5 V |
| Package Code | β | FBGA |
| Terminal Count | β | 484 |
| Terminal Form | β | Ball |
| Clock Rate | β | 437.5 MHz |
| RoHS Status | β | Compliant |
| REACH Status | β | unknown |
| Automotive Qualification | β | unknown |
| Lead-Free Status | β | unknown |
| Configuration Interface | β | [DATA_NEEDED: configuration interface] |
| Maximum I/O Voltage | β | [DATA_NEEDED: maximum I/O voltage] |
| Thermal Resistance | β | [DATA_NEEDED: junction-to-ambient thermal resistance] |