EP3C55U484C6N - 55K LE Cyclone III FPGA | Intel | Embedded Systems
MPN: EP3C55U484C6N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $274.0589 | $274.06 |
| 10 | $274.0589 | $2,740.59 |
| 100 | $274.0589 | $27,405.89 |
| 500 | $274.0589 | $137,029.45 |
| 1,000 | $274.0589 | $274,058.90 |
EP3C55U484C6N Overview
An FPGA, or field-programmable gate array, is a semiconductor device containing configurable logic blocks, programmable interconnects, and memory resources. Unlike a fixed-function application-specific integrated circuit (ASIC), an FPGA can be configured after manufacturing to implement custom digital circuits. Cyclone III devices belong to Intel's programmable-logic family and occupy a tier between small CPLDs and high-density, high-power FPGAs. The broader hierarchy is FPGA, programmable logic device, digital integrated circuit, and semiconductor.
The key architectural figures are 55,856 logic elements, 327 I/O pins, 55856 cells as reported by the supplied comparison snippets, and a 484-FBGA package. The device is listed for 1.2 V core technology and 3.3-, 3.0-, and 2.5-V LVTTL/LVCMOS JTAG operation in the supplied datasheet snippet. A 65 nm process technology is also cited in the comparison results. These characteristics support moderate-to-large digital designs where configurable logic and high pin availability matter.
The device can implement parallel datapaths, control logic, protocol bridges, state machines, and digital signal-processing structures. Embedded memory can support FIFOs, lookup tables, buffers, and other data-handling functions. The 327 I/O count provides substantial connectivity for external memories, converters, sensors, and industrial buses. As a result, the FPGA is useful when a system needs hardware timing flexibility without the development cost and non-recurring engineering associated with a custom ASIC.
Typical applications include industrial automation controllers, communications-interface equipment, test and measurement systems, video and image-processing hardware, medical monitoring equipment, and aerospace or defense prototypes. The package's 484 balls provide the physical interface for these designs, while the programmable architecture allows the logic to be adapted as requirements evolve.
Designers should confirm the exact supported I/O standards, configuration interface, timing limits, and power requirements from the manufacturer datasheet before releasing a board. The provided web data does not include all of those values, so missing electrical and timing parameters are explicitly marked as data-needed. This page combines verified distributor and manufacturer-related search data with a drop-in comparison that should be validated against the original Cyclone III family documentation.
This data set preserves the values available from the supplied search results while identifying unverified parameters instead of guessing. It is intended to support component research, procurement decisions, and preliminary FPGA architecture planning; final hardware sign-off should use the complete manufacturer datasheet and the applicable Intel device documentation.
Drop-in alternatives for EP3C55U484C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C55U484C6N (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Speed Grade, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C55U484C6
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View Datasheet →EP3C55F484C7N
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View Datasheet →EP3C55F484I7N
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View Datasheet →EP3C40U484C6N
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View Datasheet →EP3C25F324C6N
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View Datasheet →EP3C55U484C6N Maximum Ratings & Electrical Characteristics
| Product Type | Field Programmable Gate Array (FPGA) |
| Family | Cyclone III |
| Logic Elements | 55856 LE |
| Number of Logic Cells | 55856 cells |
| Embedded Memory | 2396160 bit |
| I/O Count | 327 I/O |
| Core Technology Voltage | 1.2 V |
| Process Technology | 65 nm |
| JTAG LVTTL/LVCMOS Operation | 3.3 V, 3.0 V, 2.5 V |
| Package | 484-FBGA |
| Package Code | FBGA |
| Terminal Count | 484 |
| Terminal Form | Ball |
| Mounting Type | Surface Mount |
| Clock Rate | 437.5 MHz |
| RoHS Status | Compliant |
| REACH Status | unknown |
| Automotive Qualification | unknown |
| Lead-Free Status | unknown |
EP3C55U484C6N fbga Pin Configuration Guide
Pin configuration for EP3C55U484C6N (fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C55U484C6N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C55U484C6N is suitable for 6 applications: Industrial Automation Control, Communications Interface Equipment, Test and Measurement Systems, Video and Image Processing Hardware, Medical Monitoring Equipment, Aerospace and Defense Prototypes.
Industrial Automation Control
EP3C55U484C6N fits industrial automation systems that need configurable control logic, parallel processing, and extensive external connectivity. Its verified 55,856 logic elements support state machines, motion-control sequencing, protocol handling, and sensor-data processing, while 327 I/O pins help interface with encoders, actuators, safety I/O, and local communications devices. The 2,396,160-bit embedded-memory capacity can implement FIFOs and buffers for bursty machine data. The device is a surface-mount 484-FBGA component, so designers must follow the exact ball map and provide complete power, clock, configuration, and decoupling networks. Compared with a fixed controller, the FPGA allows control algorithms and interface logic to be updated in the field, but timing closure and industrial temperature qualification must be confirmed from the manufacturer documentation.
Recommended
Communications Interface Equipment
EP3C55U484C6N is suitable for communications-interface equipment that requires multiple parallel data paths and adaptable protocol logic. The 55,856 logic elements can implement framing, packet inspection, channel coding, clock-domain conversion, and traffic management, while the 327 I/O count supports multiple external transceivers, processors, memory devices, and test interfaces. Its 2,396,160 bits of embedded memory are useful for FIFOs, lookup tables, and short packet buffers. The supplied data identifies 1.2 V core technology and JTAG operation at 3.3 V, 3.0 V, and 2.5 V LVTTL/LVCMOS, but complete I/O-bank and timing limits are data-needed. Engineers should validate signal integrity, clock distribution, I/O standards, and configuration behavior against the manufacturer Cyclone III documentation before selecting the FPGA for a production communications platform.
Recommended
Test and Measurement Systems
EP3C55U484C6N can support test and measurement systems that need deterministic hardware acquisition, event sequencing, and parallel processing. Its 55,856 logic elements allow implementation of counters, trigger logic, timing generators, digital filters, and instrument-control functions. The 327 I/O pins can connect the FPGA to analog-to-digital converters, digital-to-analog converters, sensors, display controllers, and host interfaces. Embedded memory of 2,396,160 bits is sufficient for capture buffers and waveform tables when carefully partitioned. The 484-FBGA package provides a high-density surface-mount solution but demands controlled PCB routing, reference-plane design, and power integrity. The verified data does not provide the full operating-temperature range, maximum I/O voltage, or timing specifications, so those values must be confirmed before a measurement design is released.
Recommended
Video and Image Processing Hardware
EP3C55U484C6N is a plausible FPGA for video and image-processing hardware requiring parallel pixel pipelines and configurable data handling. The verified 55,856 logic elements can support image preprocessing, frame synchronization, pixel formatting, overlays, and control-plane functions, while 327 I/O pins provide connectivity to image sensors, display interfaces, memory, and host processors. The 2,396,160-bit embedded-memory capacity can be allocated to line buffers, lookup tables, and short frame buffers, although memory architecture and bandwidth are design-specific. The 1.2 V core technology and 65 nm process values are useful for initial power and density planning, but the supplied data does not establish all required timing, transceiver, I/O, or thermal parameters. A production design should therefore validate the complete Cyclone III timing model, supported I/O standards, configuration flow, and board-level signal integrity.
Recommended
Medical Monitoring Equipment
EP3C55U484C6N can be evaluated for medical monitoring equipment that requires deterministic digital acquisition, filtering, and interface expansion. The FPGA's 55,856 logic elements can implement digital filtering, data aggregation, sensor-fusion control, and communication formatting, while 327 I/O pins allow connection to acquisition circuits, memories, displays, and service interfaces. The 2,396,160-bit embedded memory supports small buffers and configuration tables, but patient-monitoring systems may require additional external memory depending on sample rate and retention requirements. The 484-FBGA package is suitable for compact assemblies when the exact footprint, assembly process, and reliability controls are approved. The verified data does not provide medical qualification, operating temperature, safety certification, or full electrical limits, so these items remain data-needed. Manufacturer documentation and applicable medical design controls must govern any final use.
Recommended
Aerospace and Defense Prototypes
EP3C55U484C6N may be considered for aerospace and defense prototypes where reconfigurable logic, high I/O connectivity, and deterministic hardware execution are valuable. Its 55,856 logic elements can support command processing, telemetry formatting, control algorithms, and interface adaptation, while 327 I/O pins provide connections to sensors, memory, converters, and supervisory circuits. The 2,396,160-bit embedded memory can hold lookup tables, buffers, and protocol state information. The 484-FBGA package is compact and surface-mount, but the verified data does not establish radiation tolerance, military temperature grade, screening level, or long-term lifecycle assurance. These qualifications are data-needed and must be verified independently. For flight or mission-critical hardware, review the complete manufacturer ordering information, package qualification, configuration security, timing, power, and reliability documentation before using this device.
Recommended
Recommended Products Summary
Engineering reference data for EP3C55U484C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C55U484C6 | EP3C55F484C7N | EP3C55F484I7N | EP3C40U484C6N |
|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 484-FBGA | 484-FBGA | 484-FBGA | BGA-484 | 484-FBGA |
Key Differentiators
- Large verified logic capacity (vs EP3C40U484C6N)
- High user-I/O count (vs EP3C25F324C6N)
- Substantial embedded-memory resource (vs EP3C55F484I7N)
Design Notes
Use the manufacturer Cyclone III power design guidance to establish the core, I/O, auxiliary, and configuration supplies. The verified data lists 1.2 V core technology and JTAG operation at 3.3 V, 3.0 V, and 2.5 V LVTTL/LVCMOS, but it does not provide supply currents, tolerances, or power-up sequencing. Place local decoupling close to the relevant power balls, keep high-current paths short, and verify startup behavior with the selected configuration scheme. Estimate power only after the complete logic-utilization and clock plan is available.
The 484-FBGA package requires board-level thermal analysis because the verified data does not include junction-to-ambient resistance, allowable junction temperature, or power consumption. Use the complete Cyclone III thermal model and the final utilization, clock, toggle-rate, and I/O-loading assumptions. Provide a continuous reference plane and sufficient thermal vias where the manufacturer package guidance permits them. Do not infer a safe dissipation limit from the package name alone.
Plan the 484-ball escape routing before schematic freeze. The verified data confirms a 484-FBGA package and 327 user I/O, but the complete ball map and bank assignments are not included in the supplied data. Follow the manufacturer land pattern, use controlled-impedance routing for high-speed interfaces, maintain solid power and ground planes, and keep clock, configuration, and sensitive I/O paths away from aggressive transitions. Verify the actual pinout from the package documentation before PCB layout.
Use the supported I/O standards and voltage levels only after checking the complete device datasheet. The supplied snippet identifies JTAG operation for 3.3 V, 3.0 V, and 2.5 V LVTTL/LVCMOS, but it does not establish all bank rules or maximum I/O voltage. Define clock domains, output loading, termination, and cross-bank constraints in the FPGA design constraints file. For high-speed external memories or converters, simulate the channel and verify setup, hold, skew, and jitter at the receiver rather than relying on a nominal clock rate.
Compliance Information
The supplied comparison data reports RoHS details for the target. REACH, AEC-Q100, lead-free, halogen-free, and conflict-minerals statuses are not explicitly provided and remain unknown.
