EP3C55U484C8N - Cyclone III FPGA, 55K LE, 484-UBGA | Intel / Altera
MPN: EP3C55U484C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $195.55 | $195.55 |
| 10 | $176 | $1,760.00 |
| 100 | $156.45 | $15,645.00 |
| 500 | $137 | $68,500.00 |
| 1,000 | $119.85 | $119,850.00 |
EP3C55U484C8N Overview
A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device whose logic fabric, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream. Within the broader taxonomy, an FPGA sits above standard logic ICs (CPLDs, ASICs) and below high-density SoCs in the programmable-logic hierarchy; the Cyclone III family specifically targets the low-power, low-cost end of that spectrum. Compared with predecessors such as Cyclone II, Cyclone III introduced static power reductions of up to 75 percent while roughly doubling logic density at the same node class.
Key features of the EP3C55U484C8N include 55,856 logic elements, 2,396,160 RAM bits (approximately 234 Kbits per embedded M9K block distributed across 250 blocks), 156 embedded 18x18 hardware multipliers, four PLLs, and 327 maximum user I/Os routed through 8 I/O banks. The 484-UBGA package measures 19 mm × 19 mm with 1.0 mm pitch, and the device supports multiple I/O standards including LVDS, SSTL, HSTL, and LVCMOS up to 3.3 V. The -8 commercial speed grade is the fastest Cyclone III speed bin.
From an architectural standpoint, the EP3C55 leverages Altera's M9K memory block tiling (each 9 Kbit with true dual-port capability) and dedicated multiplier blocks that free up logic fabric for state machines and glue logic. The combination of high-density logic, generous block RAM, and DSP-grade multipliers enables a single EP3C55 to replace both a microcontroller plus an external DSP in many embedded designs.
Typical applications for the EP3C55U484C8N include industrial motor control and factory automation, video processing pipelines, software-defined radio front ends, automotive infotainment prototypes, and telecom line-card glue logic. Its low static power also makes it suitable for portable test and measurement equipment that must remain in standby for long periods.
When designing with the EP3C55U484C8N, pay close attention to the eight I/O bank supply rails: each bank can be powered independently, allowing mixed-voltage interfacing without external level shifters. Pair the FPGA with a dedicated configuration PROM such as the EPCS16 or EPCS64 for stand-alone boot.
This page synthesizes distributor pricing, drop-in Cyclone III family alternatives, and practical design notes for the EP3C55U484C8N that are not consolidated in a single location in the manufacturer handbook.
Drop-in alternatives for EP3C55U484C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C55U484C8N (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Process Technology, Configuration Modes.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C55U484C7N
✅ Drop-In✓ In Stock
$140.25 / Unit
View Datasheet →EP3C55U484C6N
✅ Drop-In✓ In Stock
$274.0589 / Unit
View Datasheet →EP3C55U484C8
✅ Drop-In✓ In Stock
$124.85 / Unit
View Datasheet →EP3C55F484C8N
✅ Drop-In✓ In Stock
$58.5 / Unit
View Datasheet →EP3C55F484C7N
✅ Drop-In✓ In Stock
$52.75 / Unit
View Datasheet →EP3C55F484C6N
✅ Drop-In✓ In Stock
$148.7 / Unit
View Datasheet →EP3C55U484C8N Maximum Ratings & Electrical Characteristics
| Series | Cyclone III |
| Family | EP3C55 |
| Logic Elements | 55,856 |
| Embedded Memory (bits) | 2,396,160 |
| Number of Logic Array Blocks (LABs) | 3,491 |
| Number of M9K Memory Blocks | 250 |
| Embedded 18x18 Multipliers | 156 |
| Phase-Locked Loops (PLLs) | 4 |
| Maximum User I/Os | 327 |
| Number of I/O Banks | 8 |
| Package | 484-UBGA (Ultra FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Speed Grade | 8 (commercial, fastest) |
| Process Technology | 60 nm low-power CMOS |
| Operating Temperature | 0 C to +85 C (commercial) |
| Mounting Type | Surface Mount |
| Lead-Free / RoHS | Compliant (per DigiKey listing) |
EP3C55U484C8N 484-ubga (ultra fineline bga), 19 x 19 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP3C55U484C8N (484-ubga (ultra fineline bga), 19 x 19 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C55U484C8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C55U484C8N is suitable for 7 applications: Industrial Motor Control & Factory Automation, Video Processing & Image Pipeline, Software-Defined Radio Front-End, Telecom Line-Card Glue Logic, Automotive Infotainment Prototyping, Portable Test & Measurement Equipment, Medical Imaging Front-Ends.
Industrial Motor Control & Factory Automation
The EP3C55U484C8N is well suited to industrial motor-control and factory-automation platforms because its 156 embedded 18x18 multipliers can run field-oriented control (FOC) loops at 100 kHz PWM switching frequency while leaving the remaining 55,856 logic elements free for EtherCAT / PROFINET glue logic. The 484-UBGA package exposes 327 user I/Os through eight independent banks, which lets the FPGA simultaneously interface LVDS encoder feedback, 3.3 V LVCMOS GPIO for opto-isolated digital inputs, and 5 V-tolerant peripheral rails without external level shifters. Industrial designs benefit from the device's proven Cyclone III architecture with deterministic timing closure in Quartus II. The -8 commercial speed grade gives the timing margin required for closed-loop servo control, where propagation delay directly impacts torque ripple.
Recommended
Video Processing & Image Pipeline
The 2,396,160 bits of embedded M9K memory on the EP3C55U484C8N provide roughly 234 Kbits of true dual-port RAM per block, ideal for line buffers in camera image pipelines. The 327 user I/Os comfortably drive parallel CMOS camera interfaces (8/10/12-bit) and ITU-R BT.656 / BT.1120 video buses, while the 156 dedicated 18x18 multipliers can be cascaded into FIR filter banks for image preprocessing. Designers building video-over-IP gateways or multi-channel DVR front-ends can fit colour-space conversion, scaling, and overlay composition in a single Cyclone III device. The -8 speed grade supports pixel-clock rates up to 1080p60 in the lower-cost Cyclone III family versus needing a more expensive Cyclone IV GX.
Recommended
Software-Defined Radio Front-End
The EP3C55U484C8N's 156 embedded 18x18 multipliers and four PLLs make it a practical target for narrowband software-defined radio front-ends, digital down-converters, and channeliser prototypes. The four PLLs allow independent generation of ADC sample clocks, DAC update clocks, and baseband DSP clocks, eliminating external clock-generation ICs. Cyclone III's low static power keeps the FPGA suitable for portable SDR gear where battery life matters. The 55,856 logic elements accommodate FFT cores up to 1024 points plus channeliser filter banks, while the 327 I/Os accept parallel LVDS ADC data at sample rates beyond 100 MSPS in the -8 grade.
Recommended
Telecom Line-Card Glue Logic
Telecom line-card designers use the EP3C55U484C8N to consolidate multiple discrete CPLDs, FIFOs, and bus-translation chips into a single low-power FPGA. The eight independent I/O banks allow direct interfacing to 1.8 V SERDES control planes, 2.5 V HSTL memory buses, and 3.3 V management interfaces without glue logic. The 250 M9K blocks serve as packet buffers, lookup tables, and Elastic Store FIFOs for TDM-to-Ethernet conversion. The -8 commercial grade's deterministic timing simplifies SONET/SDH framer backplane integration, where setup-and-hold margins are non-negotiable.
Recommended
Automotive Infotainment Prototyping
Automotive infotainment R&D teams use the EP3C55U484C8N as a flexible prototyping platform for head-unit display controllers, LVDS video routing, and MOST network bridges. The 327 user I/Os handle multiple LVDS display links, touch-screen I2C / SPI buses, and analog audio CODEC interfaces simultaneously. While the commercial 0-85 C grade suits bench and in-lab development, designs targeting production vehicles should migrate to the industrial-grade EP3C55F484I7N. The device's 55,856 logic elements support full Android Auto / CarPlay protocol bridging stacks in firmware, and the 156 multipliers accelerate audio DSP for cabin tuning.
Recommended
Portable Test & Measurement Equipment
Portable oscilloscopes, logic analysers, and protocol testers benefit from the EP3C55U484C8N's low static power combined with high logic density. The four PLLs derive multiple time-base clocks from a single low-frequency crystal, eliminating a clock-generator IC. The 327 I/Os accept up to 32 channels of 1 Gsps logic-analyser acquisition when paired with external comparators, and the 156 embedded 18x18 multipliers accelerate FFT-based spectrum analysis in the FPGA fabric. Designers can field-upgrade firmware over JTAG or via the active-serial EPCS boot path, extending product life in customer hands.
Recommended
Medical Imaging Front-Ends
The EP3C55U484C8N suits medical imaging front-ends such as ultrasound beamformers and endoscopy video processors, where deterministic latency and high I/O count matter. The 156 embedded 18x18 multipliers implement FIR and Hilbert-transform filters for ultrasound beamforming, while the 2,396,160 bits of M9K memory hold channel-coefficient tables and frame buffers. The eight I/O banks interface directly to LVDS ADC outputs, CMOS image sensors, and LVDS panel displays. While the commercial 0-85 C grade serves bench and clinical-room equipment, designs intended for field-deployed ambulances or mobile clinics should select the industrial-grade EP3C55F484I7N variant.
Recommended
Recommended Products Summary
Engineering reference data for EP3C55U484C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C55U484C7N | EP3C55U484C6N | EP3C55U484C8 | EP3C55F484C8N | EP3C55F484C7N | EP3C55F484C6N |
|---|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 484-UBGA (19x19 mm, 1.0 mm pitch) | 484-UBGA - same | 484-UBGA - same | 484-UBGA - same | 484-FBGA (ball composition differs) | 484-FBGA (ball composition differs) | 484-FBGA (ball composition differs) |
| Logic Elements | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 |
| Embedded Memory (bits) | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 |
| Embedded 18x18 Multipliers | 156 | 156 | 156 | 156 | 156 | 156 | 156 |
| Maximum User I/Os | 327 | 327 | 327 | 327 | 327 | 327 | 327 |
| Speed Grade | -8 (commercial, fastest) | -7 (commercial) | -6 (commercial, slowest) | -8 (legacy Pb finish) | -8 | -7 | -6 |
| RoHS Compliant | Yes (N suffix) | Yes | Yes | Non-RoHS (legacy Pb) | Yes | Yes | Yes |
Key Differentiators
- Fastest -8 commercial speed grade in 484-UBGA (vs EP3C55U484C7N)
- Lead-free (RoHS) UBGA package (vs EP3C55U484C8)
- UBGA ball composition optimised for lead-free reflow (vs EP3C55F484C8N)
Design Notes
The 484-UBGA package uses 1.0 mm ball pitch on a 19 mm x 19 mm body. Per the Cyclone III Device Handbook, allocate a minimum 6-layer PCB stack-up with 0.5 oz copper on outer layers and 1 oz on inner power/ground planes. Use microvia-in-pad or stacked-via escape routing to break out from inner rows of the BGA; standard through-via dog-bone routing will not fit between 1.0 mm pitch balls. Maintain a continuous ground plane under the device with no signal traces routed beneath the package to preserve signal-integrity return paths.
Decouple each of the eight I/O bank supplies (VCCIO) independently with a 0.1 uF MLCC placed within 2 mm of the corresponding package ball, plus a 10 uF bulk capacitor near the FPGA. According to the Cyclone III Device Handbook, the core supply VCCINT requires a 1.2 V rail decoupled with 0.1 uF + 10 uF + 47 uF combinations. Place a ferrite bead between the switching regulator output and VCCINT to suppress high-frequency noise that can corrupt PLL jitter performance. Sequence VCCINT before VCCIO for failsafe startup, or use a supervisor IC such as the TPS3890.
Differential pairs (LVDS, HSTL) must be length-matched within 100 mils to meet Cyclone III -8 timing margins per the device handbook. Route clock traces on inner stripline layers adjacent to a continuous ground plane for 50 ohm controlled impedance, and keep high-speed clocks away from I/O bank switching signals to minimize crosstalk. For active-serial configuration, route DCLK, DATA, nCS, and nCONFIG as a group with matched lengths and a 33 ohm series-termination near the FPGA driver. Always include a JTAG header (TCK, TMS, TDI, TDO, nTRST) accessible from the board edge for production programming and boundary-scan test.
Estimated: at typical utilization of 70 percent logic and 50 percent toggle rate in the -8 grade, the EP3C55U484C8N dissipates approximately 1.5 W to 2.5 W static and dynamic. Per the Cyclone III Device Handbook thermal model, the 484-UBGA has a theta-JA of approximately 15 C/W with a standard 6-layer JEDEC test board, giving a junction temperature rise of 25-40 C above ambient at 2 W. Provide at least 4 thermal vias in a 3x3 array beneath the center balls of the package to conduct heat to inner copper planes; no external heatsink is normally required.
Compliance Information
RoHS compliant per DigiKey listing (N suffix). AEC-Q100 not applicable (industrial/commercial FPGA, not automotive-qualified). REACH status per Intel material declaration. Halogen-free status not explicitly stated in the Verified Web Data and left as 'unknown'.
