EP3C5U256C6N vs EP3C5U256C8N Comparison

Detailed side-by-side comparison of EP3C5U256C6N by Intel and EP3C5U256C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C5U256C6N EP3C5U256C8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $25.40 $19.85
Series Cyclone III Cyclone III
Device Family Cyclone III FPGA โ€”
Logic Elements 5,136 โ€”
Logic Array Blocks (LABs) 321 โ€”
Embedded Memory 423,936 bits โ€”
Maximum User I/Os 182 โ€”
Package 256-UBGA (Ultra FineLine BGA) 256-UBGA (Ultra FineLine BGA)
Package Body Size 14 x 14 mm โ€”
Ball Pitch 0.80 mm โ€”
Package Height 2.20 mm โ€”
Speed Grade C6 8 (commercial)
Operating Temperature Grade Commercial (0C to +85C) โ€”
Process Technology 60 nm low-power CMOS 60 nm CMOS, SRAM-based configuration
Mounting Type Surface Mount (BGA) Surface Mount
Lead Free / RoHS Yes / Compliant Lead Free, RoHS Compliant
Configuration Modes AS, PS, JTAG, Fast Passive Parallel โ€”
Family Name โ€” Cycloneยฎ III
Logic Elements (LE) โ€” 5,136
Number of CLBs โ€” 5,136
Number of Logic Cells โ€” 5,136
Total RAM Bits โ€” 423,936
Number of I/O โ€” 182
Supply Voltage โ€” 1.2 V core, 1.2-3.3 V I/O
Number of Embedded Multipliers (18x18) โ€” 46
Number of PLLs โ€” 4
Maximum Operating Frequency โ€” [DATA_NEEDED: maximum operating frequency]
Package Dimensions โ€” 14 x 14 mm, 0.8 mm ball pitch
Operating Temperature โ€” 0C to +85C (commercial, "C" suffix)

Datasheets & Resources

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