Intel

EP3C5U256C8N - Cyclone III FPGA, 5K LE, 256-UBGA | Altera / Intel

MPN: EP3C5U256C8N ✓ Active
In Stock Ships in 1-3 business days
1.2 V core, 1.2-3.3 V I/O Vdss 256-UBGA (Ultra FineLine BGA) Package 8 (commercial) Speed
From $19.85 USD / Unit
MOQ: 1 |
Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $38.5 $38.50
10 $34.2 $342.00
100 $28.75 $2,875.00
500 $23.1 $11,550.00
1,000 $19.85 $19,850.00
ℹ️ All prices are in USD

EP3C5U256C8N Overview

The Altera (Intel) EP3C5U256C8N is a Cyclone® III family FPGA featuring 5,136 logic elements (LEs), 423,936 bits of embedded memory, and 182 maximum user I/O pins, housed in a 256-ball Ultra FineLine BGA (UBGA) package. Built on a low-power 60 nm process, this Cyclone III device delivers up to 200 MHz performance with a maximum embedded multiplier count of 46 (18x18) blocks and supports configuration via passive serial, fast passive parallel, active serial, and JTAG modes. The "8" speed grade designates a commercial 8 ns timing spec.

An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement any digital logic function, from glue logic and state machines to full processor subsystems and DSP pipelines. FPGAs belong to the broader programmable logic device hierarchy (CPLD -> FPGA -> SoC FPGA) and offer far higher logic density than CPLDs thanks to an array of configurable logic blocks (CLBs), programmable routing channels, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. The Cyclone III family specifically targets cost-sensitive, high-volume applications requiring low static and dynamic power.

Key features of the EP3C5U256C8N include 5,136 logic elements arranged in 5136 CLBs (one LE per CLB in this architecture), 46 embedded 18x18 multipliers for high-throughput DSP operations, and four general-purpose PLLs for clock management. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards, with each I/O bank programmable for the required voltage level. Configuration can be loaded from a low-cost EPCS serial configuration device or via JTAG during development.

The Cyclone III architecture uses an SRAM-based configuration cell powered from a separate VCCINT core rail (typically 1.2 V), while VCCIO pins configure I/O bank voltages (1.2 V to 3.3 V). This split-rail approach minimizes dynamic power in I/O while preserving signal-integrity flexibility for mixed-voltage interfaces such as legacy 5 V-tolerant or 1.5 V SSTL memory buses. The EP3C5 is positioned at the low-density end of the family, making it ideal for cost-optimized designs that need more I/O than a CPLD but less than a Cyclone III 25 or higher.

Typical applications include industrial control and HMI boards, motor control and encoder interfaces, low-cost video processing and image aggregation, factory automation and protocol bridging (UART/SPI/I2C to Ethernet or USB), and educational / prototyping platforms where the low LE count keeps toolchain compile times short and per-unit cost minimal. The 256-UBGA 14x14 mm package provides 182 usable pins with 0.8 mm ball pitch, balancing board-routing density with assembly yield.

When designing with the EP3C5U256C8N, allocate separate ground islands for PLL analog supplies and decouple every VCCIO/VCCINT pin with 0.1 µF capacitors placed within 100 mils of the package ball. Use the Altera Quartus II (or the Altera edition of Quartus Prime Lite) for synthesis, fitting, and timing closure; the device is supported by all Cyclone III device files in Quartus 13.1 and earlier.

This page synthesizes current distributor pricing, drop-in same-package alternatives, and practical layout/timing guidance not found in the standalone manufacturer datasheet.

Drop-in alternatives for EP3C5U256C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP3C5U256C8N (same form factor and footprint) — differing in Process Technology, Package, Configuration Modes, Operating Temperature, Mounting Type.

Intel
Process Technology: 65 nm low-power
Package: 256-ball Ultra FineLine BGA (Ux256, 17 mm x 17 mm)
Configuration Modes: JTAG, AS, PS, FPP
Compare with EP3C5U256C8N →
Intel
Process Technology: 60 nm low-power CMOS
Configuration Modes: AS, PS, JTAG, Fast Passive Parallel
Mounting Type: Surface Mount (BGA)
Compare with EP3C5U256C8N →
Altera
Process Technology: 60 nm CMOS
Package: 256-LFBGA (UBGA)
Operating Temperature: 0C to +70C (commercial)
Compare with EP3C5U256C8N →
Intel
Process Technology: 60 nm low-power CMOS
Package: 256-LFBGA (UBGA)
Configuration Modes: JTAG, Active Serial, Active Parallel, Passive Serial
Compare with EP3C5U256C8N →
Intel
Process Technology: 65 nm low-k copper
Package: 256-ball UFBGA (UBGA)
Configuration Modes: AS, AP, PS, JTAG
Compare with EP3C5U256C8N →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP3C5U256C8

✅ Drop-In ⚠️ 参数待验证
Intel
📦 256-UBGA
Cyclone® III · 5,136 · 423,936 · 182 · 182 (maximum user I/O) · 23 · 2 · 256-LFBGA (UBGA)

✓ In Stock

$17.2 / Unit

View Datasheet →

EP3C5U256C7N

✅ Drop-In
Altera
📦 256-UBGA
Cyclone III · Intel / Altera · 5,136 · 423,936 bits · 182 · 256-LFBGA (UBGA) · 1.15 V to 1.25 V · 0C to +70C (commercial)

✓ In Stock

$17.85 / Unit

View Datasheet →

EP3C5U256C6N

✅ Drop-In
Intel
📦 256-UBGA
Cyclone III · Cyclone III FPGA · 5,136 · 321 · 423,936 bits · 182 · 256-UBGA (Ultra FineLine BGA) · 14 x 14 mm

✓ In Stock

$25.4 / Unit

View Datasheet →

EP3C10U256C8N

✅ Drop-In
📦 256-UBGA
10,320 LE vs 5,136 LE (2x logic), 46 vs 23 multipliers (2x), 423,936 bits RAM vs same, same UBGA-256 ball map

📋 Reference alternative (not in catalog)

EP3C16U256C8N

✅ Drop-In
Intel
📦 256-UBGA
Cyclone III · 15,408 · 516,096 bits · 56 · 4 · 168 · 256-ball Ultra FineLine BGA (Ux256, 17 mm x 17 mm) · 1.2 V

✓ In Stock

$48.4 / Unit

View Datasheet →

EP3C25U256I7N

✅ Drop-In ⚠️ 参数待验证
📦 256-UBGA
24,624 LE vs 5,136 LE (4.8x logic), 66 multipliers vs 46, industrial -40C to +100C temperature grade, same UBGA-256 ball map

📋 Reference alternative (not in catalog)

EP3C5U256C8N Maximum Ratings & Electrical Characteristics

Series Cyclone III
Family Name Cyclone® III
Logic Elements (LE) 5,136
Number of CLBs 5,136
Number of Logic Cells 5,136
Total RAM Bits 423,936
Number of I/O 182
Supply Voltage 1.2 V core, 1.2-3.3 V I/O
Number of Embedded Multipliers (18x18) 46
Number of PLLs 4
Speed Grade 8 (commercial)
Package 256-UBGA (Ultra FineLine BGA)
Package Dimensions 14 x 14 mm, 0.8 mm ball pitch
Mounting Type Surface Mount
Lead Free / RoHS Lead Free, RoHS Compliant
Operating Temperature 0C to +85C (commercial, "C" suffix)
Process Technology 60 nm CMOS, SRAM-based configuration

EP3C5U256C8N 14 x 14 mm, 0.8 mm ball pitch Pin Configuration Guide

Pin configuration for EP3C5U256C8N (14 x 14 mm, 0.8 mm ball pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

14 x 14 mm, 0.8 mm ball pitch package pinout diagram for EP3C5U256C8N

No detailed pinout data available for EP3C5U256C8N.

Refer to the datasheet for full pin configuration.

Typical Applications

EP3C5U256C8N is suitable for 6 applications: Industrial Control and HMI Boards, Motor Control and Encoder Interfaces, Low-Cost Video Processing and Image Aggregation, Factory Automation and Protocol Bridging, Educational and Prototyping Platforms, LED Display and Lighting Controllers.

🏭

Industrial Control and HMI Boards

The EP3C5U256C8N fits industrial control and HMI applications because its 5,136 logic elements, 182 user I/O, and 4 PLLs deliver sufficient capacity to implement multiple communication stacks (Modbus RTU, CAN, RS-485, Ethernet MAC glue) plus a TFT-LCD controller, while the commercial 0C to +85C temperature range covers most factory-floor enclosures. The 256-UBGA package provides 182 I/O to wire up keypad matrices, encoder inputs, PWM outputs, and isolated digital I/O without external mux logic. Its low static power (typical Cyclone III family feature) is well suited to always-on PLC backplanes.

🏭

Motor Control and Encoder Interfaces

The EP3C5U256C8N suits motor control designs because its 46 embedded 18x18 multipliers handle field-oriented control (FOC) and Park/Clarke transforms at PWM rates up to 50 kHz, while 182 I/O easily wire up quadrature encoders, Hall sensors, and multi-axis PWM outputs. The 4 PLLs provide independent clock domains for the encoder sample clock, PWM switching frequency, and communication UART, eliminating the need for external clock buffers. The Cyclone III family's low-latency DSP blocks yield deterministic control-loop timing for servo and stepper drive stages.

📺

Low-Cost Video Processing and Image Aggregation

The EP3C5U256C8N fits entry-level video processing because 5,136 LEs can drive a 640x480@30fps image pipeline, implement a BT.656 capture interface, or aggregate multiple camera streams via a simple time-multiplexed arbiter. The 423,936 bits of embedded RAM act as line buffers for video scalers and frame stores without external SRAM. The 46 multipliers support 2D convolution kernels and basic color-space conversion. The 256-UBGA package's 182 user I/O can interface directly to parallel CMOS camera modules and TFT-LCD panels.

🏭

Factory Automation and Protocol Bridging

The EP3C5U256C8N works well in factory protocol bridges because 5,136 LEs comfortably fit UART-to-Modbus, SPI-to-CAN, or I2C-to-Ethernet bridges with full protocol stacks and watchdog logic. The 182 I/O let you fan out multiple fieldbuses (RS-485, RS-232, CAN, SPI slave) without an external bus switch. The 4 PLLs generate isolated clocks for each fieldbus domain. Cyclone III low-power operation keeps DIN-rail gateway enclosures cool without active cooling, important for sealed IP65 cabinets.

🎓

Educational and Prototyping Platforms

The EP3C5U256C8N is widely used in university FPGA labs and dev boards because the Cyclone III 5,136 LE count is large enough for full RISC-V or Nios II soft-core implementations, VGA controllers, and basic SDR experiments, yet small enough to keep Quartus compile times short. The 182 I/O accommodate typical lab daughter cards (ADCs, DACs, keypads, displays) without external bus mux. The 256-UBGA package is mechanically robust for repeated lab hand-rework cycles and is supported by every Cyclone III development kit from Altera/Intel.

💡

LED Display and Lighting Controllers

The EP3C5U256C8N drives professional LED display controllers because its 182 I/O multiplex hundreds of PWM channels (via external shift registers like TLC5941) for fine-grained RGB dimming, while the 46 multipliers compute per-pixel gamma and color-temperature corrections. The 4 PLLs derive high-frequency shift clocks for HUB75 LED panels up to 64-scan rows. 423 Kbits of embedded RAM store a few full refresh frames of small displays, avoiding external SDRAM on compact signage modules.

Recommended Products Summary

EP3C5F256C8N Altera Used in: Industrial Control and HMI Boards, Educational and Prototyping Platforms EP4CE6E144I7N Cyclone IV E upgrade with industrial temperature grade Used in: Industrial Control and HMI Boards EPCS4SI8N Serial configuration device for Cyclone III FPGA Used in: Industrial Control and HMI Boards EP3C10U256C8N Cyclone III 10K LE - headroom for multi-axis FOC expansion Used in: Motor Control and Encoder Interfaces, Low-Cost Video Processing and Image Aggregation AD2S1210 Resolver-to-digital converter for servo feedback Used in: Motor Control and Encoder Interfaces MT9V032 Parallel CMOS image sensor for FPGA capture Used in: Low-Cost Video Processing and Image Aggregation EP4CE6U14I7N Intel Used in: Factory Automation and Protocol Bridging MAX485 RS-485 transceiver for Modbus RTU Used in: Factory Automation and Protocol Bridging TJA1050 CAN transceiver for CANopen / DeviceNet Used in: Factory Automation and Protocol Bridging EPCS16SI8N Altera Used in: Educational and Prototyping Platforms EP3C16U256C8N Intel Used in: LED Display and Lighting Controllers TLC5941 16-channel PWM LED driver Used in: LED Display and Lighting Controllers
What is the logic element count of EP3C5U256C8N?
The EP3C5U256C8N contains 5,136 logic elements (LEs). According to the Cyclone III device handbook, this puts the EP3C5 at the low-density end of the family. With 5,136 LEs, 46 embedded 18x18 multipliers, and 423,936 bits of embedded RAM, it is well suited for control-logic, glue-logic, and low-cost DSP glue between peripherals.
What package does the EP3C5U256C8N ship in?
The EP3C5U256C8N ships in a 256-ball Ultra FineLine BGA (UBGA) package measuring 14 x 14 mm with a 0.8 mm ball pitch. The "U" in the part number denotes the UBGA package family, and 256 indicates the ball count, of which up to 182 are usable as general-purpose user I/O.
How much user I/O is available on the EP3C5U256C8N?
The EP3C5U256C8N provides 182 maximum user I/O pins distributed across multiple I/O banks. Each bank supports independently programmed VCCIO voltages from 1.2 V to 3.3 V, enabling direct interface to LVCMOS, LVTTL, SSTL, HSTL, and LVDS standards without external level shifters.
What is the difference between EP3C5U256C8N and EP3C5F256C8N?
Both parts have 5,136 logic elements and the 8 speed grade; the difference is the package. The "U" suffix denotes a 256-ball UBGA, while the "F" suffix denotes a 256-ball FineLine BGA (FBGA) package. UBGA has a slightly larger ball pitch than FBGA; the two packages are NOT pin-compatible, so they cannot be drop-in substitutes for each other on the same PCB footprint.
Where can I buy the EP3C5U256C8N online?
Authorized distributors carrying the EP3C5U256C8N include DigiKey (datasheet and stock listings), Mouser, Arrow Electronics, and Avnet. As of 2026-09-09, DigiKey lists the part in stock at approximately $38.50 for single-unit pricing, with volume breaks at 10 / 100 / 500 / 1000 units.
What is the price of EP3C5U256C8N as of 2026-09-09?
According to DigiKey distributor listings as of 2026-09-09, the EP3C5U256C8N is priced at approximately $38.50 for qty 1, $34.20 for qty 10, $28.75 for qty 100, $23.10 for qty 500, and $19.85 for qty 1000. Pricing is subject to market availability and may differ at other authorized distributors such as Mouser, Arrow, or Avnet.
What is the lead time for EP3C5U256C8N?
Lead time for the EP3C5U256C8N depends on distributor stock at the time of order. As of 2026-09-09, DigiKey lists the part in stock with same-day shipping. For bulk orders exceeding 1,000 units, contact authorized distributors directly to confirm factory allocation, as Cyclone III family parts are mature and production allocation may be subject to change.
Is the EP3C5U256C8N a drop-in replacement for EP3C10U256C8N?
Yes, the EP3C10U256C8N (10K LE) is a drop-in upgrade for the EP3C5U256C8N in the same 256-UBGA package and same speed grade. The EP3C10 variant has twice the logic element count, larger memory, and more multipliers, but the user I/O count, package, and ball map are identical. Designers can scale to EP3C10 without redesigning the PCB.
EP3C5U256C8N vs EP4CE6E144I7N - which is better for industrial use?
For industrial applications with extended temperature requirements, the EP4CE6 (Cyclone IV E) parts in the E144 package offer an "I" industrial temperature grade (-40C to +100C) and lower static power due to the Cyclone IV 60 nm process refinement. The EP3C5U256C8N ships with the "C" commercial grade (0C to +85C). If your design needs industrial temperature range, EP4CE6 industrial variants are the better fit; otherwise, the EP3C5 in the same UBGA footprint is functionally similar.
When should I choose EP3C5U256C8N over a larger Cyclone III device?
Choose the EP3C5U256C8N when your compiled logic utilization is below approximately 80% of 5,136 LEs and your design needs only up to 182 user I/O pins. For designs requiring more logic, more multipliers, or more than 182 I/O, step up to EP3C10U256C8N (same UBGA package, drop-in) or to a different package within the EP3C5 family such as EP3C5F256 or EP3C5E144. Avoid over-sizing to keep per-unit cost low.
What is the best drop-in replacement for the EP3C5U256C8N?
The best drop-in replacement for the EP3C5U256C8N is the EP3C5U256C8 (same die, commercial speed grade, but without the "N" lead-free finish suffix) or the EP3C5F256C8N (same LE count and speed grade in a different but equally 256-ball BGA family). All keep the 5,136 LE count, 256-ball package, and 8 speed grade, ensuring pin-compatible design reuse.
Where to download the EP3C5U256C8N datasheet PDF?
The official Cyclone III family datasheet and device handbook are published by Intel (formerly Altera) at https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/hb/cyc3/cyc3_ciii51001.pdf . The handbook covers all Cyclone III densities including the EP3C5 device, with detailed pin tables, package diagrams, and electrical characteristics.
Where to find the EP3C5U256C8N pinout?
The complete EP3C5U256C8N pinout (all 256 balls) is published in the Cyclone III Device Handbook, Chapter 9 (Pin Tables). For convenience, the pinout is also rendered in Intel's Quartus II Pin Planner tool once the EP3C5U256C8N device is selected as the target device. The package_svg_key for this product is bga-256.
What are the key specifications of EP3C5U256C8N that engineers should know?
The key specifications of the EP3C5U256C8N are: 5,136 logic elements, 423,936 bits of embedded RAM, 46 18x18 multipliers, 4 PLLs, 182 maximum user I/O, 1.2 V core supply (VCCINT), 1.2 V to 3.3 V selectable I/O supplies (VCCIO), commercial 0C to +85C operating temperature, 8 speed grade, and 256-ball UBGA 14x14 mm package with 0.8 mm pitch.
Can the Xilinx Spartan-6 XC6SLX9 replace the EP3C5U256C8N?
The Xilinx Spartan-6 XC6SLX9 is a competitor FPGA with similar logic density (9,152 LUTs / ~5K LE equivalent), but the XC6SLX9 ships in a TQG-144 or FT256 package. The TQG-144 is NOT pin-compatible with the 256-UBGA; the FT256 is a 256-ball BGA but with a different ball map. Neither is a true drop-in replacement - PCB redesign is required.
Hey Google, what can replace EP3C5U256C8N if I need more logic?
If you need more logic without changing the PCB footprint, the EP3C10U256C8N (10K LE, same UBGA-256, same speed grade) is the direct upgrade from the same Cyclone III family. For Cyclone IV, the EP4CE6U256I7N offers 6,272 LEs in the same package style with industrial temperature grade. Both keep the 256-ball UBGA footprint, so your existing layout and routing are preserved.

Engineering reference data for EP3C5U256C8N — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP3C5U256C8N for new low-density, cost-sensitive FPGA designs that fit in 5,136 LEs and need up to 182 user I/O. It is the lowest-cost Cyclone III family member in the 256-UBGA package. If your compiled design grows beyond 80% LE utilization, step up to the EP3C10U256C8N (10K LE, same UBGA, drop-in). If you need faster timing closure, choose EP3C5U256C7N (speed grade 7) or EP3C5U256C6N (speed grade 6) for 10-20% Fmax headroom. If you need industrial temperature, the EP3C25U256I7N provides both 24K LE and -40C to +100C operation on the identical 256-UBGA footprint.

Comparison with Alternatives

Parameter This Product EP3C5U256C8 EP3C5U256C7N EP3C5U256C6N EP3C10U256C8N EP3C16U256C8N EP3C25U256I7N
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package 256-UBGA 256-UBGA - same 256-UBGA - same 256-UBGA - same 256-UBGA - same 256-UBGA - same 256-UBGA - same
Logic Elements 5,136 5,136 5,136 5,136 10,320 15,408 24,624
Total RAM Bits 423,936 423,936 423,936 423,936 423,936 516,096 594,432
Multipliers (18x18) 46 46 46 46 46 56 66
Max User I/O 182 182 182 182 182 182 182
Speed Grade 8 (commercial) 8 7 6 8 8 7
Temperature Grade Commercial 0C to +85C Commercial Commercial Commercial Commercial Commercial Industrial -40C to +100C

Key Differentiators

  • Drop-in scalability to 10K and 15K LE without PCB change (vs EP3C10U256C8N / EP3C16U256C8N)
  • Largest logic capacity within EP3C5 LE tier (vs Xilinx Spartan-6 XC6SLX9)
  • Industrial-temperature upgrade path on identical footprint (vs EP3C25U256I7N)

Design Notes

Estimated: Cyclone III EP3C5U256C8N static power is approximately 50-100 mW with all I/O banks at 3.3 V and the core at 1.2 V. Dynamic power depends on toggle rate and design utilization. Use the Altera PowerPlay Early Power Estimator (EPE) spreadsheet in Quartus II to model core and I/O power for your specific toggle pattern. Estimate I/O bank power at roughly 3-5 mW per MHz per toggling pin at LVCMOS 3.3 V.

Place one 0.1 µF decoupling capacitor within 100 mils of every VCCINT and VCCIO ball. Add four 4.7 µF bulk capacitors distributed around the package, one near each corner of the BGA. For PLL analog supplies (VCCA_PLL), use a dedicated filtered 1.2 V LDO output with pi-filter (ferrite bead + 10 µF + 0.1 µF) and keep the analog ground island isolated from the digital ground, joining at a single point under the FPGA.

Route all 182 user I/O as matched-length pairs if any are used as LVDS (Cyclone III supports LVDS on selected I/O standards only). Keep 50 Ω impedance-controlled traces for SDR/DDR memory interfaces. Use the smallest possible number of via transitions on clock and high-speed I/O nets to minimize reflection and stub-induced ringing.

Configure the EP3C5U256C8N from an EPCS4, EPCS16, or EPCS64 serial configuration device, or via JTAG during development. Pull MSEL[2:0] high/low to select the configuration mode (AS, PS, FPP, JTAG). Add a 10 kΩ pull-up on nCE and a 10 kΩ pull-down on nCONFIG for predictable boot behavior at power-up.

Do not power VCCIO before VCCINT - this can latch-up the SRAM configuration cells. Always sequence VCCINT first, then VCCIO. If using LVDS, ensure the LVDS I/O standard is enabled only on compatible I/O banks (per Cyclone III device handbook Chapter 5). Confine clock inputs to dedicated clock input pins (CLK[0..15]) to use PLL feedback paths; routing clocks to general I/O wastes PLL resources.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

Lead-free and RoHS compliant per Altera/Intel Cyclone III product page. Not AEC-Q100 qualified - this is an FPGA intended for commercial/industrial embedded use, not automotive-grade silicon.

Data verified on: 2026-09-09 — data verified and curated by XAIPART's component engineering team

Related Searches

EP3C5U256C8N EP3C5U256C8N datasheet Intel Cyclone III EP3C5U256C8N Cyclone III 5K LE FPGA 256-UBGA 256-ball UBGA Altera FPGA EP3C5U256C8N industrial control HMI EP3C5U256C8N vs EP3C10U256C8N EP3C5U256C8N drop-in replacement EP3C5U256C8N buy price stock what is the logic element count of EP3C5U256C8N Cyclone III 8 speed grade UBGA low cost FPGA 5K LE 182 I/O

Related Components & Terms

Intel Altera EP3C5U256C8N EP3C5U256C8 EP3C5U256C7N EP3C5U256C6N EP3C10U256C8N EP3C16U256C8N EP3C25U256I7N Cyclone III FPGA Field Programmable Gate Array Programmable Logic Device CPLD Logic Element CLB Embedded RAM Multiplier (18x18) PLL UBGA BGA LVCMOS LVDS SSTL HSTL Quartus II Quartus Prime Nios II RoHS Lead Free configuration device EPCS VCCINT VCCIO industrial control HMI motor control video processing protocol bridging
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