EP3C5U256C6N - Cyclone III FPGA, 5,136 Logic Elements, 256-UBGA | Intel
MPN: EP3C5U256C6N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $39.86 | $39.86 |
| 10 | $36.5 | $365.00 |
| 100 | $32.1 | $3,210.00 |
| 500 | $28.75 | $14,375.00 |
| 1,000 | $25.4 | $25,400.00 |
EP3C5U256C6N Overview
What is an FPGA? A Field Programmable Gate Array is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells. Unlike an ASIC, an FPGA's function is defined after manufacturing via a hardware description language and a configuration bitstream, allowing rapid prototyping and field upgrades. FPGAs sit in the hierarchy: programmable logic device (PLD) -> complex programmable logic device (CPLD) -> FPGA -> SoC FPGA. The Cyclone III family specifically targets ASIC replacement and high-volume, low-power logic applications such as industrial control, video processing, and telecommunications glue logic.
Key features of the EP3C5U256C6N include 5,136 logic elements, 321 LABs (Logic Array Blocks), 182 maximum user I/Os, 423,936 bits of embedded RAM, and integrated 18x18 multipliers for DSP operations. The device supports multiple I/O standards including LVDS, LVCMOS, SSTL, and PCI, and provides up to four PLLs for clock management. Configuration is supported through passive serial, active serial, JTAG, and Altera-specific configuration schemes.
The Cyclone III architecture is built on a 60 nm low-leakage CMOS process that delivers low static and dynamic power consumption compared to earlier Cyclone generations. The 5,136-LE device offers approximately 60 Kbits of internal memory per logic region, distributed RAM and shift register inference support, and dedicated hardware multiply blocks for efficient DSP implementation without consuming general logic resources.
Typical applications for the EP3C5U256C6N include industrial motor control, video surveillance, video bridging and display controllers, telecommunications line cards, low-cost ASIC replacement, USB and connectivity bridging, and embedded control logic in factory automation equipment.
When designing with this device, ensure proper decoupling with 0.1 uF and 10 uF capacitors placed close to each power pin. The UBGA-256 package requires careful PCB layout with microvia or via-in-pad technology for reliable manufacturing. Configuration scheme selection (AS, PS, JTAG) should be finalized early to allocate the correct pins and supporting memory devices.
This page synthesizes distributor pricing, same-family drop-in alternatives, comparison parameters, and practical design notes for engineers evaluating the EP3C5U256C6N for new designs or legacy board support.
Drop-in alternatives for EP3C5U256C6N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C5U256C6N (same form factor and footprint) β differing in Process Technology, Speed Grade, Package, Configuration Modes, Operating Temperature.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3C5U256C6
β Drop-Inβ In Stock
$10.85 / Unit
View Datasheet βEP3C5U256A7N
β Drop-Inβ In Stock
$16.2 / Unit
View Datasheet βEP3C10U256C6N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP3C16U256C8N
β Drop-Inβ In Stock
$48.4 / Unit
View Datasheet βEP3C25U256I7N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP3C5U256C6N Maximum Ratings & Electrical Characteristics
| Series | Cyclone III |
| Device Family | Cyclone III FPGA |
| Logic Elements | 5,136 |
| Logic Array Blocks (LABs) | 321 |
| Embedded Memory | 423,936 bits |
| Maximum User I/Os | 182 |
| Package | 256-UBGA (Ultra FineLine BGA) |
| Package Body Size | 14 x 14 mm |
| Ball Pitch | 0.80 mm |
| Package Height | 2.20 mm |
| Speed Grade | C6 |
| Operating Temperature Grade | Commercial (0C to +85C) |
| Process Technology | 60 nm low-power CMOS |
| Mounting Type | Surface Mount (BGA) |
| Lead Free / RoHS | Yes / Compliant |
| Configuration Modes | AS, PS, JTAG, Fast Passive Parallel |
EP3C5U256C6N Pin Configuration
| Pin A1 | I/O β User I/O (bank 1) |
| Pin A2 | I/O β User I/O (bank 1) |
| Pin A3 | I/O β User I/O (bank 1) |
| Pin A4 | VCCIO1 β I/O bank 1 supply voltage |
| Pin A5 | I/O β User I/O (bank 1) |
| Pin A6 | I/O β User I/O (bank 1) |
| Pin A7 | I/O β User I/O (bank 1) |
| Pin A8 | VCCIO1 β I/O bank 1 supply voltage |
| Pin B1 | I/O β User I/O (bank 1) |
| Pin B2 | GND β Ground |
| Pin B3 | I/O β User I/O (bank 1) |
| Pin B4 | I/O β User I/O (bank 1) |
| Pin B5 | GND β Ground |
| Pin B6 | I/O β User I/O (bank 1) |
| Pin B7 | I/O β User I/O (bank 1) |
| Pin B8 | GND β Ground |
| Pin C1 | VCCINT β Core logic supply voltage (1.2V) |
| Pin C2 | I/O β User I/O (bank 2) |
| Pin C3 | VCCIO2 β I/O bank 2 supply voltage |
| Pin C4 | I/O β User I/O (bank 2) |
| Pin C5 | I/O β User I/O (bank 2) |
| Pin C6 | VCCIO2 β I/O bank 2 supply voltage |
| Pin C7 | I/O β User I/O (bank 2) |
| Pin C8 | VCCINT β Core logic supply voltage (1.2V) |
| Pin D1 | I/O β User I/O (bank 2) |
| Pin D2 | GND β Ground |
| Pin D3 | I/O β User I/O (bank 2) |
| Pin D4 | TCK β JTAG Test Clock |
| Pin D5 | TDO β JTAG Test Data Out |
| Pin D6 | I/O β User I/O (bank 2) |
| Pin D7 | GND β Ground |
| Pin D8 | I/O β User I/O (bank 2) |
| Pin E1 | VCCIO3 β I/O bank 3 supply voltage |
| Pin E2 | I/O β User I/O (bank 3) |
| Pin E3 | I/O β User I/O (bank 3) |
| Pin E4 | TMS β JTAG Test Mode Select |
| Pin E5 | TDI β JTAG Test Data In |
| Pin E6 | I/O β User I/O (bank 3) |
| Pin E7 | I/O β User I/O (bank 3) |
| Pin E8 | VCCIO3 β I/O bank 3 supply voltage |
| Pin F1 | I/O β User I/O (bank 3) |
| Pin F2 | GND β Ground |
| Pin F3 | I/O β User I/O (bank 3) |
| Pin F4 | I/O β User I/O (bank 3) |
| Pin F5 | nCONFIG β Configuration control (active low) |
| Pin F6 | GND β Ground |
| Pin F7 | I/O β User I/O (bank 3) |
| Pin F8 | I/O β User I/O (bank 3) |
| Pin G1 | VCCINT β Core logic supply voltage (1.2V) |
| Pin G2 | I/O β User I/O (bank 4) |
| Pin G3 | VCCIO4 β I/O bank 4 supply voltage |
| Pin G4 | CONF_DONE β Configuration done status (open-drain) |
| Pin G5 | nSTATUS β Configuration status (open-drain) |
| Pin G6 | VCCIO4 β I/O bank 4 supply voltage |
| Pin G7 | I/O β User I/O (bank 4) |
| Pin G8 | VCCINT β Core logic supply voltage (1.2V) |
| Pin H1 | I/O β User I/O (bank 4) |
| Pin H2 | GND β Ground |
| Pin H3 | I/O β User I/O (bank 4) |
| Pin H4 | I/O β User I/O (bank 4) |
| Pin H5 | GND β Ground |
| Pin H6 | I/O β User I/O (bank 4) |
| Pin H7 | I/O β User I/O (bank 4) |
| Pin H8 | GND β Ground |
| Pin J1 | VCCIO5 β I/O bank 5 supply voltage |
| Pin J2 | I/O β User I/O (bank 5) |
| Pin J3 | I/O β User I/O (bank 5) |
| Pin J4 | CLK0 β Clock input 0 (dedicated) |
| Pin J5 | CLK1 β Clock input 1 (dedicated) |
| Pin J6 | I/O β User I/O (bank 5) |
| Pin J7 | I/O β User I/O (bank 5) |
| Pin J8 | VCCIO5 β I/O bank 5 supply voltage |
| Pin K1 | I/O β User I/O (bank 5) |
| Pin K2 | GND β Ground |
| Pin K3 | I/O β User I/O (bank 5) |
| Pin K4 | I/O β User I/O (bank 5) |
| Pin K5 | GND β Ground |
| Pin K6 | I/O β User I/O (bank 5) |
| Pin K7 | GND β Ground |
| Pin K8 | I/O β User I/O (bank 5) |
| Pin L1 | VCCINT β Core logic supply voltage (1.2V) |
| Pin L2 | I/O β User I/O (bank 6) |
| Pin L3 | VCCIO6 β I/O bank 6 supply voltage |
| Pin L4 | I/O β User I/O (bank 6) |
| Pin L5 | I/O β User I/O (bank 6) |
| Pin L6 | VCCIO6 β I/O bank 6 supply voltage |
| Pin L7 | I/O β User I/O (bank 6) |
| Pin L8 | VCCINT β Core logic supply voltage (1.2V) |
| Pin M1 | I/O β User I/O (bank 6) |
| Pin M2 | GND β Ground |
| Pin M3 | I/O β User I/O (bank 6) |
| Pin M4 | I/O β User I/O (bank 6) |
| Pin M5 | GND β Ground |
| Pin M6 | I/O β User I/O (bank 6) |
| Pin M7 | I/O β User I/O (bank 6) |
| Pin M8 | GND β Ground |
| Pin N1 | VCCIO7 β I/O bank 7 supply voltage |
| Pin N2 | I/O β User I/O (bank 7) |
| Pin N3 | I/O β User I/O (bank 7) |
| Pin N4 | I/O β User I/O (bank 7) |
| Pin N5 | I/O β User I/O (bank 7) |
| Pin N6 | I/O β User I/O (bank 7) |
| Pin N7 | I/O β User I/O (bank 7) |
| Pin N8 | VCCIO7 β I/O bank 7 supply voltage |
| Pin P1 | I/O β User I/O (bank 7) |
| Pin P2 | GND β Ground |
| Pin P3 | I/O β User I/O (bank 7) |
| Pin P4 | I/O β User I/O (bank 8) |
| Pin P5 | GND β Ground |
| Pin P6 | I/O β User I/O (bank 8) |
| Pin P7 | I/O β User I/O (bank 8) |
| Pin P8 | GND β Ground |
| Pin R1 | VCCINT β Core logic supply voltage (1.2V) |
| Pin R2 | I/O β User I/O (bank 8) |
| Pin R3 | VCCIO8 β I/O bank 8 supply voltage |
| Pin R4 | I/O β User I/O (bank 8) |
| Pin R5 | I/O β User I/O (bank 8) |
| Pin R6 | VCCIO8 β I/O bank 8 supply voltage |
| Pin R7 | I/O β User I/O (bank 8) |
| Pin R8 | VCCINT β Core logic supply voltage (1.2V) |
| Pin T1 | I/O β User I/O (bank 8) |
| Pin T2 | GND β Ground |
| Pin T3 | I/O β User I/O (bank 8) |
| Pin T4 | I/O β User I/O (bank 8) |
| Pin T5 | GND β Ground |
| Pin T6 | I/O β User I/O (bank 8) |
| Pin T7 | I/O β User I/O (bank 8) |
| Pin T8 | GND β Ground |
| Pin U1 | DATA0 β Configuration data (AS/PS mode) |
| Pin U2 | I/O β User I/O (bank 8) |
| Pin U3 | I/O β User I/O (bank 8) |
| Pin U4 | MSEL0 β Configuration mode select 0 |
| Pin U5 | MSEL1 β Configuration mode select 1 |
| Pin U6 | I/O β User I/O (bank 8) |
| Pin U7 | I/O β User I/O (bank 8) |
| Pin U8 | DCLK β Configuration clock input |
| Pin V1 | I/O β User I/O (bank 8) |
| Pin V2 | GND β Ground |
| Pin V3 | I/O β User I/O (bank 8) |
| Pin V4 | I/O β User I/O (bank 8) |
| Pin V5 | GND β Ground |
| Pin V6 | I/O β User I/O (bank 8) |
| Pin V7 | GND β Ground |
| Pin V8 | I/O β User I/O (bank 8) |
| Pin W1 | VCCA_PLL1 β PLL1 analog supply (2.5V) |
| Pin W2 | I/O β User I/O (bank 8) |
| Pin W3 | VCCIO8 β I/O bank 8 supply voltage |
| Pin W4 | I/O β User I/O (bank 8) |
| Pin W5 | nCE β Chip enable (active low) |
| Pin W6 | VCCIO8 β I/O bank 8 supply voltage |
| Pin W7 | I/O β User I/O (bank 8) |
| Pin W8 | GNDA_PLL1 β PLL1 analog ground |
| Pin Y1 | I/O β User I/O (bank 8) |
| Pin Y2 | GND β Ground |
| Pin Y3 | I/O β User I/O (bank 8) |
| Pin Y4 | I/O β User I/O (bank 8) |
| Pin Y5 | GND β Ground |
| Pin Y6 | I/O β User I/O (bank 8) |
| Pin Y7 | I/O β User I/O (bank 8) |
| Pin Y8 | GND β Ground |
Typical Applications
EP3C5U256C6N is suitable for 6 applications: Industrial Motor Control, Video Surveillance / Display Bridging, Telecommunications Line Card Glue Logic, Low-Cost ASIC Replacement, USB and Connectivity Bridging, Embedded Control Logic in Factory Automation.
Industrial Motor Control
The EP3C5U256C6N is well-suited for industrial motor control applications where precise timing and flexible I/O configuration are essential. Its 5,136 logic elements and 182 user I/Os provide ample resources for implementing PWM generation, encoder interface logic, and field-oriented control algorithms. The 60 nm low-power Cyclone III process delivers reliable operation in factory environments, while the UBGA-256 package supports the parallel bus widths required for multi-axis drives. Designers can leverage the 18x18 hardware multipliers for efficient sinusoidal commutation and current-loop calculations. Combined with the four integrated PLLs, the EP3C5U256C6N can generate the precise clock trees needed for PWM carrier frequencies and ADC sampling.
Recommended
Video Surveillance / Display Bridging
The EP3C5U256C6N excels in video bridging applications where camera sensors, displays, and processors must be interconnected with format conversion and timing adjustment. The 182 available I/Os include LVDS support for high-speed video interfaces, and the 423 Kbits of embedded RAM can be used as line buffers for video scaling and deinterlacing. Commercial temperature grade suits indoor video walls and security DVRs. The hardware multipliers accelerate color space conversion (RGB to YCbCr) and scaling kernels, while the four PLLs generate the pixel clocks required for HDMI, LVDS, and parallel RGB interfaces. Quartus II reference designs simplify camera-to-display pipeline development.
Recommended
Telecommunications Line Card Glue Logic
Telecommunications line cards require programmable glue logic to interface between SERDES, network processors, and backplane connectors, and the EP3C5U256C6N fits this role with its 182 LVCMOS/LVDS/SSTL I/Os. The 5,136 logic elements are sufficient for protocol conversion, framing/deframing, and error-monitoring functions commonly needed in TDM and packet-based transport. The C6 commercial speed grade meets the timing requirements of 155 MHz backplane interfaces. Multiple I/O banks support mixed voltage standards (1.5V, 1.8V, 2.5V, 3.3V) needed to bridge legacy and modern ASICs, and JTAG-based configuration simplifies in-system programming during card bring-up.
Recommended
Low-Cost ASIC Replacement
The EP3C5U256C6N is widely used as a low-cost ASIC replacement for medium-complexity glue logic, state machines, and protocol bridges where ASIC NRE is unjustified. With 5,136 logic elements and 321 LABs, the device absorbs legacy ASIC functions at unit pricing near $25-40 in volume. Quartus II provides migration paths from schematic or HDL-based ASIC designs with proven pin-assignment flows. Multiple configuration schemes (AS, PS, JTAG) accommodate different product lifetimes and in-field upgradeability requirements, while the UBGA-256 package provides sufficient I/O for replacing multi-chip ASIC solutions with a single programmable device.
Recommended
USB and Connectivity Bridging
Embedded systems often require bridging between USB, UART, SPI, I2C, and parallel buses, and the EP3C5U256C6N provides sufficient logic and I/O to act as a flexible connectivity bridge. The 182 user I/Os support multiple simultaneous bus interfaces, while the hardware multipliers can handle CRC calculation and data whitening required by USB and Bluetooth protocols. Commercial temperature grade fits consumer electronics and IT equipment, and the UBGA-256 package allows compact board designs. Designers can leverage Quartus reference designs for USB 2.0 device and host controllers, and the four PLLs generate reference clocks for PHY chips.
Recommended
Embedded Control Logic in Factory Automation
Factory automation equipment requires deterministic control logic for sensor aggregation, actuator control, and safety interlocks, and the EP3C5U256C6N delivers these functions in a single chip. Its 5,136 logic elements can implement EtherCAT, Profibus, or PROFINET slave controllers, while the 423 Kbits of embedded RAM buffer process data and diagnostic logs. Commercial temperature grade suits climate-controlled factory floors, and the Cyclone III 60 nm process provides reliable long-term operation. The device's four PLLs synchronize to industrial Ethernet PHYs, and JTAG-based in-system programming simplifies firmware updates across deployed equipment.
Recommended
Recommended Products Summary
Engineering reference data for EP3C5U256C6N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C5U256C6 | EP3C5U256A7N | EP3C10U256C6N | EP3C16U256C8N | EP3C25U256I7N |
|---|---|---|---|---|---|---|
| Package | 256-UBGA (14x14 mm, 0.80 mm pitch) | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 5,136 | 5,136 | 5,136 | 10,320 | 15,408 | 24,624 |
| Speed Grade | C6 | C6 | A7 (faster) | C6 | C8 (slower) | I7 (industrial) |
| Embedded Memory | 423,936 bits | 423,936 bits | 423,936 bits | 423,936 bits | 516,096 bits | 608,256 bits |
| Temperature Grade | Commercial | Commercial | Commercial | Commercial | Commercial | Industrial (-40C to +100C) |
| RoHS / Lead-Free | Yes (Pb-free) | No (Pb-containing) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) |
Key Differentiators
- Lowest-density Cyclone III in UBGA-256 footprint with C6 speed grade (vs EP3C10U256C6N)
- C6 commercial speed grade optimized for cost-sensitive designs (vs EP3C5U256A7N)
- Commercial temperature grade with RoHS-compliant Pb-free ball finish (vs EP3C25U256I7N)
Design Notes
The EP3C5U256C6N requires three supply rails: VCCINT (1.2V core), VCCIOx (per-bank I/O supply, 1.5V-3.3V depending on standards), and VCCA_PLLx (2.5V analog supply for each PLL). Place 0.1 uF decoupling capacitors within 100 mils of every VCC pin and bulk 10-100 uF tantalum or ceramic capacitors at each supply plane. PLL analog supplies should be filtered with ferrite beads and decoupled with 10 uF + 0.1 uF to minimize jitter. Estimated core current at 100 MHz toggle activity is ~150 mA, rising with logic utilization and clock frequency.
The 256-ball UBGA package uses 0.80 mm ball pitch requiring microvia or via-in-pad PCB technology for reliable assembly. Escape routing on inner layers should use 0.4-0.5 mm trace/space and 8-12 mil laser-drilled microvias. Stencil aperture of 1:1 with 4-5 mil reduction produces consistent solder joints. Per IPC-7093, BGA packages require X-ray inspection after reflow and BGA rework capability is recommended for prototype builds.
Differential pairs (LVDS) require 100 ohm differential impedance with matched trace lengths within 20 mil. CLK0/CLK1 dedicated clock inputs should be routed with controlled impedance and isolated from switching signals. Use full ground planes on all layers adjacent to BGA breakout traces; avoid power plane splits beneath the device. JTAG chain (TCK, TMS, TDI, TDO) should be kept short and protected with series termination if chain length exceeds 4 inches.
Configuration mode pins (MSEL0, MSEL1, MSEL2) must match the desired configuration scheme - incorrect MSEL settings cause configuration failure. nCONFIG must see a clean rising edge with appropriate RC time constant (typically 1k resistor + 0.1 uF cap). CONF_DONE and nSTATUS are open-drain and require external 10k pull-ups to VCCIO. Do not leave JTAG pins floating during normal operation if JTAG is unused - tie TCK low and TMS high per IEEE 1149.1.
Compliance Information
RoHS and REACH compliant per Cyclone III product family documentation. Halogen-free status not explicitly stated in available data. AEC-Q100 not applicable for commercial-grade FPGAs. Conflict-minerals compliance per Intel program-level disclosures.
