EP3C5U256C8 vs EP3C5U256A7N Comparison
Detailed side-by-side comparison of EP3C5U256C8 by Intel and EP3C5U256A7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C5U256C8 | EP3C5U256A7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $17.20 | $16.20 |
| Series | Cycloneยฎ III | Cyclone III |
| Logic Elements | 5,136 | 5,136 LE |
| Total Memory Bits | 423,936 | โ |
| Number of Logic Array Blocks (LABs) | 182 | โ |
| Number of I/O Pins | 182 (maximum user I/O) | โ |
| Embedded 18x18 Multipliers | 23 | โ |
| PLLs | 2 | โ |
| Package | 256-LFBGA (UBGA) | โ |
| Package Code | LFBGA-256, 17x17 mm | โ |
| Speed Grade | 8 (commercial) | -7 |
| Operating Temperature | 0C to +85C (commercial grade) | โ |
| Core Voltage | 1.0 V to 1.2 V (1.2 V nominal) | โ |
| I/O Voltage Support | LVDS, LVCMOS, SSTL, HSTL | โ |
| Configuration Modes | JTAG, Active Serial, Active Parallel, Passive Serial | โ |
| Mounting Type | Surface Mount (BGA) | โ |
| RoHS Status | Compliant | Compliant |
| Process Technology | 60 nm low-power CMOS | โ |
| Embedded Memory | โ | 414 kbit (423,936 bits) |
| Number of I/Os | โ | 182 |
| Operating Supply Voltage (Core) | โ | 1.15 V to 1.25 V |
| Mounting Style | โ | SMD/SMT |
| Package / Case | โ | BGA-256 (U256 Ultra FineLine) |
| Packaging | โ | Tray |
| Minimum Operating Temperature | โ | -40 C |
| Maximum Operating Temperature | โ | +125 C (Automotive grade) |
| Temperature Grade | โ | Automotive |
| Adaptive Logic Modules (ALMs) | โ | [DATA_NEEDED: ALM count] |
| Embedded Multipliers (18x18) | โ | [DATA_NEEDED: 18x18 multiplier count] |
| Number of PLLs | โ | 4 |
| Process Node | โ | 60 nm low-power CMOS |