Intel

EP3C5U256A7N - Cyclone III FPGA 5K LE 256-BGA | Intel / Altera

MPN: EP3C5U256A7N βœ“ Active
In Stock Ships in 1-3 business days
1.15 V to 1.25 V Vdss BGA-256 (U256 Ultra FineLine) Package -7 Speed 414 kbit (423,936 bits) Memory
From $16.2 USD / Unit
MOQ: 1 |
Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $28.5 $28.50
10 $25.4 $254.00
100 $21.8 $2,180.00
500 $18.95 $9,475.00
1,000 $16.2 $16,200.00
ℹ️ All prices are in USD

EP3C5U256A7N Overview

The Intel (formerly Altera) EP3C5U256A7N is a low-power Cyclone III Field-Programmable Gate Array (FPGA) with 5,136 logic elements, 423,936 embedded memory bits, and 182 user I/Os, housed in a 256-ball Ultra FineLine BGA (U256) package. The device targets cost-sensitive, high-volume applications where designers need programmable logic, embedded memory, and DSP blocks without the cost of a high-end FPGA.

An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs / ALMs), programmable interconnect, and I/O cells, all of which can be reconfigured by the designer after manufacture. FPGAs sit between ASICs (custom silicon) and general-purpose processors in the hierarchy: IC -> programmable logic -> FPGA. Cyclone III devices are fabricated on a 60 nm low-power CMOS process, giving them a low static power footprint ideal for battery-powered and thermally constrained systems.

Key features include 5,136 logic elements, 423,936 bits of embedded RAM (M9K blocks), 23 embedded 18x18 multipliers for DSP, four general-purpose PLLs, and a maximum user I/O count of 182. The device operates from a 1.15 V to 1.25 V core supply with hot-socketing support, allowing live insertion into a powered backplane. Speed grade -7 places this part in the mid-speed bin of the Cyclone III family, suitable for designs targeting up to approximately 200 MHz fabric performance.

Typical applications include industrial motor control, video processing bridges, low-cost software-defined radio front-ends, LED video walls, and consumer electronics glue logic. Designers migrating from CPLDs gain thousands of additional logic elements and embedded multiplier blocks, enabling the integration of DSP and soft-core processors such as Nios II on a single device.

When designing with this part, ensure decoupling capacitors are placed close to every VCCINT and VCCIO pin, and follow Intel's PCB layout guidelines for BGA fan-out to maintain signal integrity on DDR/QSPI memory interfaces. Configuration can be sourced from an external flash, JTAG, or Altera EPCS serial configuration device.

This page consolidates distributor stock, same-family drop-in alternatives, and practical design notes not collected in a single place elsewhere, giving engineers a faster path from specification to BOM decision.

Drop-in alternatives for EP3C5U256A7N β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP3C5U256A7N (same form factor and footprint) β€” differing in Package, Process Technology, Configuration Modes, Operating Temperature, Speed Grade.

Altera
Package: 256-FBGA (17 x 17 mm)
Process Technology: 65 nm CMOS
Configuration Modes: AS, PS, JTAG
Compare with EP3C5U256A7N β†’
Intel
Package: 256-ball FBGA (FineLine BGA), 17 x 17 mm, 1 mm pitch
Configuration Modes: Serial, Parallel, JTAG, AS, PS
Operating Temperature: 0 C to +85 C (commercial "C6" speed grade)
Compare with EP3C5U256A7N β†’
Intel
Package: 256-LBGA (FineLine BGA, 17x17 mm)
Process Technology: 65 nm low-power CMOS
Configuration Modes: JTAG, AS, AP, PS
Compare with EP3C5U256A7N β†’
Altera
Package: 256-ball FineLine BGA (FBGA-256)
Process Technology: 65 nm CMOS, SRAM-based
Configuration Modes: AS, PS, JTAG, Fast Passive Parallel
Compare with EP3C5U256A7N β†’
Intel
Speed Grade: 7 (per -7 order code)
Compare with EP3C5U256A7N β†’
Intel
Package: 256-FBGA (FineLine BGA)
Process Technology: TSMC 65nm low-power
Configuration Modes: Active Serial, Passive Serial, JTAG, FPP
Compare with EP3C5U256A7N β†’
Altera
Package: 256-UBGA (U256, FineLine BGA)
Speed Grade: 6 (commercial)
Compare with EP3C5U256A7N β†’
Intel
Package: 256-UBGA (Ultra FineLine BGA)
Process Technology: 60 nm low-power CMOS
Configuration Modes: AS, PS, JTAG, Fast Passive Parallel
Compare with EP3C5U256A7N β†’
Altera
Package: 256-UBGA (Ultra FineLine BGA)
Process Technology: 65 nm low-k CMOS
Speed Grade: -7 (commercial)
Compare with EP3C5U256A7N β†’
Altera
Package: 256-LFBGA (UBGA)
Process Technology: 60 nm CMOS
Operating Temperature: 0C to +70C (commercial)
Compare with EP3C5U256A7N β†’
Intel
Package: 256-LFBGA (UBGA)
Process Technology: 60 nm low-power CMOS
Configuration Modes: JTAG, Active Serial, Active Parallel, Passive Serial
Compare with EP3C5U256A7N β†’
Intel
Package: 256-ball UFBGA (UBGA)
Process Technology: 65 nm low-k copper
Configuration Modes: AS, AP, PS, JTAG
Compare with EP3C5U256A7N β†’

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

EP3C5F256A7N

βœ… Drop-In
Altera
πŸ“¦ BGA-256 (F256)
Cyclone III Β· Cyclone III Β· 5,136 Β· 321 Β· 423,936 Β· 23 Β· 182 Β· 1.2 V

βœ“ In Stock

$24.4 / Unit

View Datasheet β†’

EP3C5F256C7N

βœ… Drop-In
Intel
πŸ“¦ BGA-256 (F256)
Cyclone III Β· FPGA - Field Programmable Gate Array Β· 5,136 Β· 182 Β· 423,936 bits (414 Kbit) Β· 23 Β· 46 Β· 182

βœ“ In Stock

$14.2 / Unit

View Datasheet β†’

EP3C5F256C8N

βœ… Drop-In
Altera
πŸ“¦ BGA-256 (F256)
Cyclone III Β· FPGA (Field-Programmable Gate Array) Β· 5,136 Β· 423,936 bits Β· 23 Β· 182 Β· 4 Β· 256-ball FineLine BGA (FBGA-256)

βœ“ In Stock

$19.85 / Unit

View Datasheet β†’

EP3C5F256I7N

βœ… Drop-In
Intel
πŸ“¦ BGA-256 (F256)
Cyclone III Β· 5,136 Β· 423,936 bits Β· 26 Β· 2 Β· 182 Β· 256-FBGA (FineLine BGA) Β· -40C to +125C (Industrial)

βœ“ In Stock

$24 / Unit

View Datasheet β†’

EP3C5F256C6N

βœ… Drop-In
Intel
πŸ“¦ BGA-256 (F256)
Cyclone III Β· EP3C5 Β· 5136 Β· 182 (per DigiKey listing) Β· 423936 Β· 23 Β· 2 Β· 182

βœ“ In Stock

$18.85 / Unit

View Datasheet β†’

EP3C5F256I7

βœ… Drop-In
Intel
πŸ“¦ BGA-256 (F256)
Cyclone III Β· FPGA (Field Programmable Gate Array) Β· 5136 Β· 423936 bits Β· 182 Β· 256-LBGA (FBGA-256) Β· Square Β· 256

βœ“ In Stock

$22.36 / Unit

View Datasheet β†’

EP3C5U256A7N Maximum Ratings & Electrical Characteristics

Series Cyclone III
Logic Elements 5,136 LE
Embedded Memory 414 kbit (423,936 bits)
Number of I/Os 182
Operating Supply Voltage (Core) 1.15 V to 1.25 V
Mounting Style SMD/SMT
Package / Case BGA-256 (U256 Ultra FineLine)
Packaging Tray
Minimum Operating Temperature -40 C
Maximum Operating Temperature +125 C (Automotive grade)
Temperature Grade Automotive
Number of PLLs 4
Process Node 60 nm low-power CMOS
Speed Grade -7
RoHS Status Compliant

EP3C5U256A7N bga-256 (u256 ultra fineline) Pin Configuration Guide

Pin configuration for EP3C5U256A7N (bga-256 (u256 ultra fineline) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

bga-256 (u256 ultra fineline) package pinout diagram for EP3C5U256A7N

No detailed pinout data available for EP3C5U256A7N.

Refer to the datasheet for full pin configuration.

Typical Applications

EP3C5U256A7N is suitable for 6 applications: Industrial Motor Control, Video Format Conversion / Display Bridge, Low-Cost Software-Defined Radio Front End, LED Video Wall Controller, Consumer Electronics Glue Logic, Automotive Infotainment and Telematics.

🏭

Industrial Motor Control

The EP3C5U256A7N is a strong fit for industrial motor control thanks to its 5,136 logic elements, 23 embedded 18x18 multipliers, and four general-purpose PLLs that can synthesize the precise PWM frequencies needed for field-oriented control (FOC). Position feedback from a QEI encoder and three-phase current sensing can be sampled by the FPGA, processed in hardware, and used to generate center-aligned PWM outputs for a three-phase inverter. Compared with a microcontroller, the FPGA delivers deterministic sub-microsecond loop times which directly improve torque ripple and acoustic noise in AC drives.

πŸ“Ί

Video Format Conversion / Display Bridge

The EP3C5U256A7N is well suited for video format conversion between parallel ITU-R BT.656, LVDS, and HDMI-derived interfaces because the 414 kbit of embedded M9K RAM can absorb a full line of video at common resolutions. Designers can implement color-space conversion, scaling, and deinterlacing in fabric while consuming less than 70% of the device's logic resources. The 182 user I/Os provide ample headroom for 24-bit parallel RGB plus control signals and I2C for display configuration.

🌐

Low-Cost Software-Defined Radio Front End

The EP3C5U256A7N can implement narrow-band SDR front-ends for amateur radio, AIS marine receivers, and industrial telemetry because its 18x18 multipliers and M9K blocks are sized for small FFTs (256-1024 points) at IF sample rates. The four PLLs generate the precise sample clocks needed for direct conversion of HF and VHF signals. Total BOM cost stays low because the FPGA replaces a chain of op-amp filters and a dedicated DSP chip.

πŸ’‘

LED Video Wall Controller

Driving large LED video walls requires many high-speed parallel data lines, which the EP3C5U256A7N provides via 182 user I/Os. Each output can be paired with an external LED driver to control 16 channels of constant-current PWM, and the embedded M9K memory stores gamma correction tables and refresh buffers. Fabric-based logic also handles HUB75 protocol generation, refresh timing, and color-depth dithering without taxing a small microcontroller.

πŸ“±

Consumer Electronics Glue Logic

In consumer products, the EP3C5U256A7N replaces multiple CPLDs and discrete logic by integrating I2C/SPI/UART bridges, key-scan controllers, IR remote decoders, and power-sequencing logic on one device. The 1.2 V core plus hot-socketing support enables live insertion into docked products, and the small BGA package fits behind a connector. Power consumption is low enough to fit in a battery-powered product envelope.

πŸš—

Automotive Infotainment and Telematics

With its automotive temperature grade (-40 C to +125 C), the EP3C5U256A7N is qualified for cabin-mounted infotainment, CAN/LIN gateway, and telematics modules. The Cyclone III family has been deployed across automotive Tier-1 supply chains for years, so design collateral and software libraries (including Nios II) are mature. Logic capacity is sufficient for audio routing, Bluetooth baseband glue, and small vision preprocessing tasks at the edge.

Recommended Products Summary

IRF7507 Half-bridge MOSFET for inverter output stage Used in: Industrial Motor Control ACS712 Current sensor for FOC feedback Used in: Industrial Motor Control ADV7123 Video DAC for analog RGB output Used in: Video Format Conversion / Display Bridge TFP401 DVI/HDMI receiver bridge Used in: Video Format Conversion / Display Bridge AD9854 Direct digital synthesizer for local oscillator Used in: Low-Cost Software-Defined Radio Front End AD8367 Variable gain amplifier for AGC Used in: Low-Cost Software-Defined Radio Front End MBI5024 16-channel LED driver for HUB75 panels Used in: LED Video Wall Controller SN65HVDA100 CAN transceiver for panel status reporting Used in: LED Video Wall Controller PCA9306 I2C level translator companion Used in: Consumer Electronics Glue Logic MAX3232 RS-232 line driver for UART extension Used in: Consumer Electronics Glue Logic TJA1050 CAN transceiver for vehicle network Used in: Automotive Infotainment and Telematics BCM89610 Automotive Ethernet PHY Used in: Automotive Infotainment and Telematics
What is the logic element count of EP3C5U256A7N?
The EP3C5U256A7N contains 5,136 logic elements in the Cyclone III architecture. According to the Intel Cyclone III device handbook, this places the device in the lowest-density position of the Cyclone III family, suitable for control-plane glue logic, simple state machines, and small DSP pipelines rather than high-density data-path designs.
How much embedded memory does EP3C5U256A7N have?
The EP3C5U256A7N integrates 423,936 bits of embedded RAM (414 kbit) distributed across M9K memory blocks. This is sufficient for line buffers in video bridges, FFT working memory, and small CPU scratchpad RAM for Nios II soft-core designs without needing an external SRAM.
How many user I/O pins does EP3C5U256A7N provide?
The EP3C5U256A7N provides 182 user I/O pins in the 256-ball U256 BGA package. Some BGA balls are dedicated to power, ground, and configuration, leaving 182 general-purpose I/Os that can be configured as LVDS, LVTTL, LVCMOS, or SSTL interfaces.
What is the core voltage of EP3C5U256A7N?
The EP3C5U256A7N operates from a 1.15 V to 1.25 V VCCINT core supply. The 1.2 V rail should be generated by a low-noise LDO or DC-DC converter with at least 500 mA capability; Intel recommends decoupling every power pin with 0.1 uF and 10 uF capacitors.
Is EP3C5U256A7N RoHS compliant?
Yes. The EP3C5U256A7N is RoHS compliant per the Intel product page. It is also lead-free (Pb-free) and supports the higher 125 C automotive temperature grade, although automotive qualification is part-specific - consult the ordering code datasheet for the exact AEC-Q100 status.
Where can I buy EP3C5U256A7N online?
You can buy the EP3C5U256A7N from authorized distributors such as DigiKey, Mouser, Arrow, and Avnet. As of 2026-09-09, distributor stock is variable due to the device's mature lifecycle; check distributor real-time inventory for current qty-1 unit price and lead time, and request a quote for higher volume.
What is the lead time for EP3C5U256A7N?
Lead time for EP3C5U256A7N is typically 8 to 14 weeks when ordered from the factory, but franchised distributors like DigiKey and Mouser often ship from local stock on the same day. As of 2026-09-09, confirm lead time at order entry because Cyclone III is a mature node.
Is EP3C5U256A7N in stock at major distributors?
Stock status changes daily. As of 2026-09-09, the EP3C5U256A7N shows limited stock at major distributors because the device is in a mature phase of the Cyclone III lifecycle. Use Octopart to compare real-time stock across DigiKey, Mouser, Arrow, and Avnet before placing an order.
What is the difference between EP3C5U256A7N and EP3C5F256A7N?
The EP3C5U256A7N uses the U256 Ultra FineLine BGA package while the EP3C5F256A7N uses the F256 FineLine BGA package. Both devices contain 5,136 logic elements and 414 kbit of memory, but the F256 version typically offers slightly higher I/O count and different ball mapping. They are not drop-in replacements because the ball-out differs between U256 and F256.
EP3C5U256A7N vs EP3C55U484I7N - which is better for higher-density logic?
The EP3C55U484I7N contains approximately 55,000 logic elements versus 5,136 in the EP3C5U256A7N, making the EP3C55 the right choice when you need ten times more logic capacity. However, the EP3C55U484I7N uses a 484-ball BGA package, which is not pin-compatible with the 256-ball EP3C5U256A7N and requires a different PCB layout.
When should I choose EP3C5U256A7N over a Cyclone IV or Cyclone V device?
Choose EP3C5U256A7N when cost is the primary driver and your design fits within 5,136 logic elements, 414 kbit of memory, and 182 I/Os. Cyclone IV adds a transceiver option, and Cyclone V offers a Cortex-A9 hard-core SoC variant, but both cost more. For new designs with no cost pressure, Cyclone V is recommended; for cost-sensitive mature designs, Cyclone III remains viable.
What is the best drop-in replacement for EP3C5U256A7N?
The closest drop-in replacements are other Cyclone III EP3C5 devices in the same U256 BGA package, such as EP3C5F256A7N (different ball mapping, requires PCB review) or other speed grades of EP3C5 in U256. For full pin compatibility, choose another EP3C5 device ordered with the same U256 package code; cross-package alternatives require PCB redesign and are not drop-in.
Can EP3C5E144A7N replace EP3C5U256A7N?
The EP3C5E144A7N is NOT a drop-in replacement for the EP3C5U256A7N. Both contain 5,136 logic elements, but the EP3C5E144 uses a 144-pin EQFP package with only about 94 user I/Os, while the EP3C5U256A7N uses a 256-ball BGA with 182 I/Os. Choosing the E144 would force a full PCB redesign.
Where to download EP3C5U256A7N datasheet PDF?
The official Cyclone III device datasheet is available on the Intel FPGA website at intel.com under the Cyclone III documentation tab. Search for the document titled 'Cyclone III Device Handbook' which contains the electrical characteristics, pin-out, and configuration specifications for the EP3C5 family including the EP3C5U256A7N.
Where to find EP3C5U256A7N pinout?
The pinout for EP3C5U256A7N is in the Cyclone III device handbook published by Intel. The U256 BGA ball map is in the 'Package Information' chapter. You can also import the pinout into Quartus II or Intel Quartus Prime via the device selector once you create a new project targeting the EP3C5U256A7N.

Engineering reference data for EP3C5U256A7N β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the EP3C5U256A7N when your design needs up to 5,136 logic elements and 182 I/Os in a compact 256-ball BGA, with operation up to 125 C for automotive or industrial environments. Choose the EP3C5F256A7N if you need the same logic capacity but in the FineLine BGA pin-out - check PCB compatibility first because the ball maps differ. Choose the EP3C5F256C7N or C8N for cost-sensitive commercial designs that do not require automotive qualification. Choose the EP3C55U484I7N when you need roughly 10x the logic capacity for video processing or complex state machines, accepting a larger 484-ball BGA footprint. All parts share the same Cyclone III architecture and Quartus Prime tool chain.

Comparison with Alternatives

Parameter This Product EP3C5F256A7N EP3C5F256C7N EP3C5F256C8N EP3C5F256I7N
Brand Intel Intel Intel Intel Intel
Package BGA-256 (U256) BGA-256 (F256) BGA-256 (F256) BGA-256 (F256) BGA-256 (F256)
Logic Elements 5,136 LE 5,136 LE 5,136 LE 5,136 LE 5,136 LE
Embedded Memory 414 kbit 414 kbit 414 kbit 414 kbit 414 kbit
Number of I/Os 182 182 182 182 182
Speed Grade -7 (A7) -7 (A7) -7 (C7) -8 (C8) -7 (I7)
Temperature Grade Automotive Automotive Commercial Commercial Industrial
Core Voltage 1.15 V to 1.25 V 1.15 V to 1.25 V 1.15 V to 1.25 V 1.15 V to 1.25 V 1.15 V to 1.25 V

Key Differentiators

  • Lowest-density Cyclone III device with full 256-ball BGA (vs EP3C55U484I7N)
  • Automotive temperature grade in a small BGA (vs EP3C5F256C7N)
  • Ultra FineLine BGA package variant (vs EP3C5E144A7N)

Design Notes

Decouple every VCCINT pin with a 0.1 uF X7R ceramic capacitor placed within 5 mm of the BGA ball, and add four 10 uF bulk capacitors distributed around the package perimeter. VCCIO banks can be supplied at 1.2 V to 3.3 V independently to match the connected memory or peripheral logic. Intel's Cyclone III handbook recommends powering VCCINT last in the sequence to avoid latch-up during hot-socketing events.

The U256 BGA uses a 1 mm pitch ball array. Use a 4-6 layer PCB with at least one continuous ground plane directly under the FPGA to control return paths for high-speed LVDS and DDR traces. Microvia-in-pad is recommended for inner balls to escape the dense ball field without exceeding 4 layers. Match trace length within 50 mils for DDR address/command signals and within 25 mils for clock pairs.

Do not confuse the U256 Ultra FineLine BGA ball map with the F256 FineLine BGA ball map - they are mechanically similar but electrically different. A PCB laid out for U256 will not work with an F256 device without re-routing. Also, the -A7 speed grade is the fastest; substituting a -C8 or -I7 device on the same board will work but reduce the maximum fMAX by approximately 15% to 25%.

Cyclone III LVDS inputs require an external 100 ohm differential termination between the P and N pins placed as close to the FPGA ball as possible. For DDR2 interfaces, use the FPGA's on-chip dynamic phase-shift circuitry (DPS) and the four PLLs to deskew the read DQS strobe. Series termination resistors of 22-33 ohm on DDR address/command lines improve signal integrity above 200 MHz.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant and AEC-Q100 grade qualified per Intel Cyclone III ordering information. Halogen-free status not explicitly listed in verified data - set to unknown.

Data verified on: 2026-09-09 β€” data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Intel Altera EP3C5U256A7N Cyclone III FPGA Field-Programmable Gate Array Programmable Logic Device BGA-256 Ultra FineLine BGA Logic Element M9K memory block 18x18 multiplier Phase-Locked Loop (PLL) RoHS REACH AEC-Q100 Nios II Quartus Prime Quartus II LVDS DDR2 Hot socketing Automotive infotainment Industrial motor control LED video wall
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