EP3C5U256C8 - Cyclone III FPGA 5K LE 256-BGA | Intel / Altera
MPN: EP3C5U256C8 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.95 | $259.50 |
| 100 | $22.4 | $2,240.00 |
| 500 | $19.85 | $9,925.00 |
| 1,000 | $17.2 | $17,200.00 |
EP3C5U256C8 Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable routing, and dedicated hard-IP blocks such as block RAM, DSP slices, PLLs, and high-speed transceivers. Within the broader semiconductor hierarchy, FPGAs sit between microcontrollers/CPUs (fixed-function, software-defined) and ASICs (application-specific, hardware-defined). Cyclone III sits within the programmable logic taxonomy: FPGA -> low-power FPGA -> Cyclone family -> Cyclone III generation, optimized for cost and power efficiency rather than raw performance.
Key features of the EP3C5U256C8 include 23 true 18-bit x 18-bit hardware multipliers for DSP operations, 4 PLLs providing flexible clock synthesis, and 1.0 V core operation with multi-voltage I/O support for LVDS, LVCMOS, SSTL, and HSTL standards. The Cyclone III architecture supports the Nios II embedded processor for soft-core CPU integration, and configuration can be loaded via JTAG, Active Serial (AS), Active Parallel (AP), or Passive Serial (PS) modes. Suspend mode allows power-down of unused logic to reduce quiescent consumption.
Technical depth is provided by 2 PLLs with eight output banks (when paired with the 65 nm Cyclone III LS family) and dedicated per-pin serialization/deserialization (SERDES) blocks for LVDS signaling up to 875 Mbps. The device supports up to 8 input clocks and provides on-chip termination (OCT) for impedance matching, simplifying PCB design. Configuration bitstream is stored in external flash and loaded by the FPGA at power-up, with built-in error detection via CRC check and decompression for compressed bitstreams.
Typical applications include industrial motor control, video surveillance and image processing, low-cost ASIC prototyping, consumer handheld devices, and automotive infotainment pre-development. The 5,136 LE count maps well to glue-logic replacement, parallel-to-serial bridges, and small protocol conversion IPs. Pair the EP3C5U256C8 with external DDR/DDR2 SDRAM and an Altera EPCS configuration device for a complete low-cost system.
A key design consideration when using the EP3C5U256C8 is power budgeting: although Cyclone III is the lowest-power 60 nm FPGA family, dense designs at high toggle rates can still draw 1-2 W of core power. Plan thermal relief on the UBGA-256 land pattern with via-in-pad or thermal vias under the center ball array, and use the Quartus II PowerPlay analyzer to estimate static and dynamic losses before PCB layout commitment.
This page synthesizes distributor pricing, drop-in same-package Cyclone III alternatives, and practical design notes not found in the standalone manufacturer datasheet, providing engineering context for selecting the right density and speed grade within the Cyclone III family.
Drop-in alternatives for EP3C5U256C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C5U256C8 (same form factor and footprint) — differing in Speed Grade, Process Technology, Package, Operating Temperature, Series.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C5U256C7N
✅ Drop-In✓ In Stock
$17.85 / Unit
View Datasheet →EP3C5U256C7
✅ Drop-In✓ In Stock
$16.1 / Unit
View Datasheet →EP3C5U256C6N
✅ Drop-In✓ In Stock
$25.4 / Unit
View Datasheet →EP3C5U256C6
✅ Drop-In✓ In Stock
$10.85 / Unit
View Datasheet →EP3C5U256A7N
✅ Drop-In✓ In Stock
$16.2 / Unit
View Datasheet →EP3C5U256C8 Maximum Ratings & Electrical Characteristics
| Series | Cyclone® III |
| Logic Elements | 5,136 |
| Total Memory Bits | 423,936 |
| Number of Logic Array Blocks (LABs) | 182 |
| Number of I/O Pins | 182 (maximum user I/O) |
| Embedded 18x18 Multipliers | 23 |
| PLLs | 2 |
| Package | 256-LFBGA (UBGA) |
| Package Code | LFBGA-256, 17x17 mm |
| Speed Grade | 8 (commercial) |
| Operating Temperature | 0C to +85C (commercial grade) |
| Core Voltage | 1.0 V to 1.2 V (1.2 V nominal) |
| I/O Voltage Support | LVDS, LVCMOS, SSTL, HSTL |
| Configuration Modes | JTAG, Active Serial, Active Parallel, Passive Serial |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Process Technology | 60 nm low-power CMOS |
EP3C5U256C8 lfbga-256, 17x17 mm Pin Configuration Guide
Pin configuration for EP3C5U256C8 (lfbga-256, 17x17 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C5U256C8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C5U256C8 is suitable for 6 applications: Industrial Motor Control, Video Surveillance & Image Processing, ASIC Prototyping, Consumer Handheld Devices, Automotive Infotainment Pre-Development, Communication Protocol Bridging.
Industrial Motor Control
The EP3C5U256C8 fits industrial motor control designs by providing 23 embedded 18x18 hardware multipliers for real-time PID/SVPWM loop computation, 182 user I/O for encoder feedback and power-stage gating signals, and 4 PLLs (when paired with the broader Cyclone III architecture) for generating switching frequencies up to 200 kHz. The 5,136 logic elements comfortably accommodate 3-phase FOC (field-oriented control) state machines and soft-core Nios II supervisory code, while 423,936 bits of block RAM hold reference trajectory tables. Commercial 0-85C temperature range suits enclosed control cabinets with moderate airflow, and the 1.0 V core voltage keeps dissipation under 1.5 W for typical servo duty cycles. Compared to a discrete MCU, the FPGA parallel architecture eliminates timing jitter between current sampling and PWM update - critical for sub-1% torque ripple targets in CNC spindle drives and robotics actuators.
Recommended
Video Surveillance & Image Processing
The EP3C5U256C8 suits cost-sensitive video surveillance and machine-vision front-end designs by leveraging its 5,136 logic elements for parallel pixel processing pipelines at ITU-R BT.656 (27 MHz) or 720p60 (74.25 MHz) input rates. The 23 hardware 18x18 multipliers handle real-time 2D FIR filtering and Sobel edge detection, while the 423,936 bits of block RAM provide double-buffer line storage for up to 720p30 with minimal external SDRAM. With LVDS support up to 875 Mbps per channel, the 182 I/O pins can directly interface to OV5640 / MT9V032 image modules in low-resolution applications, while the on-chip PLLs generate pixel clocks from a single 27 MHz crystal. Commercial 0-85C operation matches indoor camera housing requirements, and 1.2 V core voltage keeps total board power under 1.5 W for fanless PoE-powered IP cameras.
Recommended
ASIC Prototyping
The EP3C5U256C8 works as an ASIC prototyping vehicle for designs targeting 100K-200K gate-equivalent ASICs, by providing 5,136 LEs plus 23 multipliers and ample block RAM for verification of logic partitions before tape-out. Designers can instantiate the entire ASIC's control plane plus a partial data plane within the Cyclone III fabric, with 182 user I/O mapping to the ASIC's pad ring through level shifters. Industrial 0-85C temperature range matches ASIC qualification profiles, and JTAG-based configuration supports rapid compile/test cycles during emulation. Compared to an ASIC, the Cyclone III prototype enables software team to begin driver development 6-9 months earlier, with Quartus II software providing incremental compile in seconds rather than the hours required for ASIC synthesis. The drop-in EP3C5U256C7N variant enables quick speed-grade swaps when timing closure fails on the prototype.
Recommended
Consumer Handheld Devices
The EP3C5U256C8 targets consumer handheld applications such as portable media players, e-readers, and low-end digital cameras by delivering 5,136 LEs of logic capacity at a low unit cost (under $20 at qty 1000) with the Cyclone III family's industry-leading low static power consumption (typically 30-50 mW). The 256-ball UBGA package at 17x17 mm fits handheld mainboards, and the 1.2 V core voltage supports Li-ion battery operation. The 182 I/O interface directly to MIPI-style display controllers, capacitive touch controllers, and audio codecs through level shifters. Suspend mode reduces quiescent current below 5 mA when the device is idle - critical for battery-life targets. Industrial 0-85C operation matches pocket-portable thermal envelopes.
Recommended
Automotive Infotainment Pre-Development
The EP3C5U256C8 supports automotive infotainment pre-development and algorithm validation work, providing 5,136 LEs for prototyping head-unit audio mixing, CAN/LIN gateway logic, and rear-seat entertainment video routing. The 23 hardware 18x18 multipliers accelerate audio DSP kernels such as MP3/AAC decode and acoustic echo cancellation, while 423,936 bits of block RAM hold audio sample buffers. The 182 user I/O map to MOST bus interfaces and LVDS display panels. For production, designers migrate to the automotive-qualified EP3C5U256A7N variant (which is in this same family) - the drop-in compatibility lets engineering teams prototype on the C8 part and switch to A7 for qualification builds. Commercial 0-85C temperature matches pre-development lab conditions, with -40 to +100C reserved for production designs via the A-grade variant.
Recommended
Communication Protocol Bridging
The EP3C5U256C8 fits industrial communication protocol bridging applications such as UART/SPI/I2C to CAN/Ethernet conversion by offering 5,136 LEs for protocol state machines and 4 PLLs for generating timing references at multiple rates. The 182 user I/O accept multiple serial bus transceivers simultaneously - 8 UARTs, 4 SPI masters, and 2 CAN interfaces can be implemented in a single device with room for soft-core Nios II supervisory code. The 23 hardware 18x18 multipliers handle CRC computation and AES-128 encryption for secure industrial IoT bridging. Commercial 0-85C operation suits factory-floor DIN-rail enclosures with active cooling, and JTAG-based configuration supports remote firmware updates over the same Ethernet interface the device implements. The drop-in C7N variant offers 15% timing margin for high-speed SPI peripherals running above 50 MHz.
Recommended
Recommended Products Summary
Engineering reference data for EP3C5U256C8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C5U256C7N | EP3C5U256C7 | EP3C5U256C6N | EP3C5U256C6 | EP3C5U256A7N |
|---|---|---|---|---|---|---|
| Package | 256-LFBGA (UBGA) | 256-LFBGA (UBGA) - same | 256-LFBGA (UBGA) - same | 256-LFBGA (UBGA) - same | 256-LFBGA (UBGA) - same | 256-LFBGA (UBGA) - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Series | Cyclone III | Cyclone III - same | Cyclone III - same | Cyclone III - same | Cyclone III - same | Cyclone III - same |
| Logic Elements | 5,136 | 5,136 | 5,136 | 5,136 | 5,136 | 5,136 |
| Speed Grade | C8 (commercial, slowest) | C7 (~15% faster) | C7 (~15% faster) | C6 (~25% faster) | C6 (~25% faster) | A7 (automotive, -40 to +125C) |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Automotive (-40C to +125C) |
| Embedded RAM (bits) | 423,936 | 423,936 | 423,936 | 423,936 | 423,936 | 423,936 |
| Embedded 18x18 Multipliers | 23 | 23 | 23 | 23 | 23 | 23 |
| User I/O Pins | 182 | 182 | 182 | 182 | 182 | 182 |
Key Differentiators
- Lowest-cost speed grade in the EP3C5U256 UBGA-256 family (vs EP3C5U256C7N)
- Drop-in same-footprint upgradability within Cyclone III EP3C5 family (vs EP3C10F256C8N)
- Automotive temperature upgrade path via A7 variant (vs EP3C5U256A7N)
Design Notes
Estimated: Cyclone III EP3C5U256C8 typical core power at 100% toggle rate and 1.2 V is 0.8-1.2 W; static power at idle is 30-50 mW. Decouple the 1.2 V VCCINT rail with 4 x 4.7 uF X7R ceramic capacitors distributed around the BGA, plus a 220 uF bulk tantalum or polymer capacitor. Use separate 2.5 V or 3.3 V VCCIO banks for I/O voltage rails, with 100 nF per-pin decoupling on all 182 user I/O for high-speed LVDS or SSTL signaling. A dedicated PLL analog supply (VCC_PLL) requires an LC pi-filter (ferrite + 1 uF + 100 nF) for low-jitter clock generation per Altera Cyclone III Handbook Volume 1.
Estimated: The UBGA-256 package has theta_JA approximately 25-30 C/W with standard 4-layer PCB thermal vias. At 1.5 W typical dissipation, junction temperature rises 40-45 C above ambient - acceptable for commercial 0-85C operation in well-ventilated enclosures. For sealed enclosures without airflow, derate ambient to below 50C or upgrade to industrial temperature variants (EP3C5U256I8 family). Use Quartus II PowerPlay Power Analyzer to model actual design dissipation before finalizing the mechanical enclosure.
The UBGA-256 ball matrix is a 17x17 mm FineLine BGA with 1.0 mm pitch. Use 0.4 mm via-in-pad microvias with 4 mil laser drill for escape routing to inner layers, and stitch a 5x5 thermal via array (0.3 mm finished hole) under the center ball cluster. Maintain 50-ohm controlled impedance for LVDS pairs routed as length-matched differential pairs with 100-ohm differential impedance, and use 90-ohm differential for LVDS without on-chip termination. Stack-up should be 8 layers minimum with dedicated GND planes above and below BGA signal layers per High-Speed Design guidelines.
Route configuration-related signals carefully: TCK, TMS, TDI, TDO for JTAG; DCLK, DATA0, nCONFIG, nSTATUS, CONF_DONE for AS mode. Place the EPCS configuration flash within 2 inches of the FPGA to minimize DCLK skew, and add 4.7k pull-up resistors on TCK, nCONFIG, and CONF_DONE per the Cyclone III Configuration Handbook. For high-speed LVDS, isolate TX and RX pairs on different layers with GND shielding between them, and avoid routing LVDS across plane splits. PLL analog supply traces must be short with ferrite isolation from digital supply noise.
Do not assume pinout compatibility with Cyclone IV or Cyclone 10 families - those use different BGA assignments even at the same ball count. When upgrading from EP3C5U256C8 to EP4CE5F256C8N (Cyclone IV E), a full PCB redesign is required. Also avoid confusing UBGA-256 with the larger FBGA-484 (used on EP3C55F484C8N and similar higher-density Cyclone III parts) - the 484-BGA package is physically larger and not footprint-compatible. Finally, do not skip the 100 nF decoupling caps on VCCIO banks - the Cyclone III is sensitive to VCCIO ripple for LVDS signaling at 875 Mbps.
Compliance Information
RoHS and REACH compliant per Altera / Intel environmental documentation. Not AEC-Q100 qualified - choose EP3C5U256A7N for automotive applications. Lead-free 256-BGA terminations rated for reflow up to 260C peak per JEDEC J-STD-020.
