EP3CLS100F780C8N vs EP3CLS100F780I7 Comparison

Detailed side-by-side comparison of EP3CLS100F780C8N by Intel and EP3CLS100F780I7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3CLS100F780C8N EP3CLS100F780I7
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $105.80 $775.00
Device Family Cyclone III LS Cyclone III LS
Logic Elements (LE) 100,448 β€”
Total Memory Bits 4,451,328 β€”
Embedded Memory Blocks M9K + M144K β€”
Logic Array Blocks (LAB) 6,278 β€”
Number of PLLs 4 β€”
Maximum User I/O 429 413
Core Supply Voltage (VCCINT) 1.2 V β€”
Analog Supply (VCCA) 2.5 V β€”
Process Technology 65 nm low-power CMOS 60 nm low-power CMOS
Maximum Embedded Multipliers (18x18) 244 β€”
Package 780-ball FBGA (FineLine BGA) 780-ball FBGA (F780)
Package Dimensions 29 mm x 29 mm, 1.0 mm ball pitch β€”
Operating Temperature (Commercial) 0C to +85C β€”
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
Configuration Schemes AS, PS, PP, JTAG β€”
RoHS Status Compliant Compliant
Lead-Free Yes β€”
Device Type β€” FPGA (Field Programmable Gate Array)
Logic Elements β€” 100,448
Embedded Memory Bits β€” 4,451,328 bits (~4.4 Mbit)
Number of Logic Array Blocks β€” 47 (per distributor summary)
Number of Transceivers β€” 4
Supply Voltage (Core) β€” 1.2 V
Operating Temperature Grade β€” Industrial (-40C to +100C)
Configuration Method β€” SRAM-based, JTAG or external flash (EPCS/EPCQ)
I/O Standards Supported β€” LVDS, LVCMOS, LVTTL, SSTL, HSTL
PLLs β€” Up to 8 (family maximum)
Security Features β€” 256-bit AES bitstream encryption, JTAG disable

Datasheets & Resources

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