EP3CLS100F780I7 - Cyclone III LS FPGA, 100K LE, 780-BGA | Intel
MPN: EP3CLS100F780I7 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $922.09 | $922.09 |
| 10 | $890 | $8,900.00 |
| 25 | $850 | $21,250.00 |
| 50 | $810 | $40,500.00 |
| 100 | $775 | $77,500.00 |
EP3CLS100F780I7 Overview
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable I/O cells, all connected by a programmable routing fabric. Within the broader semiconductor taxonomy, FPGAs sit between general-purpose microcontrollers (software-defined behavior, fixed silicon) and ASICs (fixed function, custom silicon), occupying the programmable-logic niche defined by standards such as JEDEC JESD-8 (interface voltage levels) and IEEE 1149.1 (boundary-scan/JTAG). Cyclone III LS devices extend this definition with low static power consumption and built-in design-security features such as configuration bitstream encryption and JTAG-protected access.
Key features of the EP3CLS100F780I7 include 100,448 logic elements (LEs), 4,451,328 bits of embedded RAM (~4.4 Mbit), 4 full-duplex transceiver channels, and 413 maximum user I/O pins exposed through the 780-ball BGA. The device supports multiple I/O standards including LVDS, LVCMOS, LVTTL, SSTL, and HSTL via dedicated I/O banks, and offers up to 8 PLLs for clock management. The 780-FBGA package provides a high-density pin count in a footprint compatible with the rest of the Cyclone III LS F780 family.
Architecturally, the EP3CLS100F780I7 is built on a low-power 60 nm process and uses SRAM-based configuration cells, requiring an external configuration memory (EPCS or EPCQ flash) or JTAG download for bitstream loading. Security features include 256-bit AES encryption of the configuration bitstream and a JTAG-access disable mode, supporting anti-tamper designs. Transceivers operate up to 3.125 Gbps, enabling common serial-protocol bridging.
Typical applications for the EP3CLS100F780I7 include industrial motor control, factory automation PLC interfaces, video bridging and image processing pipelines, low-cost software-defined radio front-end control, and consumer display controllers. The combination of high logic density and low static power also suits portable battery-powered instruments.
When designing with this FPGA, attention must be paid to power-rail sequencing (VCCINT before VCCA, then VCCIO), decoupling capacitor placement adjacent to each power pin, and selection of a compatible configuration device. Designers should also confirm PCB BGA fanout and via-in-pad capability to ensure manufacturability at the 1.0 mm FBGA-780 pitch.
This page synthesizes distributor pricing, same-package drop-in alternatives drawn from the Cyclone III LS F780 family, and practical design notes not found in the manufacturer datasheet, giving engineers a one-stop reference for part selection.
Drop-in alternatives for EP3CLS100F780I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3CLS100F780I7 (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, RoHS Status, Bitstream Encryption.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3CLS100F780C8N
✅ Drop-In✓ In Stock
$105.8 / Unit
View Datasheet →EP3CLS100F780C8
✅ Drop-In✓ In Stock
$65 / Unit
View Datasheet →EP3CLS100F780C7N
✅ Drop-In✓ In Stock
$298.75 / Unit
View Datasheet →EP3CLS100F780C7
✅ Drop-In✓ In Stock
$632.4 / Unit
View Datasheet →EP3C120F780I7
✅ Drop-In✓ In Stock
$610 / Unit
View Datasheet →EP3CLS100F780I7 Maximum Ratings & Electrical Characteristics
| Device Family | Cyclone III LS |
| Device Type | FPGA (Field Programmable Gate Array) |
| Logic Elements | 100,448 |
| Embedded Memory Bits | 4,451,328 bits (~4.4 Mbit) |
| Number of Logic Array Blocks | 47 (per distributor summary) |
| Number of Transceivers | 4 |
| Maximum User I/O | 413 |
| Package | 780-ball FBGA (F780) |
| Supply Voltage (Core) | 1.2 V |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Process Technology | 60 nm low-power CMOS |
| Configuration Method | SRAM-based, JTAG or external flash (EPCS/EPCQ) |
| I/O Standards Supported | LVDS, LVCMOS, LVTTL, SSTL, HSTL |
| PLLs | Up to 8 (family maximum) |
| Security Features | 256-bit AES bitstream encryption, JTAG disable |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
EP3CLS100F780I7 780-ball fbga (f780) Pin Configuration Guide
Pin configuration for EP3CLS100F780I7 (780-ball fbga (f780) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3CLS100F780I7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3CLS100F780I7 is suitable for 7 applications: Industrial Motor Control, Video Bridging and Image Processing, Software-Defined Radio Front-End Control, Factory Automation PLC Interface, Medical Instrumentation Front-End, Aerospace Avionics Interface Bridge, Portable Test and Measurement Equipment.
Industrial Motor Control
The EP3CLS100F780I7's 100,448 logic elements, 8 PLLs, and 413 user I/Os make it an excellent platform for multi-axis industrial motor control. Its 4 full-duplex transceivers support industrial fieldbuses such as EtherCAT, Profinet, or SERCOS III alongside real-time position feedback. The industrial -40C to +100C temperature grade ensures reliable operation in factory cabinets and outdoor enclosures. Built-in 256-bit AES bitstream encryption protects IP from cloning, while the low-power Cyclone III LS architecture reduces thermal stress in sealed enclosures. Designers typically pair the FPGA with external ADCs for current sensing and gate drivers for IGBT/SiC power stages.
Recommended
Video Bridging and Image Processing
With 100K logic elements and 4.4 Mbit of embedded RAM, the EP3CLS100F780I7 can implement real-time video bridging pipelines such as HDMI-to-MIPI, dual-camera aggregation, or on-the-fly image scaling and color-space conversion. The 4 transceivers handle DisplayPort 1.1, HDMI, or SDI at rates up to 3.125 Gbps, while the abundant LVDS/HSUL/HSTL I/O support direct interfacing to flat-panel drivers and external image sensors. The industrial temperature rating suits outdoor surveillance and automotive infotainment applications. Cyclone III LS static power is well under competing 90 nm FPGAs, simplifying thermal design in sealed displays.
Recommended
Software-Defined Radio Front-End Control
The EP3CLS100F780I7 is well suited as the digital control and baseband glue logic for low-to-mid-range software-defined radio systems. Its 4 transceivers handle ADC/DAC data streams up to 3.125 Gbps, while the 100K LEs implement digital down/up-conversion, FIR filtering, and protocol framing. The 8 PLLs derive the precise sample clocks required by high-speed converters, and the LVDS-capable I/O interfaces directly to most modern ADC/DAC devices. Industrial temperature grading supports tactical and outdoor radio deployments. Security features protect proprietary waveforms and modulation algorithms from reverse engineering.
Recommended
Factory Automation PLC Interface
For PLC and distributed I/O modules, the EP3CLS100F780I7 provides sufficient logic density to host multiple industrial Ethernet protocols, custom digital I/O aggregation, and on-module diagnostics. The 4 transceivers and abundant LVCMOS I/Os permit direct connection to RS-485, CAN, and isolated 24V industrial I/O without external bridges. Cyclone III LS static power is low enough that compact DIN-rail modules can be passively cooled. The AES bitstream encryption prevents unauthorized firmware injection, an increasing concern in connected factory environments.
Recommended
Medical Instrumentation Front-End
The EP3CLS100F780I7's low static power and high logic density suit portable medical instruments such as patient monitors, ultrasound front-ends, and point-of-care analyzers. The 4 transceivers stream digitized sensor data from high-speed ADCs to an external processor or display controller, while the 100K LEs implement digital filtering, QRS/pulse detection, and USB/Ethernet connectivity. Industrial temperature grading (which overlaps with most medical environmental specs) and the AES bitstream encryption safeguard patient data and proprietary signal-processing algorithms. Designers should validate IEC 60601 compliance separately.
Recommended
Aerospace Avionics Interface Bridge
The EP3CLS100F780I7 functions as a multi-protocol bridge in avionics subsystems, supporting ARINC 429, MIL-STD-1553 (with external transceiver), and Ethernet interfaces on a single chip. Its 4 transceivers aggregate high-speed sensor or radar data, while the 100K LEs implement protocol stacks and data routing. Industrial temperature rating suits most avionics bay environments, though for full DO-254/DO-160 qualification additional analysis is required. AES bitstream encryption is valuable for tamper-resistant avionics firmware.
Recommended
Portable Test and Measurement Equipment
Handheld oscilloscopes, logic analyzers, and protocol testers benefit from the EP3CLS100F780I7's combination of logic density, low power, and small FBGA-780 footprint. The FPGA implements high-speed sample acquisition, triggering state machines, and display driving, while the 4 transceivers handle USB 3.0, Ethernet, or HDMI output to an external panel. AES bitstream encryption protects proprietary measurement IP from extraction in the field. The industrial temperature grade allows operation in lab, factory, and outdoor field environments.
Recommended
Recommended Products Summary
Engineering reference data for EP3CLS100F780I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3CLS100F780C8N | EP3CLS100F780C8 | EP3CLS100F780C7N | EP3CLS100F780C7 | EP3C120F780I7 |
|---|---|---|---|---|---|---|
| Package | 780-ball FBGA (F780) | 780-ball FBGA (F780) - same | 780-ball FBGA (F780) - same | 780-ball FBGA (F780) - same | 780-ball FBGA (F780) - same | 780-ball FBGA (F780) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Cyclone III LS | Cyclone III LS | Cyclone III LS | Cyclone III LS | Cyclone III LS | Cyclone III (non-LS) |
| Logic Elements | 100,448 | 100,448 | 100,448 | 100,448 | 100,448 | 119,088 (+19%) |
| Embedded Memory | 4,451,328 bits | 4,451,328 bits | 4,451,328 bits | 4,451,328 bits | 4,451,328 bits | 3,981,312 bits |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Speed Grade | 7 | 8 | 8 | 7 | 7 | 7 |
| AES Bitstream Encryption | Yes (256-bit) | Yes (256-bit) | Yes (256-bit) | Yes (256-bit) | Yes (256-bit) | No (non-LS) |
| Lead-Free (RoHS) | unknown | Yes (N suffix) | No (SnPb or matte tin) | Yes (N suffix) | No (SnPb or matte tin) | unknown |
Key Differentiators
- 256-bit AES bitstream encryption and JTAG disable (vs EP3C120F780I7)
- Full industrial temperature range (-40C to +100C) as standard (vs EP3CLS100F780C8N)
- Higher logic density than mid-range Cyclone III LS (vs EP3C55F780I7)
Design Notes
The Cyclone III LS EP3CLS100F780I7 requires sequenced power-up: VCCINT (1.2V core) before VCCA (2.5V analog PLLs) and finally VCCIO (1.2V-3.3V I/O). All three rails must ramp monotonically and settle within the datasheet's power-on-reset (POR) window. Use a dedicated power supervisor such as the LTC3025 or TPS7A45 with Power-Good to enforce sequencing. Place bulk decoupling (>= 22uF tantalum or polymer) within 25 mm of the BGA plus 0.1uF and 1nF ceramics adjacent to every power pin to suppress transient current spikes.
At maximum utilization (100K LEs toggling, 4 transceivers active), the EP3CLS100F780I7 can dissipate up to ~2.5 W. The FBGA-780 package has a theta_JA of roughly 12 C/W with a properly designed 4-layer PCB, giving a junction-temperature rise of 30 C above 70 C ambient - within the 100 C industrial limit. Use a continuous top-layer ground/power pour directly under the BGA to spread heat, and consider thermal vias in the BGA land pattern. For fully sealed enclosures, validate with a thermal probe on a populated board at worst-case workload.
The FBGA-780 package uses a 1.0 mm ball pitch with a 0.6 mm pad diameter. PCB designs must use via-in-pad (VIPPO) or microvia technology (e.g., HDI stack-up with 1-2-1 or 1-2-1-2 layers) to route signals out of the inner rows without requiring dog-bone fanout. Maintain 50 ohm single-ended and 100 ohm differential impedance on transceiver channels and LVDS pairs. JTAG and configuration signals should be length-matched within 1 mm if multiple devices share the chain.
Do not connect MSEL[3:0] to a default of all-1s unless the design uses AS (active serial) mode with a standard EPCS flash - incorrect MSEL settings prevent configuration. The DCLK pin must never float; tie it through a 1k-10k resistor to GND in standalone JTAG mode. When using AES encryption, store the 256-bit key only in volatile BBRAM or an encrypted flash, never in plaintext on an external EEPROM. Cyclone III LS devices require Quartus II 13.0sp1 or later for design compilation; older Quartus versions do not support LS-specific security features.
Compliance Information
RoHS and REACH compliant per Intel/Altera product page. AEC-Q100 is not applicable (FPGAs are not qualified to AEC-Q100; users needing automotive-grade should consult Intel automotive product line). Lead-free and halogen-free status of the I7 industrial variant is not confirmed in the provided data - confirm before RoHS-critical designs.
