EP3CLS150F780C7N vs EP3CLS100F780C8N Comparison

Detailed side-by-side comparison of EP3CLS150F780C7N by Intel and EP3CLS100F780C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3CLS150F780C7N EP3CLS100F780C8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $88.40 $105.80
Device Family Cyclone III LS Cyclone III LS
Logic Elements (LEs) 150,848 β€”
Logic Array Blocks (LABs) 9,428 β€”
Embedded Memory (M9K blocks) 5,994 Kbits β€”
Embedded Multipliers (18x18) 320 β€”
Maximum User I/O Pins 413 β€”
Phase-Locked Loops (PLLs) 4 β€”
Process Technology 65 nm CMOS 65 nm low-power CMOS
Core Supply Voltage 1.2 V β€”
Maximum Operating Frequency 437.5 MHz β€”
External Memory Interfaces DDR2 SDRAM, QDRII+ SRAM β€”
Package 780-ball FBGA (29x29 mm, 1.0 mm pitch) 780-ball FBGA (FineLine BGA)
Speed Grade C7 (commercial, -7 speed grade) β€”
Configuration Methods JTAG, Active Serial (AS), Passive Serial (PS) β€”
Operating Temperature 0C to +85C (commercial) β€”
RoHS Status Compliant Compliant
Logic Elements (LE) β€” 100,448
Total Memory Bits β€” 4,451,328
Embedded Memory Blocks β€” M9K + M144K
Logic Array Blocks (LAB) β€” 6,278
Number of PLLs β€” 4
Maximum User I/O β€” 429
Core Supply Voltage (VCCINT) β€” 1.2 V
Analog Supply (VCCA) β€” 2.5 V
Maximum Embedded Multipliers (18x18) β€” 244
Package Dimensions β€” 29 mm x 29 mm, 1.0 mm ball pitch
Operating Temperature (Commercial) β€” 0C to +85C
Mounting Type β€” Surface Mount (BGA)
Configuration Schemes β€” AS, PS, PP, JTAG
Lead-Free β€” Yes

Datasheets & Resources

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