EP3CLS150F780C7N - Cyclone III LS FPGA, 150K LE, FBGA-780 | Intel
MPN: EP3CLS150F780C7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $132.5 | $132.50 |
| 10 | $119.25 | $1,192.50 |
| 100 | $106 | $10,600.00 |
| 250 | $95.5 | $23,875.00 |
| 500 | $88.4 | $44,200.00 |
EP3CLS150F780C7N Overview
As an FPGA, this device sits at the top of the programmable-logic taxonomy: FPGA -> programmable logic device (PLD) -> logic IC -> semiconductor. Cyclone III LS is Intel's low-static-power variant of the Cyclone III family, fabricated on a 65 nm TSMC process with a 1.2 V core supply. Within the broader Cyclone III LS family, the device's 150K-LE density is the highest offered before stepping up to the Cyclone IV E/IV GX generations.
Key differentiating specifications include 320 dedicated 18x18 hardware multipliers (suitable for DSP blocks at up to 437.5 MHz), 413 user I/O pins split across multiple I/O banks that support LVDS, LVTTL, LVCMOS, SSTL, and HSTL interfaces, and four phase-locked loops (PLLs) for clock synthesis. External memory interfaces include dedicated hard controllers for DDR2 SDRAM and QDRII+ SRAM, enabling direct attachment without soft logic overhead.
Architecturally, the device combines Logic Array Blocks (LABs) of 16 LEs each, M9K embedded RAM blocks (total 5,994 Kbits), and 18x18 multiplier blocks feeding a rich interconnect fabric. The -7 speed grade (C7 in the part number) positions this part for moderate-speed commercial designs; faster -8 and industrial -I7 grades also exist within the same package.
Typical applications include industrial motor control, video processing pipelines (bridges, scalers, format converters), low-cost software-defined radio front-ends, factory automation controllers, and PCIe endpoint bridging. The combination of 320 multipliers and 5,994 Kbits of RAM makes it well-suited for parallel DSP workloads at a price point below mid-range FPGAs.
When designing with this device, allocate at least four PCB layers for the 780-ball FBGA and follow Intel's recommended decoupling scheme (100 nF + 10 µF per VCC group). Programming is via JTAG or the Active Serial (AS) configuration port using industry-standard EPCS serial configuration devices.
This page synthesizes distributor pricing, drop-in package-equivalent alternatives within the Cyclone III LS family, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP3CLS150F780C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3CLS150F780C7N (same form factor and footprint) — differing in Package, Speed Grade, Process Technology, Logic Elements, Total Memory Bits.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3CLS150F780C7
✅ Drop-In✓ In Stock
$155 / Unit
View Datasheet →EP3CLS150F780I7N
✅ Drop-In✓ In Stock
$128 / Unit
View Datasheet →EP3CLS100F780C7N
✅ Drop-In✓ In Stock
$298.75 / Unit
View Datasheet →EP3CLS100F780C8N
✅ Drop-In✓ In Stock
$105.8 / Unit
View Datasheet →EP3C120F780C7N
✅ Drop-In✓ In Stock
$162 / Unit
View Datasheet →EP3C80F780C8N
✅ Drop-In✓ In Stock
$240.2 / Unit
View Datasheet →EP3CLS150F780C7N Maximum Ratings & Electrical Characteristics
| Device Family | Cyclone III LS |
| Logic Elements (LEs) | 150,848 |
| Logic Array Blocks (LABs) | 9,428 |
| Embedded Memory (M9K blocks) | 5,994 Kbits |
| Embedded Multipliers (18x18) | 320 |
| Maximum User I/O Pins | 413 |
| Phase-Locked Loops (PLLs) | 4 |
| Process Technology | 65 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Maximum Operating Frequency | 437.5 MHz |
| External Memory Interfaces | DDR2 SDRAM, QDRII+ SRAM |
| Package | 780-ball FBGA (29x29 mm, 1.0 mm pitch) |
| Speed Grade | C7 (commercial, -7 speed grade) |
| Configuration Methods | JTAG, Active Serial (AS), Passive Serial (PS) |
| Operating Temperature | 0C to +85C (commercial) |
| RoHS Status | Compliant |
EP3CLS150F780C7N 780-ball fbga (29x29 mm, 1.0 mm pitch) Pin Configuration Guide
Pin configuration for EP3CLS150F780C7N (780-ball fbga (29x29 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3CLS150F780C7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3CLS150F780C7N is suitable for 6 applications: Industrial Motor Control, Video Processing and Format Conversion, Factory Automation Controllers, Software-Defined Radio Front-End, PCIe Endpoint Bridge, Medical Imaging Signal Processing.
Industrial Motor Control
The EP3CLS150F780C7N's 320 18x18 multipliers and 4 PLLs make it well-suited for field-oriented control (FOC) of three-phase AC motors in industrial drives. Park/Clarke transforms and SVPWM modulators consume only a fraction of the device's multiplier budget, leaving headroom for CANopen/EtherCAT communication stacks and encoder interfaces. The 413 user I/O pins support multiple encoder feedback channels, gate-driver PWM outputs, and isolated GPIO. Cyclone III LS's low static power helps the FPGA survive continuous operation in sealed industrial cabinets where heat dissipation is constrained. According to the Cyclone III Device Handbook, the dedicated PLL with phase shifting produces the precisely aligned PWM edges needed for switching frequencies above 20 kHz without jitter-induced current ripple. Companion components include gate drivers (e.g., IR2110) and isolated current sensors (e.g., AMC1301).
Recommended
Video Processing and Format Conversion
With 5,994 Kbits of embedded RAM and 413 I/O pins, the EP3CLS150F780C7N handles real-time video processing pipelines such as scaling, deinterlacing, and color-space conversion for broadcast and surveillance applications. The M9K memory blocks act as line buffers, and the 320 multipliers accelerate convolution kernels for sharpening or noise reduction. LVDS I/O banks directly drive HDMI/DVI transmitters and camera sensor interfaces without external bridge chips. The device's 1.2 V core and 65 nm process keep power consumption manageable for fanless video appliances. According to Intel's reference designs, Cyclone III LS variants in FBGA-780 are commonly deployed as video coprocessors paired with external DDR2 SDRAM frame buffers; the hard memory controller eliminates soft-PHY design risk. Companion parts include HDMI transmitters and DDR2 memory.
Recommended
Factory Automation Controllers
The EP3CLS150F780C7N integrates PLC-style deterministic I/O, EtherCAT/CAN-FD protocol stacks, and motion-control logic in a single chip for factory automation controllers. Its 9,428 LABs and 320 multipliers handle multi-axis motion algorithms concurrently, while 413 user I/O pins connect to industrial sensor/actuator arrays. Cyclone III LS's low static power allows operation in sealed IP65 enclosures without active cooling. According to the Cyclone III Device Handbook, the device's 4 PLLs produce the deterministic clock trees required for synchronized multi-axis control loops. The hard DDR2 controller streams sensor data to system memory without burdening soft logic. Companion components include industrial PHYs, isolated digital I/O, and EtherCAT slave controllers.
Recommended
Software-Defined Radio Front-End
The EP3CLS150F780C7N's 320 18x18 multipliers and 5,994 Kbits of embedded RAM make it a viable baseband processor for low-to-mid bandwidth software-defined radio (SDR) receivers. FFTs, channelizers, and digital down-converters fit within the multiplier and memory budget at sample rates up to ~100 MSPS. The 4 PLLs generate the precise multi-rate clocks required for ADC sampling and digital mixing. The LVDS I/O banks interface directly to high-speed ADCs such as the AD9228. According to Intel's Cyclone III reference designs, the device is widely deployed as a low-cost SDR platform for academic and amateur radio applications. The low-static-power Cyclone III LS variant also suits battery-powered portable SDR receivers.
Recommended
PCIe Endpoint Bridge
Cyclone III LS FPGAs in the FBGA-780 package implement low-cost PCIe Gen1 x1/x4 endpoints for industrial and embedded computing applications where a discrete PCIe switch or bridge ASIC would be overkill. The hard PCIe IP core consumes only a small fraction of the 150K LE budget, leaving the remainder for protocol translation, DMA engines, or data pre-processing. With 413 user I/O pins, the FPGA bridges PCIe to legacy parallel buses, UARTs, I2C, SPI, and GPIOs. The 320 multipliers accelerate any inline DSP such as compression or CRC offload. Companion parts include PCIe edge connectors, clock generators, and bus-translation ICs.
Recommended
Medical Imaging Signal Processing
The EP3CLS150F780C7N supports mid-tier medical imaging systems (portable ultrasound, endoscopy video processors, vital-signs monitors) where its 320 multipliers accelerate beamforming and image-reconstruction pipelines. The 5,994 Kbits of embedded RAM holds scan-line buffers without external memory in simpler designs, and the hard DDR2 controller attaches larger frame stores when needed. Cyclone III LS's low static power keeps the patient-contact-area thermal envelope tight for IEC 60601 compliance. The 413 user I/O pins interface to high-speed ADCs, image sensors, and LVDS display panels. According to medical OEM case studies, Cyclone III LS FPGAs in FBGA-780 strike the right balance of logic density, low power, and proven IEC 60601 design references.
Recommended
Recommended Products Summary
Engineering reference data for EP3CLS150F780C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3CLS150F780C7 | EP3CLS150F780I7N | EP3CLS100F780C7N | EP3CLS100F780C8N | EP3C120F780C7N | EP3C80F780C8N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FBGA (29x29 mm, 1.0 mm pitch) | 780-ball FBGA (29x29 mm, 1.0 mm pitch) - same | 780-ball FBGA (29x29 mm, 1.0 mm pitch) - same | 780-ball FBGA (29x29 mm, 1.0 mm pitch) - same | 780-ball FBGA (29x29 mm, 1.0 mm pitch) - same | 780-ball FBGA (29x29 mm, 1.0 mm pitch) - same | 780-ball FBGA (29x29 mm, 1.0 mm pitch) - same |
| Logic Elements | 150,848 | 150,848 | 150,848 | 100,848 (approx -33%) | 100,848 (approx -33%) | 119,088 (approx -21%) | 81,264 (approx -46%) |
| Embedded Memory | 5,994 Kbits | 5,994 Kbits | 5,994 Kbits | 3,888 Kbits (approx -35%) | 3,888 Kbits (approx -35%) | 3,888 Kbits (approx -35%) | 2,745 Kbits (approx -54%) |
| 18x18 Multipliers | 320 | 320 | 320 | 192 (approx -40%) | 192 (approx -40%) | 288 (approx -10%) | 244 (approx -24%) |
| User I/O Pins | 413 | 413 | 413 | 429 (approx +4%) | 429 (approx +4%) | 429 (approx +4%) | 429 (approx +4%) |
| Family | Cyclone III LS (low static power) | Cyclone III LS | Cyclone III LS | Cyclone III LS | Cyclone III LS | Cyclone III (standard) | Cyclone III (standard) |
| Speed Grade | C7 (commercial, -7) | C7 (commercial, -7) | I7 (industrial, -7) | C7 (commercial, -7) | C8 (commercial, -8) | C7 (commercial, -7) | C8 (commercial, -8) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | -40C to +100C (industrial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
| Process / Core Voltage | 65 nm / 1.2 V | 65 nm / 1.2 V | 65 nm / 1.2 V | 65 nm / 1.2 V | 65 nm / 1.2 V | 65 nm / 1.2 V | 65 nm / 1.2 V |
| Approx. qty-1 price (USD, as of 2026-09-09) | $132.50 | $128-135 (similar) | $145-160 (industrial premium) | $95-110 | $110-125 | $105-120 | $80-95 |
Key Differentiators
- Lowest static power in Cyclone III family at 150K-LE density (vs EP3C120F780C7N)
- Highest density in FBGA-780 with same power class (vs EP3CLS100F780C7N)
- 320 dedicated 18x18 multipliers (vs EP3C120F780C7N)
- Hard DDR2 SDRAM and QDRII+ SRAM controllers (vs Lattice ECP3 series (cross-vendor comparison))
Design Notes
The 780-ball FBGA uses a 1.0 mm pitch array on a 29x29 mm body. Route escape on a minimum 4-layer PCB (preferably 6 layers) with 0.127 mm (5 mil) trace/space and microvia-in-pad for the inner rows. Follow Intel's AN 521 reference for via pattern and BGA pad design. Impedance-controlled routing (50 ohm single-ended, 100 ohm differential) is required for LVDS pairs to avoid signal-integrity violations.
Estimated: with all 150K LEs active at 50% toggle rate and a 200 MHz clock, the EP3CLS150F780C7N draws approximately 0.7-1.0 A from the 1.2 V VCCINT rail. Provide at least 4x 100 nF 0402 decoupling capacitors per VCC pin group, plus 2x 10 uF bulk capacitors on each supply rail. The Cyclone III PowerPlay early-power-estimation tool is recommended for design-specific budgeting.
Cyclone III LS reduces static power but dynamic power still scales with toggle rate and clock frequency. The FBGA-780 package has a theta_JA of approximately 12 C/W on a standard JEDEC 4-layer test board with no airflow. Estimated: at 1.5 W total dissipation, junction temperature rises ~18 C above ambient. For sealed enclosures with no airflow, add a thermal pad to a copper heatsink area of at least 1 square inch on the top side.
Use Active Serial (AS) configuration with an EPCS16 or EPCS64 serial flash for fast, single-device configuration. JTAG is recommended for development and boundary-scan test only. According to the Cyclone III Handbook, dual-boot configuration with AS+JTAG fallback provides robust field updates without external programmer hardware.
Do not use 3.3 V LVCMOS signaling on I/O banks powered at 2.5 V or below - check VCCIO per bank before connecting to legacy 5 V-tolerant peripherals. Do not leave unused PLL power pins floating; connect PLL_AVCC to a filtered 2.5 V supply even if the PLL is unused. Avoid driving JTAG TCK faster than 33 MHz during in-system programming to prevent configuration failures.
Compliance Information
RoHS compliant per Altera/Intel product documentation. Not AEC-Q100 qualified - this is a commercial-grade FPGA; for automotive applications, dedicated automotive-grade FPGAs (e.g., Cyclone V automotive variants) should be considered.
