EP3CLS200F484C7N vs EP3CLS200F484I7 Comparison
Detailed side-by-side comparison of EP3CLS200F484C7N by Intel and EP3CLS200F484I7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3CLS200F484C7N
EP3CLS200F484C7N - Cyclone III LS FPGA 198K LE FBGA-484 | Intel
EP3CLS200F484C7N β ActiveIntel
EP3CLS200F484I7
EP3CLS200F484I7 - Cyclone III LS FPGA, 198464 LE, 484-BGA | Intel
EP3CLS200F484I7 β ActiveSpecification Comparison
| Parameter | EP3CLS200F484C7N | EP3CLS200F484I7 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,650.00 | $3,580.00 |
| Series | Cyclone III LS | β |
| Logic Elements (LE) | 198,464 | 198464 |
| Logic Array Blocks (LAB) | 12,404 | β |
| Embedded Memory | 8,211,456 bits | β |
| Embedded 18x18 Multipliers | 210 | β |
| User I/O | 226 | β |
| Package | 484-ball FBGA (FineLine BGA, 23x23 mm) | 484-ball FBGA (PBGA484, 23 x 23 mm, 1.0 mm pitch) |
| Core Voltage | 1.2 V | 1.2 V |
| Operating Temperature | 0C to +85C (commercial) | -40 Β°C to +85 Β°C (Industrial) |
| Process Technology | 65 nm low-power CMOS | 60 nm low-power CMOS |
| Configuration Modes | AS, PS, JTAG (IEEE 1149.1) | β |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | β |
| Number of I/O Banks | 8 | β |
| Hot Socketing | Supported | β |
| PLLs | 4 | β |
| RoHS Status | Compliant | β |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Device Family | β | Cyclone III LS |
| CLBs | β | 198464 |
| Total Memory Bits | β | 8211456 bits (~1.0 MB) |
| Embedded Memory Blocks | β | 432 M9K blocks |
| User I/O Pins | β | 210 |
| Maximum Operating Frequency | β | 450 MHz |
| Number of PLLs | β | 4 |
| Supply Voltage | β | 1.2 V |
| Bitstream Encryption | β | AES (Cyclone III LS feature) |