EP3CLS200F484I7 - Cyclone III LS FPGA, 198464 LE, 484-BGA | Intel
MPN: EP3CLS200F484I7 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4580.75 | $4,580.75 |
| 10 | $4400.5 | $44,005.00 |
| 100 | $4125 | $412,500.00 |
| 500 | $3850 | $1,925,000.00 |
| 1,000 | $3580 | $3,580,000.00 |
EP3CLS200F484I7 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a matrix of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect that the designer configures after manufacturing using a hardware description language. Within the wider taxonomy, FPGAs sit under programmable logic devices (PLD) -> logic ICs -> integrated circuits -> semiconductors. The Cyclone III LS family is a low-static-power variant of Cyclone III, optimized for power-sensitive applications requiring the security and reliability features of the LS sub-family.
Key features of the EP3CLS200F484I7 include 198464 logic elements (also referred to as 198464 cells or ~47K logic blocks per FindIC summary), 432 M9K embedded memory blocks totaling 8,211,456 bits (about 1.0 Mbyte), 4 PLLs for clock management, 198464 CLBs in some parameter sets, and a typical core voltage of 1.2 V. The device supports DDR/DDR2/DDR3 external memory interfaces, LVDS signaling, and up to 4 phase-locked loops for high-speed serial or parallel I/O. Cyclone III LS parts add hardware AES encryption for bitstream protection.
The EP3CLS200F484I7 is typically used in industrial motor control, video processing, software-defined radio front-ends, low-power wireline telecom line cards, and portable medical instrumentation. Its low static power (~250 mW typical) makes it attractive for battery-backed or thermally-constrained systems where Cyclone III (non-LS) would not meet the power budget.
When designing with this FPGA, ensure the PCB provides a minimum of 4 dedicated GND balls plus continuous power planes under the BGA, and follow Intel's Pin Connection Guidelines for unused pins and JTAG pull-ups. The Quartus II (or Quartus Prime) design suite is required for synthesis, place-and-route, and bitstream generation.
Drop-in alternatives for EP3CLS200F484I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3CLS200F484I7 (same form factor and footprint) — differing in Process Technology, Package, Operating Temperature, Logic Elements (LE), Embedded Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3CLS200F484I7N
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EP3CLS200F484C8N
✅ Drop-In✓ In Stock
$1245 / Unit
View Datasheet →EP3CLS200F484C7N
✅ Drop-In✓ In Stock
$1650 / Unit
View Datasheet →EP3CLS150F484I7N
✅ Drop-In✓ In Stock
$192.4 / Unit
View Datasheet →EP3CLS100U484I7N
✅ Drop-In✓ In Stock
$108 / Unit
View Datasheet →EP3CLS200F484I7 Maximum Ratings & Electrical Characteristics
| Device Family | Cyclone III LS |
| Logic Elements (LE) | 198464 |
| CLBs | 198464 |
| Total Memory Bits | 8211456 bits (~1.0 MB) |
| Embedded Memory Blocks | 432 M9K blocks |
| User I/O Pins | 210 |
| Maximum Operating Frequency | 450 MHz |
| Number of PLLs | 4 |
| Core Voltage | 1.2 V |
| Supply Voltage | 1.2 V |
| Process Technology | 60 nm low-power CMOS |
| Operating Temperature | -40 °C to +85 °C (Industrial) |
| Package | 484-ball FBGA (PBGA484, 23 x 23 mm, 1.0 mm pitch) |
| Mounting Type | Surface Mount (BGA) |
| Bitstream Encryption | AES (Cyclone III LS feature) |
EP3CLS200F484I7 484-ball fbga (pbga484, 23 x 23 mm, 1.0 mm pitch) Pin Configuration Guide
Pin configuration for EP3CLS200F484I7 (484-ball fbga (pbga484, 23 x 23 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3CLS200F484I7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3CLS200F484I7 is suitable for 6 applications: Industrial Motor Control, Video Processing and Image Aggregation, Software Defined Radio (SDR) Front-End, Wireline Telecom Line Card, Portable Medical Instrumentation, Aerospace Avionics Databus Bridge.
Industrial Motor Control
The EP3CLS200F484I7 fits industrial motor control because its 198464 logic elements comfortably host multi-axis field-oriented control (FOC) state machines, while the 432 M9K memory blocks provide deterministic buffering for encoder feedback. The 1.2 V core plus Cyclone III LS low-static-power design keeps total board power within the thermal envelope of a sealed IP65 enclosure. Four PLLs generate the high-resolution PWM carriers required for sinusoidal commutation up to 200 kHz. Hardware AES bitstream encryption protects proprietary motor-control IP from cloning. Industrial temperature grade (-40 °C to +85 °C) tolerates factory-floor ambient conditions.
Recommended
Video Processing and Image Aggregation
The 8211456 bits of embedded memory (about 1.0 MB) in the EP3CLS200F484I7 provide line and frame buffers for multi-stream video aggregation at 1080p60 without external SRAM. The 210 user I/Os easily accept parallel CMOS inputs from multiple image sensors and drive LVDS outputs to a downstream encoder. AES bitstream encryption (Cyclone III LS feature) protects proprietary video-processing IP. Compared to a discrete DSP approach, the FPGA parallel architecture processes per-pixel operations at lower latency. Designers should target 4-layer PCB stack-up with the 1.0 mm-pitch FBGA to route LVDS pairs cleanly.
Recommended
Software Defined Radio (SDR) Front-End
The EP3CLS200F484I7 supports SDR front-end DSP such as DDC/DUC, channelizers, and digital predistortion because its 198464 logic elements and DSP blocks implement many parallel multiply-accumulate paths. Four PLLs derive the high-frequency sampling clocks required by 16-bit ADC interfaces. LVDS I/O simplifies connectivity to modern A/D converters like the AD9268. The Cyclone III LS low-static-power design is suitable for battery-backed portable SDR units. Industrial-grade operation ensures stable performance across wide temperature swings in tactical or outdoor deployments.
Recommended
Wireline Telecom Line Card
The EP3CLS200F484I7 suits telecom line-card applications such as TDM-to-packet conversion, multi-channel T1/E1 aggregation, and low-power DSL framer logic. AES bitstream encryption meets carrier security requirements, while the low-static-power Cyclone III LS process fits the dense NEBS-compliant chassis thermal budget. 210 user I/Os accommodate backplane serial interfaces plus local management buses. Industrial temperature grade ensures operation in unconditioned central-office edge cabinets. Hardware AES is a key differentiator versus non-LS Cyclone III parts.
Recommended
Portable Medical Instrumentation
The EP3CLS200F484I7 fits portable patient monitors and handheld ultrasound front-ends because its Cyclone III LS architecture achieves typical static power around 250 mW, extending battery run-time. The 198464 logic elements implement beamforming, FFT, and ECG feature-extraction pipelines, while 8 Mbit of embedded memory holds sample buffers. Industrial temperature operation handles the wide ambient range of clinical and field environments. AES bitstream encryption supports FDA cybersecurity guidance for connected medical devices.
Recommended
Aerospace Avionics Databus Bridge
The EP3CLS200F484I7 works as a multi-protocol avionics databus bridge (ARINC 429, MIL-STD-1553, and Ethernet) because its 198464 logic elements implement multiple protocol stacks concurrently. Four PLLs supply the disparate clock rates needed by each interface, and 210 user I/Os accommodate parallel ARINC channels. Industrial temperature grade and low static power suit airborne and ground-vehicle electronics. AES bitstream encryption protects sensitive mission data. The 1.0 mm-pitch FBGA integrates well with 6-layer avionic stack-ups.
Recommended
Recommended Products Summary
Engineering reference data for EP3CLS200F484I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3CLS200F484I7N | EP3CLS200F484C8N | EP3CLS200F484C7N | EP3CLS150F484I7N | EP3CLS100U484I7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA (23 x 23 mm, 1.0 mm pitch) | 484-ball FBGA (same) | 484-ball FBGA (same) | 484-ball FBGA (same) | 484-ball FBGA (same) | 484-ball FBGA (same) |
| Logic Elements | 198464 | 198464 | 198464 | 198464 | 150000 | 100000 |
| Embedded Memory (bits) | 8211456 | 8211456 | 8211456 | 8211456 | 6480000 (approx.) | 4450000 (approx.) |
| User I/O Pins | 210 | 210 | 210 | 210 | 210 | 210 |
| Operating Temperature | -40 °C to +85 °C (Industrial I7) | -40 °C to +85 °C | 0 °C to +85 °C (Commercial C8) | 0 °C to +85 °C (Commercial C7) | -40 °C to +85 °C | -40 °C to +85 °C |
| AES Bitstream Encryption | Yes (Cyclone III LS) | Yes | Yes | Yes | Yes | Yes |
| Approx. Unit Price (USD, as of 2026-09-09) | $4580.75 (qty-1) | similar to EP3CLS200F484I7 | $3900-4200 (estimated) | $3700-4000 (estimated) | $2800-3200 (estimated) | $1800-2200 (estimated) |
Key Differentiators
- Highest density in the EP3CLS family at the 484-FBGA package (vs EP3CLS150F484I7N)
- Industrial temperature grade (-40 °C to +85 °C) for harsh environments (vs EP3CLS200F484C7N)
- AES-128 bitstream encryption (Cyclone III LS feature) (vs EP3C120F484I7)
Design Notes
The 484-ball FBGA uses a 1.0 mm pitch and requires a 4-layer or 6-layer PCB stack-up with microvia (laser-drilled) or via-in-pad construction for reliable assembly. Place at least 4 GND balls plus a continuous ground plane directly under the package to provide a low-impedance return path for LVDS and DDR signals. Use the Intel-provided .bxl board file to import the land pattern, and verify the PCB house supports 1.0 mm-pitch BGAs (most Tier-1 SMT houses do).
Estimated: with the Cyclone III LS process at 1.2 V core and typical static current around 250 mW plus dynamic power proportional to toggle rate, total board power is dominated by I/O banks. Provide a low-noise LDO (e.g., TI TPS7A4701 or similar) on each 1.2 V/2.5 V/3.3 V rail with at least 10 µF of bulk ceramic plus 0.1 µF decoupling per power pin. Decoupling capacitors must be placed within 100 mils of each power pin per Intel's pin connection guidelines.
Follow Intel's LVDS and DDR routing rules: matched-pair length matching within 50 mils for LVDS, and ±25 mil length matching with 2-W spacing for DDR2/DDR3. Keep high-speed serial traces on the top layer with a continuous reference plane, and avoid routing signal traces over split power planes. The JTAG chain must include 4.7 kΩ pull-ups on TCK, TMS, and TDI, and a 4.7 kΩ pull-down on TDO per the Cyclone III handbook.
Do not assume EP3CLS200F484I7 and EP3CLS200F484C7N are interchangeable - the temperature grade differs (industrial vs commercial). Do not omit the AES key programming step during board bring-up, or the device will refuse to load bitstreams. Do not use Quartus Prime versions newer than 21.1 for Cyclone III LS without checking device support; Intel deprecated some legacy devices in newer Quartus releases.
Compliance Information
Compliance not explicitly stated in the verified web snippets; consult the manufacturer datasheet for RoHS/REACH declarations. AEC-Q100 not applicable (FPGA is not a discrete automotive IC, though the LS family is used in some automotive subsystems). Lead-free RoHS-compliant variant is EP3CLS200F484I7N (with 'N' suffix).
