EP3CLS70F484I7 vs EP3CLS70F484C7N Comparison

Detailed side-by-side comparison of EP3CLS70F484I7 by Intel and EP3CLS70F484C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3CLS70F484I7 EP3CLS70F484C7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $49.10 $96.30
Family Cyclone III LS โ€”
Series Cyclone III โ€”
Logic Elements (LE) 70208 70,208
Logic Array Blocks (LABs/CLBs) 4388 โ€”
Embedded Memory (Bits) 3068928 (about 2.93 Mbit) โ€”
Embedded Multipliers (18x18) 278 โ€”
Maximum User I/O 294 โ€”
Number of PLLs 4 โ€”
Operating Supply Voltage (Core) 1.15 V to 1.25 V โ€”
Process Technology 65 nm TSMC TSMC 65nm low-power (LP)
Maximum Operating Frequency 437.5 MHz 437.5 MHz
Operating Temperature -40C to +85C (Industrial) [DATA_NEEDED: commercial/industrial grade]
Mounting Style SMD/SMT โ€”
Package 484-FBGA (FineLine BGA, 23x23 mm) โ€”
RoHS Status Compliant Compliant (per Intel product page)
Lead-Free Yes โ€”
Moisture Sensitivity Level [DATA_NEEDED: MSL level] โ€”
Configuration Mode JTAG, Active Serial (AS), Passive Serial (PS) โ€”
Device Family โ€” Cycloneยฎ III LS
Logic Array Blocks (LABs) โ€” 4,388
Embedded Memory Bits โ€” 3,068,928
Maximum User I/Os โ€” 278
Core Supply Voltage (VCCINT) โ€” 1.2 V
Package Type โ€” 484-ball FineLine BGA (FBGA-484)
Package Dimensions โ€” 19 x 19 mm, 1.0 mm ball pitch
Mounting Type โ€” Surface Mount
MSL Level โ€” [DATA_NEEDED: MSL rating]
Configuration Method โ€” JTAG / Passive Serial / Active Serial
Design Tool โ€” Intel Quartus II (Cyclone III support)

Datasheets & Resources

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