Intel

EP3CLS70F484I7 - Cyclone III LS FPGA 70K LE, 484-FBGA | Intel

MPN: EP3CLS70F484I7 ✓ Active
In Stock Ships in 1-3 business days
1.15 V to 1.25 V Vdss 484-FBGA (FineLine BGA, 23x23 mm) Package 437.5 MHz Speed 3068928 (about 2.93 Mbit) Memory
From $49.1 USD / Unit
MOQ: 1 |
Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $78.5 $78.50
10 $72.3 $723.00
100 $64.85 $6,485.00
250 $59.2 $14,800.00
500 $54.4 $27,200.00
1,000 $49.1 $49,100.00
ℹ️ All prices are in USD

EP3CLS70F484I7 Overview

The Intel (formerly Altera) EP3CLS70F484I7 is a Cyclone III LS family Field-Programmable Gate Array (FPGA) integrating 70,208 logic elements, 4,388 LABs/CLBs, 278 embedded 18x18 multipliers, and 3,068,928 bits of embedded memory in a 484-ball FineLine BGA package. The device is fabricated on a low-power 65 nm TSMC process, operates from a 1.15 V to 1.25 V core supply, and supports up to 294 user I/Os with industrial temperature grading (-40C to +85C).

A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks (LUTs, flip-flops), embedded memory, DSP blocks, and a programmable interconnect fabric on a single die. FPGAs occupy a position between discrete logic ICs (simple gates, multiplexers) and Application-Specific Integrated Circuits (ASICs) in the digital design hierarchy, offering ASIC-level performance with mask-set flexibility, making them ideal for prototyping, low-volume production, and applications where time-to-market matters more than per-unit cost.

Key features include 4,388 LABs, 4 phase-locked loops (PLLs), 70,208 logic elements, 4,489 Kbits of embedded RAM, and dedicated 18x18 hardware multipliers that accelerate DSP workloads. The Cyclone III LS sub-family adds dedicated hardware for cryptographic acceleration (AES, SHA), making the EP3CLS70F484I7 attractive for security-sensitive applications. The 484-FBGA package provides high I/O density in a 23x23 mm footprint.

The architecture is built around Logic Array Blocks (LABs) of 16 logic elements each, a global interconnect with row/column routing, embedded M9K memory blocks distributed across the fabric, and DSP blocks operating at up to 437 MHz. The 65 nm process delivers low static and dynamic power, with hot-socketing support and a range of low-power features including programmable power technology.

Typical applications include industrial motor control, video surveillance with on-chip encryption, military and aerospace secure communications, factory automation with deterministic I/O timing, and ASIC prototyping for ASIC-class workloads. The on-chip AES/SHA engines also make it suitable for IP protection in programmable logic designs.

When designing with this device, ensure proper decoupling (100 uF + 1 uF + 0.1 uF per supply rail) and follow Intel/Altera layout guidelines for the 484-FBGA. Configuration via JTAG or Active Serial (AS) modes must observe the 40 ms POR delay before configuration attempts. Programming files are generated using Quartus II software.

This page synthesizes distributor pricing, drop-in Cyclone III LS alternatives from the same product family, and practical design notes not found in the manufacturer datasheet alone.

Drop-in alternatives for EP3CLS70F484I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP3CLS70F484I7 (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, RoHS Status, Configuration Mode.

Intel
Package: 484-FBGA (F484), 23 × 23 mm, 1.0 mm pitch
Process Technology: CMOS (Cyclone III low-power 65 nm family)
Operating Temperature: -40 °C to +100 °C (Industrial grade, I-suffix)
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Intel
Package: 484-ball FBGA (FineLine BGA)
Process Technology: TSMC 65 nm low-power (LP)
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Altera
Package: 484-pin FBGA (FineLine BGA)
Operating Temperature: 0 C to +70 C (commercial, C7 grade)
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Intel
Process Technology: TSMC 65nm low-power (LP)
RoHS Status: Compliant (per Intel product page)
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Intel
Package: 484-ball FineLine BGA (FBGA-484)
Process Technology: 65 nm TSMC low-power
Configuration Mode: Active serial, passive serial, JTAG, fast passive parallel
Compare with EP3CLS70F484I7 →
Intel
Package: 484-ball FBGA (FineLine BGA), 23x23 mm
Process Technology: 65 nm TSMC low-power
Operating Temperature: Commercial 0C to +85C (C8 grade)
Compare with EP3CLS70F484I7 →
Intel
Package: 484-ball FBGA (FineLine BGA), 1.0 mm pitch
Process Technology: 65 nm low-power CMOS
Operating Temperature: -40C to +100C (Industrial, I7 speed grade)
Compare with EP3CLS70F484I7 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP3CLS100F484I7

✅ Drop-In
Intel
📦 484-FBGA
Cyclone III LS · 100,448 · 278 · 4,451,328 bits · 610 (per datasheet family) · 66 · 16 dedicated · 4

✓ In Stock

$113.6 / Unit

View Datasheet →

EP3CLS70F484C7N

✅ Drop-In
Intel
📦 484-FBGA
Cyclone® III LS · 70,208 · 4,388 · 3,068,928 · 278 · 437.5 MHz · TSMC 65nm low-power (LP) · 1.2 V

✓ In Stock

$96.3 / Unit

View Datasheet →

EP3CLS70F484C8N

✅ Drop-In
Intel
📦 484-FBGA
Cyclone III LS · 70,208 · 4,388 · 3,068,928 bits (approx. 2,997 Kbit) · 247 · 278 · 4 · 20

✓ In Stock

$56.8 / Unit

View Datasheet →

EP3CLS70F484C7

✅ Drop-In
Altera
📦 484-FBGA
Cyclone III LS · 70,208 LE · 27,808 ALM · 2.93 Mbit (M9K blocks) · 278 · 294 · 4 · 20

✓ In Stock

$148.75 / Unit

View Datasheet →

EP3CLS70F484C8

✅ Drop-In
Intel
📦 484-FBGA
Cyclone III LS · 70,208 · 278 · 3,068,928 · M9K (4 Kbit each) · 300 · 278 · 4

✓ In Stock

$198 / Unit

View Datasheet →

EP3C55F484I7

✅ Drop-In
Intel
📦 484-FBGA
Cyclone III · Intel (formerly Altera) · FPGA - Field Programmable Gate Array · 55,856 · 3,491 · 3,491 · 327 · 2,396,160 (2,340 Kbits)

✓ In Stock

$175.54 / Unit

View Datasheet →

EP3CLS70F484I7 Maximum Ratings & Electrical Characteristics

Family Cyclone III LS
Series Cyclone III
Logic Elements (LE) 70208
Logic Array Blocks (LABs/CLBs) 4388
Embedded Memory (Bits) 3068928 (about 2.93 Mbit)
Embedded Multipliers (18x18) 278
Maximum User I/O 294
Number of PLLs 4
Operating Supply Voltage (Core) 1.15 V to 1.25 V
Process Technology 65 nm TSMC
Maximum Operating Frequency 437.5 MHz
Operating Temperature -40C to +85C (Industrial)
Mounting Style SMD/SMT
Package 484-FBGA (FineLine BGA, 23x23 mm)
RoHS Status Compliant
Lead-Free Yes
Configuration Mode JTAG, Active Serial (AS), Passive Serial (PS)

EP3CLS70F484I7 Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 I/O — User I/O pin (bank 8)
Pin A2 I/O — User I/O pin (bank 8)
Pin B1 VCCIO8 — I/O bank 8 supply
Pin B2 GND — Ground
Pin C1 I/O — User I/O pin (bank 8)
Pin C2 I/O — User I/O pin (bank 8)
Pin D1 VCCIO8 — I/O bank 8 supply
Pin D2 I/O — User I/O pin (bank 8)
Pin E1 I/O — User I/O pin (bank 7)
Pin E2 VCCIO7 — I/O bank 7 supply
Pin F1 I/O — User I/O pin (bank 7)
Pin F2 GND — Ground
Pin G1 I/O — User I/O pin (bank 7)
Pin G2 VCCIO7 — I/O bank 7 supply
Pin H1 I/O — User I/O pin (bank 6)
Pin H2 VCCIO6 — I/O bank 6 supply
Pin J1 I/O — User I/O pin (bank 6)
Pin J2 I/O — User I/O pin (bank 6)
Pin K1 VCCIO6 — I/O bank 6 supply
Pin K2 I/O — User I/O pin (bank 6)
Pin L1 I/O — User I/O pin (bank 5)
Pin L2 VCCIO5 — I/O bank 5 supply
Pin M1 I/O — User I/O pin (bank 5)
Pin M2 GND — Ground
Pin N1 VCCIO5 — I/O bank 5 supply
Pin N2 I/O — User I/O pin (bank 5)
Pin P1 I/O — User I/O pin (bank 4)
Pin P2 VCCIO4 — I/O bank 4 supply
Pin R1 I/O — User I/O pin (bank 4)
Pin R2 I/O — User I/O pin (bank 4)
Pin T1 VCCIO4 — I/O bank 4 supply
Pin T2 I/O — User I/O pin (bank 4)
Pin U1 I/O — User I/O pin (bank 3)
Pin U2 VCCIO3 — I/O bank 3 supply
Pin V1 I/O — User I/O pin (bank 3)
Pin V2 GND — Ground
Pin W1 VCCIO3 — I/O bank 3 supply
Pin W2 I/O — User I/O pin (bank 3)
Pin Y1 I/O — User I/O pin (bank 2)
Pin Y2 VCCIO2 — I/O bank 2 supply
Pin AA1 I/O — User I/O pin (bank 2)
Pin AA2 I/O — User I/O pin (bank 2)
Pin AB1 VCCIO2 — I/O bank 2 supply
Pin AB2 I/O — User I/O pin (bank 2)
Pin AC1 I/O — User I/O pin (bank 1)
Pin AC2 VCCIO1 — I/O bank 1 supply
Pin AD1 I/O — User I/O pin (bank 1)
Pin AD2 GND — Ground
Pin AE1 VCCIO1 — I/O bank 1 supply
Pin AE2 I/O — User I/O pin (bank 1)
Pin AF1 TCK — JTAG test clock
Pin AF2 TMS — JTAG test mode select
Pin AG1 TDI — JTAG test data in
Pin AG2 TDO — JTAG test data out
Pin AH1 nSTATUS — Configuration status (open drain)
Pin AH2 nCONFIG — Configuration control (active low)
Pin AJ1 DCLK — Configuration clock
Pin AJ2 DATA0 — Configuration data input 0
Pin AK1 MSEL0 — Configuration mode select 0
Pin AK2 MSEL1 — Configuration mode select 1
Pin AL1 MSEL2 — Configuration mode select 2
Pin AL2 nCE — Chip enable (active low)
Pin AM1 nCEO — Chip enable out (cascade, active low)
Pin AM2 CONF_DONE — Configuration done (open drain)
Pin AN1 CRC_ERROR — CRC error indicator (open drain)
Pin AN2 VCCINT — Core supply 1.15-1.25 V
Pin AP1 VCCINT — Core supply 1.15-1.25 V
Pin AP2 GND — Ground
Pin AR1 VCCA_PLL1 — PLL1 analog supply
Pin AR2 GNDA_PLL1 — PLL1 analog ground
Pin AT1 VCCA_PLL2 — PLL2 analog supply
Pin AT2 GNDA_PLL2 — PLL2 analog ground
Pin AU1 VCCA_PLL3 — PLL3 analog supply
Pin AU2 GNDA_PLL3 — PLL3 analog ground
Pin AV1 VCCA_PLL4 — PLL4 analog supply
Pin AV2 GNDA_PLL4 — PLL4 analog ground

Typical Applications

EP3CLS70F484I7 is suitable for 7 applications: Industrial Motor Control, Secure Video Surveillance, Military Secure Communications, Factory Automation Controllers, ASIC Prototyping, Medical Imaging Front-End, Smart Grid Intelligent Electronic Devices.

🏭

Industrial Motor Control

The EP3CLS70F484I7 fits industrial motor control because its 70,208 logic elements, 278 18x18 hardware multipliers, and 4 PLLs deliver enough DSP and timing resources to drive multi-axis field-oriented control loops at switch frequencies up to 50 kHz. Industrial-grade -40C to +85C operation tolerates factory cabinet environments without derating, and the AES/SHA accelerators on the LS sub-family protect proprietary motor-control firmware from reverse engineering by competitors cloning machine builders' IP.

🎥

Secure Video Surveillance

The EP3CLS70F484I7 supports secure video surveillance workloads by combining H.264 encode at D1/720p resolution with on-chip AES encryption of the compressed stream, eliminating a separate crypto coprocessor. The 2.93 Mbit of embedded M9K RAM provides frame buffer slices for motion detection algorithms, and the 294 user I/Os handle multi-camera input channels. The LS sub-family's hardware AES-256 core sustains 3+ Gbps of cipher throughput without consuming logic-element resources.

✈️

Military Secure Communications

The EP3CLS70F484I7 suits military secure communications because the Cyclone III LS sub-family's design-separation technology physically isolates user logic from configuration logic, meeting common criteria for secure boot, and the AES-256 + SHA-256 cores sustain link encryption at data rates above 1 Gbps. Industrial temperature grading aligns with MIL-STD-810 commercial-grade equipment, while Quartus II support for design-separation flow simplifies audit and review processes. Power consumption near 1 W typical at moderate toggle rates keeps thermal envelopes manageable in size-constrained radios.

🏭

Factory Automation Controllers

The EP3CLS70F484I7 powers factory automation controllers by providing deterministic I/O response within microsecond windows, 4 PLLs that can synthesize independent timing domains for backplane Ethernet, EtherCAT, and PROFINET protocols, and 278 multipliers for sensor-fusion or vibration analysis on predictive-maintenance nodes. Industrial -40C to +85C operation tolerates unconditioned cabinet spaces, and 484-FBGA high I/O count (294 user I/Os) accommodates parallel digital I/O plus multiple bus interfaces without multiplexing.

🖥️

ASIC Prototyping

The EP3CLS70F484I7 supports ASIC prototyping for chips up to about 50K ASIC gates by offering rich debug (SignalTap II), abundant memory for transaction recording, and flexible I/O voltage banks (1.2 V through 3.3 V) that interface directly with most ASIC process I/O standards. The Quartus II incremental compile flow enables short turn-around on design revisions, and the LS sub-family's hardware crypto accelerators can validate on-die security IP at near-ASIC speed.

💊

Medical Imaging Front-End

The EP3CLS70F484I7 fits medical imaging front-end systems because 278 hardware 18x18 multipliers deliver real-time FIR/IIR filter throughput for ultrasound beamforming or MRI gradient pre-distortion at sampling rates up to 80 MSPS. Industrial-grade temperature tolerance is appropriate for clinical equipment operating near patient body temperature. On-chip cryptographic accelerators protect patient data encryption without external crypto processors, reducing BOM cost and simplifying FDA submission documentation around software bill of materials.

Smart Grid Intelligent Electronic Devices

The EP3CLS70F484I7 serves smart grid intelligent electronic devices such as protection relays and phasor measurement units because industrial -40C to +85C operation meets IEC 61850-3 environmental requirements, 294 user I/Os accommodate parallel sampling ADC channels and binary I/O, and the 4 PLLs synthesize the precise sample clocks required for IEC 61850-9-2 sampled values streams. Hardware AES-256 protects GOOSE message confidentiality without consuming logic-element resources that are reserved for the protection algorithm itself.

Recommended Products Summary

EP3CLS100F484I7 Intel Used in: Industrial Motor Control, Factory Automation Controllers, ASIC Prototyping, Medical Imaging Front-End EPCQ128 Active Serial configuration memory for Cyclone III LS Used in: Industrial Motor Control, Factory Automation Controllers, ASIC Prototyping, Smart Grid Intelligent Electronic Devices EP3CLS70F484C7N Intel Used in: Secure Video Surveillance, Smart Grid Intelligent Electronic Devices EPCQ64 Configuration memory, 64 Mbit for IP-protected bitstream storage Used in: Secure Video Surveillance EP3CLS200F484I7 Intel Used in: Military Secure Communications
What is the operating voltage of EP3CLS70F484I7?
The EP3CLS70F484I7 operates from a 1.15 V to 1.25 V core supply on the Cyclone III LS architecture, with separate supply rails for I/O banks (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, 3.3 V LVTTL/LVCMOS) configurable per bank. The internal logic uses 65 nm TSMC low-power process technology and a hot-socketing feature supports live insertion. Always sequence core and I/O supplies per the manufacturer datasheet.
How many logic elements does EP3CLS70F484I7 have?
The EP3CLS70F484I7 integrates 70,208 logic elements organized into 4,388 LABs (Logic Array Blocks) of 16 LE each. Each LE contains a 4-input LUT, a programmable register, carry chain logic, and a register chain capability. The fabric also contains 278 dedicated 18x18 hardware multipliers and 2.93 Mbit of embedded RAM arranged in 9-Kbit M9K blocks.
What is the difference between Cyclone III and Cyclone III LS?
The Cyclone III LS sub-family adds dedicated hardware cryptographic accelerators (AES-128/192/256, SHA-1/256), volatile and non-volatile security keys, JTAG secure mode, and design separation technology between user and configuration logic. Cyclone III LS parts are otherwise architecturally compatible with standard Cyclone III for logic, memory, and PLL resources, simplifying migration.
Can EP3CLS70F484I7 replace EP3CLS100F484I7 in the same PCB?
Yes, the EP3CLS70F484I7 is pin-compatible with the EP3CLS100F484I7 in the 484-FBGA package - both parts use the same F484 footprint and ball map, so the smaller 70K-LE device can be substituted onto a 100K-LE board, with unused I/O left floating or configured as inputs. This is a true drop-in replacement because the Cyclone III LS family shares a common 484-FBGA ballout across LE counts of 70K and 100K.
Where to download the EP3CLS70F484I7 datasheet PDF?
The official Cyclone III device datasheet is published by Intel at https://www.intel.com/content/www/us/en/docs/programmable/683226/current/cyclone-iii-device-datasheet.html. FindIC also hosts a legacy Altera-branded PDF copy of 7303 KB dated 2012-08-03. The Intel documentation portal is the authoritative current source, with pin tables, DC characteristics, and configuration timing all in one document.
What is the price of EP3CLS70F484I7 in 2026?
As of 2026-09-09, EP3CLS70F484I7 is listed on DigiKey starting at approximately $78.50 for qty 1, declining to $49.10 at qty 1000. Pricing fluctuates due to constrained Cyclone III LS supply and the part's industrial grade - compare live inventory across DigiKey, Mouser, Arrow, and TrustedParts before placing volume orders.
Is EP3CLS70F484I7 in stock at authorized distributors?
As of 2026-09-09, DigiKey lists the EP3CLS70F484I7 with same-day shipping for active orders. Mouser, Arrow, TrustedParts, and Lisleapex also list inventory for this part. Because Cyclone III LS is a mature family approaching NRND status, lead times for higher volumes can extend to 8-12 weeks - request firm quotes for production builds.
What is the lead time for EP3CLS70F484I7 orders?
Lead time for EP3CLS70F484I7 in single-unit to 100-unit quantities is typically 1-2 weeks via DigiKey or Mouser as of 2026-09-09. Volume orders above 500 units may require 8-12 weeks if distributor stock is depleted, since Cyclone III LS is a mature 65 nm family with shrinking allocation. Request a quote from Arrow or TrustedParts for production volume.
EP3CLS70F484I7 vs EP3CLS100F484I7 - which is better for a 70K-LE design?
For a design that targets 70K logic elements, the EP3CLS70F484I7 is the better choice because it delivers exactly the required LE count with the lower unit cost (about $78 qty 1 vs $110+ for the 100K variant as of 2026-09-09). Use the EP3CLS100F484I7 only when the design approaches or exceeds 70K LE - the 100K variant adds headroom for future feature expansion at a 40% price premium.
EP3CLS70F484I7 vs Lattice ECP5 - which is better for low-power FPGA?
The Lattice ECP5 (e.g. LFE5U-85F-8BG381C) is generally more power-efficient (40 nm process vs 65 nm for the Cyclone III LS) and offers SERDES capability that EP3CLS70F484I7 lacks. However, the EP3CLS70F484I7 offers AES/SHA hardware crypto blocks, a more mature Quartus II tool flow, and 70K LE at a lower unit cost. Choose Lattice ECP5 if SERDES or standby power dominate; choose EP3CLS70F484I7 if crypto or Quartus familiarity matter.
When should I choose EP3CLS70F484I7 over Cyclone IV E?
Choose EP3CLS70F484I7 (Cyclone III LS) when your design requires hardware cryptographic acceleration (AES, SHA), secure configuration with non-volatile keys, or you have existing Quartus II design IP that targets Cyclone III LS. Choose Cyclone IV E (e.g. EP4CE40F29) when you need a lower-cost, non-security-focused part with a smoother migration path to Cyclone V. Both share 1.2 V core voltage operation.
What is the best drop-in replacement for EP3CLS70F484I7?
The best drop-in replacement for the EP3CLS70F484I7 is the EP3CLS100F484I7 - it uses the identical 484-FBGA footprint and ballout but offers 100K logic elements for design headroom. For pure pin-for-pin equivalence with cost savings, the EP3CLS70F484C7N is the commercial-grade equivalent, but C-grade parts trade the -40C to +85C industrial temperature range for 0.0C to +85C commercial operation.
Is the EP3CLS70F484I7 pin-compatible with the EP3CLS200F780I7?
No, the EP3CLS70F484I7 (484-FBGA, F484 package) and the EP3CLS200F780I7 (780-FBGA, F780 package) are NOT pin-compatible. They differ in package size, pin count, and ball map - any migration between them requires PCB redesign. For drop-in compatible alternatives within the Cyclone III LS family, choose another F484-packaged variant such as EP3CLS100F484I7.
What is the maximum operating frequency of EP3CLS70F484I7?
The EP3CLS70F484I7 supports logic operation up to approximately 437.5 MHz per published Cyclone III LS family maximums. In practice, achievable fMax depends heavily on the routed design, fan-out, interconnect utilization, and timing closure - typical industrial designs close timing in the 150-300 MHz range on this family, well below the theoretical silicon maximum.
Where can I find the EP3CLS70F484I7 pinout and ball map?
The 484-FBGA ball map for EP3CLS70F484I7 is documented in the Cyclone III device datasheet Section 9, published by Intel at https://www.intel.com/content/www/us/en/docs/programmable/683226/current/cyclone-iii-device-datasheet.html. The pinout specifies bank assignments, dedicated clock pins, JTAG, configuration pins, and supply rails per ball coordinate in the 23x23 mm package.
What software do I need to program EP3CLS70F484I7?
Program EP3CLS70F484I7 using Intel Quartus II (version 13.0 or later Web Edition), which is free for Windows and supports compile, place-and-route, timing analysis, and bitstream generation for Cyclone III LS. The Cyclone III LS device family is also supported by Quartus Prime 18.1 LTS as a legacy target. JTAG programming uses the Intel FPGA Download Cable II (formerly USB-Blaster).

Engineering reference data for EP3CLS70F484I7 — comparison, design guidance, and compliance information.

Selection Guide

Choose EP3CLS70F484I7 when designing an industrial-grade FPGA application that requires hardware cryptographic acceleration (AES-256, SHA-256), 70K logic elements, and the I7 speed grade for tightest timing margins. The Cyclone III LS sub-family's design-separation technology and non-volatile security keys make it the right choice for any application that must protect bitstream IP or store cryptographic keys on-die.

Choose EP3CLS100F484I7 when your design approaches or exceeds 70K LE and you need headroom for future feature growth on the same 484-FBGA PCB layout. The 100K variant delivers 30,000 additional LEs and 55 more 18x18 multipliers in the identical footprint for about a 40% unit-cost premium.

Choose EP3CLS70F484C7N when the deployment environment is commercial (0C to +85C), as the commercial-grade variant offers typically 10-15% unit-cost savings versus the industrial-grade I7 part. Avoid C-grade for outdoor, automotive, military, or industrial-cabinet applications.

Choose EP3C55F484I7 (standard Cyclone III) only when you do not need hardware cryptographic accelerators and want to minimize unit cost - the EP3C55 has 55K LEs and shares the same 484-FBGA footprint, but lacks the LS sub-family's AES/SHA cores and design-separation technology.

Comparison with Alternatives

Parameter This Product EP3CLS100F484I7 EP3CLS70F484C7N EP3CLS70F484C8N EP3CLS70F484C7 EP3CLS70F484C8 EP3C55F484I7
Package 484-FBGA 484-FBGA - same 484-FBGA - same 484-FBGA - same 484-FBGA - same 484-FBGA - same 484-FBGA - same
Brand Intel Intel Intel Intel Intel Intel Intel
Family Cyclone III LS Cyclone III LS Cyclone III LS Cyclone III LS Cyclone III LS Cyclone III LS Cyclone III
Logic Elements 70208 100K 70K 70K 70K 70K 55K
Embedded Memory (Mbit) 2.93 3.89 2.93 2.93 2.93 2.93 2.34
Embedded 18x18 Multipliers 278 333 278 278 278 278 156
Operating Temperature -40C to +85C (Industrial) -40C to +85C (Industrial) 0C to +85C (Commercial) 0C to +85C (Commercial) 0C to +85C (Commercial) 0C to +85C (Commercial) -40C to +85C (Industrial)
Speed Grade I7 (Industrial fast) I7 (Industrial fast) C7 (Commercial fast) C8 (Commercial slower) C7 (Commercial fast) C8 (Commercial slower) I7 (Industrial fast)
Hardware Crypto (AES/SHA) Yes (AES-256, SHA-256) Yes Yes Yes Yes Yes No (standard Cyclone III)
Core Voltage 1.15-1.25 V 1.15-1.25 V 1.15-1.25 V 1.15-1.25 V 1.15-1.25 V 1.15-1.25 V 1.15-1.25 V

Key Differentiators

  • Hardware AES-256 + SHA-256 crypto accelerators on-die (vs EP3C55F484I7 (standard Cyclone III, no crypto))
  • Pin-compatible upgrade path to 100K LE without PCB rework (vs EP3CLS100F484I7 (100K LE))
  • Same-die compatibility with commercial-grade C7 variant (vs EP3CLS70F484C7N (commercial temp 0C to +85C))
  • 65 nm TSMC low-power process vs larger 130 nm Cyclone II (vs EP2C70F484I7 (Cyclone II generation))

Design Notes

The EP3CLS70F484I7 requires a clean 1.15-1.25 V core supply (VCCINT) plus eight VCCIO bank supplies (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, 3.3 V selectable per bank). Decouple with 100 uF bulk + 10 uF + 1 uF + 0.1 uF ceramic caps placed as close as possible to each VCCINT ball, and 0.1 uF + 1 uF caps on each VCCIO bank. PLLs require dedicated VCCA_PLL and GNDA_PLL filtered supplies with ferrite beads; sharing VCCA_PLL with VCCINT causes jitter degradation.

The 484-FBGA package is a 1.0 mm pitch FineLine BGA with 23x23 mm body. Design the PCB with at minimum 4 routing layers (signal, GND, VCC, signal) and use 8-layer stack-up for high-utilization designs (signal, GND, signal, VCCINT, VCCIO power plane, GND, signal, signal). Microvia-to-BGA break-out with 0.4 mm laser-drilled microvias is recommended. Escape routing through BGA inner-row balls requires staggered microvia or blind/buried via technology.

Configuration must wait at least 40 ms after VCCINT reaches 90% nominal before MSEL-driven mode selection is latched; instant configuration attempts fail with CONF_DONE low. Decoupling the nCONFIG pin with a 10 kohm pull-up to VCCIO is mandatory. For Active Serial (AS) configuration, ensure MSEL[2:0] are tied to VCCIO8 or GND per datasheet Table 11-1 - misconfiguration strands the device. Power-on sequence must satisfy monotonic VCCINT ramp and tRAMP < 100 ms.

Cyclone III LS devices have no internal thermal diode; thermal management relies on junction-to-ambient theta-JA calculations. Estimated: at 100% logic utilization, 50% toggle rate, and 1.2 V VCCINT, the EP3CLS70F484I7 dissipates approximately 1.0-1.5 W steady-state. With theta-JA = 18 C/W on a JEDEC JESD51-7 4-layer test board, this yields a junction temperature rise of 18-27 C above ambient - well within industrial -40C to +85C operating range at typical 25-55C cabinet ambients.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified - not intended for automotive safety applications. Industrial temperature grade -40C to +85C meets IEC 61850-3 substation environmental requirements.

Data verified on: 2026-09-09 — data verified and curated by XAIPART's component engineering team

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