EP3CLS70F780C8 vs EP3CLS70F780I7N Comparison

Detailed side-by-side comparison of EP3CLS70F780C8 by Intel and EP3CLS70F780I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3CLS70F780C8 EP3CLS70F780I7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $56.75 $880.00
Family Cyclone III LS β€”
Logic Elements (LE) 70,208 β€”
Logic Array Blocks (LAB) 4,463 β€”
Embedded Memory Bits 3,068,928 bit β€”
Embedded Memory (M9K blocks) 305 β€”
Embedded 18x18 Multipliers 244 β€”
Maximum User I/O Pins 413 β€”
Maximum Operating Frequency 402 MHz β€”
Process Technology 65 nm TSMC low-power CMOS β€”
Core Supply Voltage 1.2 V β€”
Package 780-ball FineLine BGA (FBGA-780) β€”
Operating Junction Temperature 0 Β°C to +85 Β°C (commercial) β€”
PLLs 4 general-purpose PLLs β€”
Global Clock Networks 20 β€”
Security Features AES bitstream encryption, JTAG tamper protection β€”
Configuration Scheme Active serial (AS), passive serial (PS), JTAG, Fast Passive Parallel (FPP) β€”
RoHS Status Compliant unknown
Mounting Type Surface Mount (BGA) Surface Mount
Device Type β€” Field Programmable Gate Array (FPGA)
Series β€” Cyclone III LS
Logic Elements β€” 70,208
Embedded Memory β€” 3,068,928 bits
Maximum User I/O β€” 413 pins
Supply Voltage β€” 1.2 V
Temperature Grade β€” Industrial
Package Type β€” BGA
Package Pin Count β€” 780 balls
Package Shape β€” Square
Terminal Form β€” Ball
Configuration Technology β€” SRAM-based FPGA
Configuration Method β€” [DATA_NEEDED: configuration method]
Operating Temperature β€” [DATA_NEEDED: operating temperature]
REACH Status β€” unknown
AEC-Q100 Qualification β€” unknown

Datasheets & Resources

Browse All Products Create BOM Request Quote