EP3SE110F1152I4 vs EP3SE110F1152C4N Comparison

Detailed side-by-side comparison of EP3SE110F1152I4 by Intel and EP3SE110F1152C4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3SE110F1152C4N EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel

EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel

EP3SE110F1152C4N ⚠ Last Time Buy

Specification Comparison

Parameter EP3SE110F1152I4 EP3SE110F1152C4N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $1,020.00 $1,395.00
Family Stratix III E Stratix III Enhanced (E)
Logic Elements (LE) 107,500 β€”
Logic Array Blocks (LABs) 4300 4300
DSP Blocks 744 β€”
Embedded Memory (bits) 8,936,448 β€”
User I/Os 744 β€”
Package 1152-ball FCBGA (Flip-Chip BGA) 1152-ball FCBGA (Flip-Chip BGA)
Operating Temperature -40Β°C to +100Β°C (Industrial) 0C to +85C (Commercial)
Process Node 40 nm β€”
Maximum User I/O Speed [DATA_NEEDED: maximum I/O toggle rate MHz] β€”
PLLs 24 β€”
Configuration Modes JTAG, Passive Serial (PS), Fast Passive Parallel (FPP), Active Serial (AS) β€”
Memory Interface Support DDR3, DDR2, QDRII+, RLDRAM II β€”
Transceiver Protocol Support PCIe Gen1/Gen2, Gbit Ethernet, XAUI, Serial RapidIO β€”
RoHS Status Compliant Compliant
Lead-Free Yes β€”
Mounting Type Surface Mount (BGA) Surface Mount
MSL Level [DATA_NEEDED: MSL rating] 3 (168 hours)
Logic Elements β€” 107,500
Memory Bits β€” 8,936,448
Embedded Multipliers (18x18) β€” 896
User I/O Pins β€” 744
Core Voltage β€” 1.1 V
Process Technology β€” 65 nm
Maximum Operating Frequency β€” 450 MHz
Configuration Method β€” Passive Serial / Fast Passive Parallel / JTAG / AES-256
Design Software β€” Quartus II (v9.1 or later)

Datasheets & Resources

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