EP3SE260F1152C2N vs EP3SE260F1152C3N Comparison

Detailed side-by-side comparison of EP3SE260F1152C2N by Intel and EP3SE260F1152C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE260F1152C2N EP3SE260F1152C3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Active
Stock Status In Stock In Stock
Unit Price (USD) $11,000.00 $7,500.00
Series Stratix III E Stratix III E
Family FPGA - Field Programmable Gate Array β€”
Number of Logic Elements 255000 β€”
Number of LABs/CLBs 10200 β€”
Total Memory Bits 16672768 β€”
Number of I/O 744 β€”
Voltage - Supply 1.1 V β€”
Mounting Type Surface Mount Surface Mount
Operating Temperature [DATA_NEEDED: operating temperature grade] 0 C to +85 C (Commercial)
Package / Case 1152-BBGA, FCBGA β€”
Process Technology 65 nm 65 nm
Maximum Frequency 600 MHz β€”
Supplier Device Package 1152-FCBGA β€”
MSL Level [DATA_NEEDED: MSL rating] β€”
RoHS Status Compliant Compliant
Lead Free Yes (per EP3SE260F1152C2G comparison) β€”
ECCN [DATA_NEEDED: ECCN code] β€”
Moisture Sensitivity [DATA_NEEDED: MSL level] β€”
Logic Elements / Cells β€” 255,000
Embedded Memory Bits β€” 16,672,768 bits
Logic Array Blocks (LABs) β€” 10,200
User I/O Count β€” 744
Package β€” 1152-BBGA, FCBGA
Core Voltage β€” 1.1 V
Transceivers β€” Integrated high-speed transceivers
DSP Blocks β€” Yes (dedicated multiplier/accumulator)
Embedded Memory Type β€” TriMatrix (true dual-port, FIFO, ROM, RAM)
External Memory Support β€” DDR3, DDR2, QDR II+, RLDRAM II
Configuration Modes β€” AS, AP, PS, FPP, JTAG
Partial Reconfiguration β€” Supported
Programmable Power Technology β€” Yes (up to 50% dynamic power reduction)

Datasheets & Resources

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