EP3SE260F1152C2N vs EP3SE260F1152C4 Comparison

Detailed side-by-side comparison of EP3SE260F1152C2N by Intel and EP3SE260F1152C4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE260F1152C2N EP3SE260F1152C4
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $11,000.00 $8,900.00
Series Stratix III E Stratix III E (Enhanced)
Family FPGA - Field Programmable Gate Array Stratix III
Number of Logic Elements 255000 β€”
Number of LABs/CLBs 10200 β€”
Total Memory Bits 16672768 β€”
Number of I/O 744 β€”
Voltage - Supply 1.1 V β€”
Mounting Type Surface Mount Surface Mount (BGA)
Operating Temperature [DATA_NEEDED: operating temperature grade] Commercial (0C to +85C) - inferred from speed grade C4
Package / Case 1152-BBGA, FCBGA β€”
Process Technology 65 nm 65 nm CMOS (TSMC)
Maximum Frequency 600 MHz β€”
Supplier Device Package 1152-FCBGA β€”
MSL Level [DATA_NEEDED: MSL rating] β€”
RoHS Status Compliant Compliant (per distributor listings)
Lead Free Yes (per EP3SE260F1152C2G comparison) β€”
ECCN [DATA_NEEDED: ECCN code] β€”
Moisture Sensitivity [DATA_NEEDED: MSL level] β€”
Logic Elements (LE) β€” 255,000
Logic Array Blocks (LABs) β€” 10,200
Embedded Memory Bits β€” 16,672,768
User I/O Count β€” 744
Core Voltage β€” 1.1 V
Speed Grade β€” C4 (slowest commercial grade)
Maximum Internal Frequency β€” ~450 MHz (per FPGAkey listing)
Package β€” 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA)
Package Code β€” BGA, square
I/O Standards Supported β€” LVDS, LVTTL, LVCMOS, SSTL, HSTL
Configuration Modes β€” Passive Serial, Fast Passive Parallel, JTAG
DSP Blocks (18x18 Multipliers) β€” 384
PLL Count β€” [DATA_NEEDED: PLL count]
Transceivers β€” External PHY interface only (no integrated GXB)

Datasheets & Resources

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