EP3SE260F1152C3N vs EP3SE260F1152C4 Comparison

Detailed side-by-side comparison of EP3SE260F1152C3N by Intel and EP3SE260F1152C4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE260F1152C3N EP3SE260F1152C4
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $7,500.00 $8,900.00
Series Stratix III E Stratix III E (Enhanced)
Logic Elements / Cells 255,000 β€”
Embedded Memory Bits 16,672,768 bits 16,672,768
Logic Array Blocks (LABs) 10,200 10,200
User I/O Count 744 744
Package 1152-BBGA, FCBGA 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA)
Mounting Type Surface Mount Surface Mount (BGA)
Process Technology 65 nm 65 nm CMOS (TSMC)
Core Voltage 1.1 V 1.1 V
Operating Temperature 0 C to +85 C (Commercial) Commercial (0C to +85C) - inferred from speed grade C4
Transceivers Integrated high-speed transceivers External PHY interface only (no integrated GXB)
DSP Blocks Yes (dedicated multiplier/accumulator) β€”
Embedded Memory Type TriMatrix (true dual-port, FIFO, ROM, RAM) β€”
External Memory Support DDR3, DDR2, QDR II+, RLDRAM II β€”
Configuration Modes AS, AP, PS, FPP, JTAG Passive Serial, Fast Passive Parallel, JTAG
Partial Reconfiguration Supported β€”
Programmable Power Technology Yes (up to 50% dynamic power reduction) β€”
RoHS Status Compliant Compliant (per distributor listings)
Family β€” Stratix III
Logic Elements (LE) β€” 255,000
Speed Grade β€” C4 (slowest commercial grade)
Maximum Internal Frequency β€” ~450 MHz (per FPGAkey listing)
Package Code β€” BGA, square
I/O Standards Supported β€” LVDS, LVTTL, LVCMOS, SSTL, HSTL
DSP Blocks (18x18 Multipliers) β€” 384
PLL Count β€” [DATA_NEEDED: PLL count]

Datasheets & Resources

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