EP3SE260F1517C3N vs EP3SE260F1517I3N Comparison
Detailed side-by-side comparison of EP3SE260F1517C3N by Intel and EP3SE260F1517I3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SE260F1517C3N | EP3SE260F1517I3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $9,850.00 | $2,275.00 |
| Family | Stratix III E | Stratixยฎ III E |
| Logic Elements | 254,400 | 255,000 |
| Embedded Memory | 16,672,768 bits (16.7 Mbits) | โ |
| User I/Os | 976 | โ |
| DSP Blocks (18x18 Multipliers) | 816 | โ |
| M9K Memory Blocks | 1,040 | โ |
| Maximum Transceiver Data Rate | 600 Mbps | โ |
| PLLs | 4 | โ |
| Global Clock Networks | 16 | โ |
| Package | 1517-BBGA (FCBGA) | 1517-ball FC-FBGA |
| Process Technology | 65 nm TSMC low-power CMOS | 65 nm |
| Speed Grade | C3 (commercial) | -3 (fastest) |
| Operating Junction Temperature | 0 C to +85 C (commercial) | -40 ยฐC to +100 ยฐC |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | Compliant | Compliant |
| External Memory Interfaces | DDR3, DDR2, QDRII+, RLDRAM2 | โ |
| Embedded Memory Bits | โ | 16,672,768 bits |
| Logic Array Blocks (LABs) | โ | 10,200 |
| User I/O Count | โ | 976 |
| Core Voltage | โ | 1.1 V |
| Temperature Grade | โ | Industrial (I): -40 ยฐC to +100 ยฐC |
| Configuration Method | โ | JTAG / Passive Serial / Active Serial |
| Lead-Free | โ | Yes |
| Internal Logic Performance | โ | Up to 500 MHz |
| Memory Subsystems | โ | M9K + M144K block RAM, DDR2/DDR3/QDR II+ controllers |
| DSP Blocks | โ | Yes (dedicated multiply-accumulate) |