EP3SL200H780C2N vs EP3SL200H780C3N Comparison
Detailed side-by-side comparison of EP3SL200H780C2N by Intel and EP3SL200H780C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SL200H780C2N | EP3SL200H780C3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $6,050.00 | $4,995.00 |
| Family | Stratix III L | Stratix III L (low-power) |
| Logic Elements | 200,000 | 200,000 |
| Adaptive Logic Modules (ALMs) | 80,000 | β |
| User I/O Count | 488 | β |
| Embedded Memory Bits | 10,901,504 | 10,901,504 bits |
| Process Technology | 65 nm CMOS | β |
| Core Voltage | 1.1 V | β |
| Maximum Internal Frequency | 800 MHz | β |
| Speed Grade | C2 | C3 (commercial, -3 speed) |
| Transceivers | Per family capability - not specified for this OPN | 24 channels, up to 3.75 Gbps |
| Package | 780-ball HBGA / FCBGA | 780-Ball FCBGA (HBGA), 29 x 29 mm |
| Package Code | PBGA780 / HBGA-780 | β |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | Commercial (0C to +85C) | 0C to +85C (commercial) |
| Lead Free | Yes | β |
| RoHS Status | Compliant | β |
| Process Node | β | 40 nm |
| Logic Array Blocks (LABs) | β | 8,000 |
| User I/Os | β | 488 |
| Maximum Internal Clock Frequency | β | 800 MHz |
| DSP Blocks | β | 384 |
| Voltage - Core | β | 0.9 V / 1.0 V (core, VCC) |
| Voltage - I/O | β | 1.2 V to 3.3 V (VCCIO banks) |
| MSL Level | β | 3 |
| Lead-Free / RoHS | β | Yes |
| Mounting Pitch | β | 1.0 mm ball pitch |
| PLLs | β | 12 (Stratix III PLL array) |
| Configuration | β | JTAG IEEE Std 1149.1, passive/active serial |