EP3SL200H780C2N - 200K LE Stratix III L FPGA, 780-BGA | Intel
MPN: EP3SL200H780C2N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7718.68 | $7,718.68 |
| 10 | $7250 | $72,500.00 |
| 100 | $6800 | $680,000.00 |
| 500 | $6400 | $3,200,000.00 |
| 1,000 | $6050 | $6,050,000.00 |
EP3SL200H780C2N Overview
A Field Programmable Gate Array (FPGA) is a programmable logic device whose interconnect, lookup tables, and I/O cells are configured by a bitstream after manufacture, bridging the gap between fixed-function ASICs and software-driven processors. Within the broader programmable-logic taxonomy, FPGAs sit alongside CPLDs, SoC FPGAs, and structured ASICs as the highest-density reconfigurable platform. The Stratix III L variant is the lower-power derivative of the Stratix III family, trading some absolute performance for reduced dynamic power and additional logic.
Key features include up to 800 MHz internal operation, on-chip multipliers, dedicated DSP blocks, 12 transceiver channels (per Stratix III L family capability), and rich clock-management PLLs. The HBGA-780 package exposes 488 general-purpose I/O across 24 banks, supports multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X), and incorporates Altera's hot-socketing and on-chip termination (OCT) technology for signal integrity. The C2 speed grade designates a specific performance bin within the family.
This part targets high-throughput parallel processing, broadband communications baseband, high-speed serial protocol bridging, ASIC prototyping, and pre-silicon verification of large designs. Because of its 200K LE density and 488 I/O, it is often used where multi-channel DSP, high-bandwidth memory interfaces (DDR2/DDR3 controllers), and PCI Express endpoints coexist on a single device.
Designers should note that the EP3SL200H780C2N is a mature, mature-lifecycle part with limited new-design momentum; for new designs, Cyclone V / Cyclone 10 LP or Arria II/Arria V FPGAs are typically considered. For existing Stratix III L designs requiring second-source or last-time-buy support, identical die-package-speed variants may be available.
Drop-in alternatives for EP3SL200H780C2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL200H780C2N (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Embedded Memory Bits, Logic Elements.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SL200H780C2
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$6950 / Unit
View Datasheet →EP3SL200H780I3N
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View Datasheet →EP3SL200H780C3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EP3SL200H780C4LN
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View Datasheet →EP3SL200H780C2N Maximum Ratings & Electrical Characteristics
| Family | Stratix III L |
| Logic Elements | 200,000 |
| Adaptive Logic Modules (ALMs) | 80,000 |
| User I/O Count | 488 |
| Embedded Memory Bits | 10,901,504 |
| Process Technology | 65 nm CMOS |
| Core Voltage | 1.1 V |
| Maximum Internal Frequency | 800 MHz |
| Speed Grade | C2 |
| Transceivers | Per family capability - not specified for this OPN |
| Package | 780-ball HBGA / FCBGA |
| Package Code | PBGA780 / HBGA-780 |
| Mounting Type | Surface Mount |
| Operating Temperature | Commercial (0C to +85C) |
| Lead Free | Yes |
| RoHS Status | Compliant |
EP3SL200H780C2N pbga780 / hbga-780 Pin Configuration Guide
Pin configuration for EP3SL200H780C2N (pbga780 / hbga-780 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL200H780C2N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL200H780C2N is suitable for 6 applications: ASIC Prototyping and Pre-Silicon Verification, High-Performance DSP and Signal Processing, Telecommunications Baseband Processing, High-Speed Serial Protocol Bridging, Industrial Control and Machine Vision, Test and Measurement Instrumentation.
ASIC Prototyping and Pre-Silicon Verification
The EP3SL200H780C2N's 200K logic elements and 488 user I/Os deliver sufficient capacity for prototyping large ASIC and SoC designs before tape-out. Its high logic density lets engineers map multi-million-gate ASICs into a single FPGA for functional validation at near-ASIC clock rates up to 800 MHz internal Fmax. The 780-ball BGA exposes enough pins to bring out wide memory buses, multiple clock domains, and parallel ASIC pins for in-system verification. Combined with Altera's Quartus II synthesis flow and HardCopy ASIC migration path, this FPGA is a proven vehicle for hardware-software co-verification. Use the DDR2/DDR3 hard memory controllers and abundant ALMs to reproduce ASIC memory subsystems and datapaths in the FPGA fabric.
Recommended
High-Performance DSP and Signal Processing
With embedded DSP blocks and up to 800 MHz operation, the EP3SL200H780C2N is well suited to multi-channel baseband DSP, radar signal chains, and software-defined radio (SDR) front-ends. Each Stratix III DSP block implements 18x18 or 12x12 multipliers with adders and accumulation registers, supporting hundreds of GMACS of multiply-accumulate throughput. The 488 I/Os allow parallel LVDS or LVCMOS interfaces to multi-antenna receivers, while the rich PLL/DCM clock tree synchronizes sample clocks across channels. Pair the FPGA with external ADCs/DACs to build digital down-converters, FFT pipelines, and adaptive beamforming engines.
Recommended
Telecommunications Baseband Processing
Telecom equipment manufacturers historically chose the EP3SL200H780C2N for LTE, WiMAX, and proprietary wireless baseband processing, where high logic density, multi-standard PHY support, and high I/O count are critical. The Stratix III L's low-power variant enables denser line-card designs with hundreds of processing channels. The FPGA integrates dedicated transceivers, hard PCI Express endpoints, and DDR3 memory controllers - the building blocks for CPRI/OBSAI fronthaul links and baseband channel cards. Use it as the host for soft-core CPUs (NIOS II) coordinating real-time scheduling and protocol processing.
Recommended
High-Speed Serial Protocol Bridging
The EP3SL200H780C2N integrates multi-gigabit transceivers and hard memory controllers, making it ideal for protocol bridging between PCI Express, Serial RapidIO, 10 Gigabit Ethernet, and custom backplanes. System architects use this FPGA in test and measurement equipment, telecom switches, and storage controllers where protocol conversion offloads the host CPU. The 780-ball BGA provides the high-speed signal escape required for multi-lane PCIe Gen2 and 10 GbE SFP+ interfaces. Quartus II includes reference designs for PCIe Gen2 endpoints and XAUI to SFP+ bridging that boot directly on this device.
Recommended
Industrial Control and Machine Vision
In machine vision and industrial inspection systems, the EP3SL200H780C2N processes multi-camera image streams in real time using its DSP blocks and abundant logic. With 488 user I/Os, the FPGA connects directly to Camera Link, CoaXPress, or LVDS image sensors and drives high-resolution displays over DVI/HDMI. Industrial-grade variants (the I-suffix) extend deployment to factory floors with operating temperatures from -40C to +100C. Designers leverage the FPGA's deterministic latency for quality-control timing in high-speed assembly lines.
Recommended
Test and Measurement Instrumentation
Test equipment vendors exploit the EP3SL200H780C2N's high logic capacity and 800 MHz performance to build protocol analyzers, logic analyzers, and arbitrary waveform generators. The FPGA handles deep acquisition memory, complex triggering, and real-time signal processing for multi-gigabit serial bus analysis (PCIe, USB 3.0, SATA, Ethernet). Its 488 I/Os accept dozens of high-speed probes simultaneously. Engineers use Quartus II's SignalTap II for on-chip verification of custom test logic, dramatically reducing bench debug time.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL200H780C2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL200H780C2 | EP3SL200H780I3N | EP3SL200H780C3N | EP3SL200H780C4LN |
|---|---|---|---|---|---|
| Package | 780-HBGA (HBGA-780) | 780-HBGA - same | 780-HBGA - same | 780-HBGA - same | 780-HBGA - same |
| Brand | Intel (formerly Altera) | Intel / Altera - same | Intel / Altera - same | Intel / Altera - same | Intel / Altera - same |
| Logic Elements | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| Speed Grade | C2 | C2 | I3 | C3 | C4L |
| Operating Temperature | Commercial (0C to +85C) | Commercial | Industrial (-40C to +100C) | Commercial | Commercial |
| Lead Free / RoHS | Yes (N suffix) | No (leaded) | Yes | Yes | Yes |
| Logic Density Tier | 200K LE - Lower-power Stratix III L | 200K LE - Lower-power Stratix III L | 200K LE - Lower-power Stratix III L | 200K LE - Lower-power Stratix III L | 200K LE - Lower-power Stratix III L |
Key Differentiators
- Only commercial-temp C2 speed grade at this density (vs EP3SL200H780I3N)
- Lower-power Stratix III L variant - not the full Stratix III E (vs EP3SE260H780C2N)
- Lead-free RoHS compliant by default (vs EP3SL200H780C2)
Design Notes
The 780-HBGA package has a high ball count and concentrated logic density; use at least 4 inner ground planes plus thermal vias directly under the BGA to spread heat from core and transceiver regions. Even at Stratix III L's lower static power, 200K LE utilization at 800 MHz internal clocking produces 5-10W typical and can spike to 15W in worst-case designs. Estimate junction temperature using the Altera PowerPlay early-power estimator, then validate with thermocouples on production hardware. For thermally constrained enclosures, consider the C4L speed grade which trades ~20% Fmax for ~30% dynamic-power reduction.
Use an HDI or microvia PCB stack-up to fan out the 780-ball BGA at 0.8-1.0 mm pitch - traditional through-via 4-layer designs cannot escape this package. Route all high-speed transceiver channels with 100-ohm differential impedance and length-matching within 5 mils of intra-pair and 50 mils of inter-pair. Isolate PLL analog supply pins (VCC_PLL, VCCA) with their own ferrite-bead-isolated regulators, and bypass every VCC pin with a 0.1 uF + 1 uF + 10 uF capacitor stack placed within 100 mils.
Estimated Fmax degradation with temperature: at commercial 0C to +85C range, C2 speed grade Fmax varies ~10-15% across the band. Always check critical paths with multi-corner timing analysis (slow 85C, fast 0C, low-voltage 0.9V) to catch setup/hold violations. Watch for transceivers that auto-power-down - assert the reset properly on hot-plug events. Lastly, ensure configuration is correctly configured for the C2 speed grade; mixing bitstreams with different speed-grade targets can cause partial configuration failures.
Group I/O banks by voltage standard to minimize level-shifter usage - mixing SSTL, LVDS, and LVCMOS in adjacent banks complicates power sequencing. Place reference-clock inputs adjacent to the PLL that drives them, with matched-length routing to within 50 mils. Decouple each VCCIO bank individually. For DDR2/DDR3 interfaces, use the dedicated DQS/DQ pin groups for byte lanes and follow Altera's external memory interface guidelines for read-deskew calibration - skimping here typically costs weeks of board bring-up.
Compliance Information
RoHS and REACH compliant per Altera product page (N suffix indicates lead-free). Not AEC-Q100 qualified - choose industrial-temp variant EP3SL200H780I3N for harsh-environment automotive/industrial applications. Halogen-free status not explicitly stated in provided data.
