EP3SL200H780C3N vs EP3SL200H780C2N Comparison

Detailed side-by-side comparison of EP3SL200H780C3N by Intel and EP3SL200H780C2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SL200H780C3N EP3SL200H780C2N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $4,995.00 $6,050.00
Family Stratix III L (low-power) Stratix III L
Process Node 40 nm β€”
Logic Elements 200,000 200,000
Embedded Memory Bits 10,901,504 bits 10,901,504
Logic Array Blocks (LABs) 8,000 β€”
User I/Os 488 β€”
Package 780-Ball FCBGA (HBGA), 29 x 29 mm 780-ball HBGA / FCBGA
Mounting Type Surface Mount Surface Mount
Maximum Internal Clock Frequency 800 MHz β€”
Transceivers 24 channels, up to 3.75 Gbps Per family capability - not specified for this OPN
DSP Blocks 384 β€”
Speed Grade C3 (commercial, -3 speed) C2
Operating Temperature 0C to +85C (commercial) Commercial (0C to +85C)
Voltage - Core 0.9 V / 1.0 V (core, VCC) β€”
Voltage - I/O 1.2 V to 3.3 V (VCCIO banks) β€”
MSL Level 3 β€”
Lead-Free / RoHS Yes β€”
Mounting Pitch 1.0 mm ball pitch β€”
PLLs 12 (Stratix III PLL array) β€”
Configuration JTAG IEEE Std 1149.1, passive/active serial β€”
Adaptive Logic Modules (ALMs) β€” 80,000
User I/O Count β€” 488
Process Technology β€” 65 nm CMOS
Core Voltage β€” 1.1 V
Maximum Internal Frequency β€” 800 MHz
Package Code β€” PBGA780 / HBGA-780
Lead Free β€” Yes
RoHS Status β€” Compliant

Datasheets & Resources

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