EP3SL200H780C3N vs EP3SL200H780I3 Comparison

Detailed side-by-side comparison of EP3SL200H780C3N by Intel and EP3SL200H780I3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SL200H780C3N EP3SL200H780I3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $4,995.00 $7,980.00
Family Stratix III L (low-power) Stratix III
Process Node 40 nm β€”
Logic Elements 200,000 200,000
Embedded Memory Bits 10,901,504 bits β€”
Logic Array Blocks (LABs) 8,000 β€”
User I/Os 488 β€”
Package 780-Ball FCBGA (HBGA), 29 x 29 mm 780-BBGA, FCBGA (HBGA-780)
Mounting Type Surface Mount Surface Mount
Maximum Internal Clock Frequency 800 MHz β€”
Transceivers 24 channels, up to 3.75 Gbps β€”
DSP Blocks 384 β€”
Speed Grade C3 (commercial, -3 speed) β€”
Operating Temperature 0C to +85C (commercial) -40C to +100C (Industrial)
Voltage - Core 0.9 V / 1.0 V (core, VCC) β€”
Voltage - I/O 1.2 V to 3.3 V (VCCIO banks) β€”
MSL Level 3 β€”
Lead-Free / RoHS Yes Compliant (lead-free)
Mounting Pitch 1.0 mm ball pitch β€”
PLLs 12 (Stratix III PLL array) 12
Configuration JTAG IEEE Std 1149.1, passive/active serial β€”
Series β€” Stratix III L
LABs (Logic Array Blocks) β€” 8000
Total RAM Bits β€” 10,901,504 (10,900 Kb)
User I/O Count β€” 488
Number of I/O Banks β€” [DATA_NEEDED: I/O banks]
Embedded Multipliers (DSP blocks) β€” 384 (18x18)
Process Technology β€” 65 nm CMOS
Core Voltage β€” 1.1 V
Maximum Operating Frequency β€” 717 MHz
Supplier Device Package β€” 780-FBGA (29x29 mm)

Datasheets & Resources

Browse All Products Create BOM Request Quote