EP3SL200H780I3 vs EP3SL200H780C3N Comparison
Detailed side-by-side comparison of EP3SL200H780I3 by Intel and EP3SL200H780C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SL200H780I3 | EP3SL200H780C3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $7,980.00 | $4,995.00 |
| Series | Stratix III L | β |
| Family | Stratix III | Stratix III L (low-power) |
| Logic Elements | 200,000 | 200,000 |
| LABs (Logic Array Blocks) | 8000 | β |
| Total RAM Bits | 10,901,504 (10,900 Kb) | β |
| User I/O Count | 488 | β |
| Number of I/O Banks | [DATA_NEEDED: I/O banks] | β |
| Embedded Multipliers (DSP blocks) | 384 (18x18) | β |
| PLLs | 12 | 12 (Stratix III PLL array) |
| Process Technology | 65 nm CMOS | β |
| Core Voltage | 1.1 V | β |
| Maximum Operating Frequency | 717 MHz | β |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (commercial) |
| Package | 780-BBGA, FCBGA (HBGA-780) | 780-Ball FCBGA (HBGA), 29 x 29 mm |
| Mounting Type | Surface Mount | Surface Mount |
| Supplier Device Package | 780-FBGA (29x29 mm) | β |
| Lead-Free / RoHS | Compliant (lead-free) | Yes |
| Process Node | β | 40 nm |
| Embedded Memory Bits | β | 10,901,504 bits |
| Logic Array Blocks (LABs) | β | 8,000 |
| User I/Os | β | 488 |
| Maximum Internal Clock Frequency | β | 800 MHz |
| Transceivers | β | 24 channels, up to 3.75 Gbps |
| DSP Blocks | β | 384 |
| Speed Grade | β | C3 (commercial, -3 speed) |
| Voltage - Core | β | 0.9 V / 1.0 V (core, VCC) |
| Voltage - I/O | β | 1.2 V to 3.3 V (VCCIO banks) |
| MSL Level | β | 3 |
| Mounting Pitch | β | 1.0 mm ball pitch |
| Configuration | β | JTAG IEEE Std 1149.1, passive/active serial |