EP3SL200H780I4N vs EP3SL200H780C3N Comparison
Detailed side-by-side comparison of EP3SL200H780I4N by Intel and EP3SL200H780C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3SL200H780I4N - Stratix III L FPGA 200K LE 780-HBGA | Intel
EP3SL200H780I4N β Last Time BuySpecification Comparison
| Parameter | EP3SL200H780I4N | EP3SL200H780C3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $4,750.00 | $4,995.00 |
| Series | Stratix III L | β |
| Family | Stratix III (Logic-rich variant) | Stratix III L (low-power) |
| Logic Elements | 200,000 | 200,000 |
| Logic Array Blocks (LABs) | 8,000 | 8,000 |
| Embedded Memory (bits) | 10,901,504 | β |
| User I/Os | 488 | 488 |
| Core Voltage | 1.1 V (0.86 V to 1.15 V range) | β |
| Process Technology | 65 nm CMOS | β |
| Fabric Frequency (typical) | 450 MHz | β |
| Speed Grade | I4 | C3 (commercial, -3 speed) |
| Operating Temperature Range | -40C to +100C (industrial) | β |
| Package | 780-ball FCBGA (Flip-Chip BGA, FineLine) | 780-Ball FCBGA (HBGA), 29 x 29 mm |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Lead-Free | Yes (suffix N) | β |
| RoHS Status | Compliant | β |
| Process Node | β | 40 nm |
| Embedded Memory Bits | β | 10,901,504 bits |
| Maximum Internal Clock Frequency | β | 800 MHz |
| Transceivers | β | 24 channels, up to 3.75 Gbps |
| DSP Blocks | β | 384 |
| Operating Temperature | β | 0C to +85C (commercial) |
| Voltage - Core | β | 0.9 V / 1.0 V (core, VCC) |
| Voltage - I/O | β | 1.2 V to 3.3 V (VCCIO banks) |
| MSL Level | β | 3 |
| Lead-Free / RoHS | β | Yes |
| Mounting Pitch | β | 1.0 mm ball pitch |
| PLLs | β | 12 (Stratix III PLL array) |
| Configuration | β | JTAG IEEE Std 1149.1, passive/active serial |