EP3SL70F780C3 vs EP3SL70F780C4L Comparison

Detailed side-by-side comparison of EP3SL70F780C3 by Intel and EP3SL70F780C4L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SL70F780C3 EP3SL70F780C4L
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $780.00 $944.74
Series Stratix III L Stratix III L
Family Stratix III β€”
Logic Elements (LE) 67,500 67,500
Embedded Memory (bits) 2,699,264 β€”
Logic Array Blocks (LABs) 2,700 2,700
User I/O Count 488 β€”
Number of I/O Banks [DATA_NEEDED: number of I/O banks] β€”
Number of Pins / Balls 780 β€”
Package 780-BBGA, FC-FBGA β€”
Mounting Type Surface Mount Surface Mount (BGA)
Process Technology 65 nm 65 nm
Core Voltage (VCCINT) 1.1 V β€”
Maximum Internal Clock Frequency 500 MHz β€”
Operating Temperature Range 0Β°C to 85Β°C (commercial) β€”
Speed Grade C3 C4
Design Software Quartus II (last supported v13.1) Quartus II (Stratix III device support)
RoHS Status [DATA_NEEDED: RoHS status] β€”
Manufacturer β€” Intel (formerly Altera)
Device Type β€” FPGA - Field Programmable Gate Array
Total Memory Bits β€” 2,699,264 bits (~2.7 Mb)
Maximum User I/O β€” 488
Internal Frequency (max) β€” [DATA_NEEDED: internal frequency]
Core Voltage (VCC) β€” 0.9 V
Operating Temperature β€” 0C to 85C (commercial)
Package Type β€” 780-BBGA, FC-FBGA (Flip-Chip)
Lead Free / RoHS β€” Yes (lead-free per BGA package)
Configuration Method β€” JTAG, Passive Serial, FPP, external memory

Datasheets & Resources

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